DE2525166C2 - Kontakt-Sondenvorrichtung - Google Patents

Kontakt-Sondenvorrichtung

Info

Publication number
DE2525166C2
DE2525166C2 DE2525166A DE2525166A DE2525166C2 DE 2525166 C2 DE2525166 C2 DE 2525166C2 DE 2525166 A DE2525166 A DE 2525166A DE 2525166 A DE2525166 A DE 2525166A DE 2525166 C2 DE2525166 C2 DE 2525166C2
Authority
DE
Germany
Prior art keywords
contact
contacts
probe
arrangement
coaxial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2525166A
Other languages
German (de)
English (en)
Other versions
DE2525166A1 (de
Inventor
Ronald Wappingers Falls N.Y. Bove
Alexander Hopewell Junction N.Y. Kostenko jun.
William Hyde Park N.Y. Tkazyik jun.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2525166A1 publication Critical patent/DE2525166A1/de
Application granted granted Critical
Publication of DE2525166C2 publication Critical patent/DE2525166C2/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE2525166A 1974-06-28 1975-06-06 Kontakt-Sondenvorrichtung Expired DE2525166C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US484052A US3911361A (en) 1974-06-28 1974-06-28 Coaxial array space transformer

Publications (2)

Publication Number Publication Date
DE2525166A1 DE2525166A1 (de) 1976-01-15
DE2525166C2 true DE2525166C2 (de) 1985-01-17

Family

ID=23922539

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2525166A Expired DE2525166C2 (de) 1974-06-28 1975-06-06 Kontakt-Sondenvorrichtung

Country Status (5)

Country Link
US (1) US3911361A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5932740B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2525166C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2275781A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1038694B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004023987A1 (de) * 2004-05-14 2005-12-08 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004027886A1 (de) * 2004-05-28 2005-12-22 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295182A (en) * 1976-02-06 1977-08-10 Nippon Telegr & Teleph Corp <Ntt> Measurement for high frequency characteristics of transistor wafer
US4045735A (en) * 1976-02-17 1977-08-30 E-H Research Laboratories, Inc. Apparatus for testing electronic devices having a high density array of pin leads
JPS5729314Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-12-30 1982-06-26
JPS5711414Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1978-11-13 1982-03-05
US4523144A (en) * 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
US4574235A (en) * 1981-06-05 1986-03-04 Micro Component Technology, Inc. Transmission line connector and contact set assembly for test site
US4554506A (en) * 1981-06-30 1985-11-19 International Business Machines Corporation Modular test probe
US4566184A (en) * 1981-08-24 1986-01-28 Rockwell International Corporation Process for making a probe for high speed integrated circuits
JPS58120652U (ja) * 1982-02-08 1983-08-17 日本電子材料株式会社 プロ−ブカ−ド
JPS5911444U (ja) * 1982-07-13 1984-01-24 日本電子材料株式会社 プロ−ブカ−ド
JPS5972148A (ja) * 1982-09-14 1984-04-24 アキユテスト・コ−ポレ−シヨン 電子回路ウエ−ハ−検査装置
US4719417A (en) * 1983-05-03 1988-01-12 Wentworth Laboratories, Inc. Multi-level test probe assembly for IC chips
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
DE3340179C1 (de) * 1983-11-07 1985-05-09 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Anordnung an einem Leiterplattenpruefgeraet zur Anpassung der Abstaende von Kontakten
JPS60116244U (ja) * 1984-01-13 1985-08-06 日本電子材料株式会社 プロ−ブカ−ド
JPS6156981A (ja) * 1984-08-27 1986-03-22 Nec Corp 半導体検査装置
JPS6180067A (ja) * 1984-09-21 1986-04-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・プロ−ブ装置
US4734046A (en) * 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US4757256A (en) * 1985-05-10 1988-07-12 Micro-Probe, Inc. High density probe card
DE3750692D1 (de) * 1986-10-14 1994-12-01 Feinmetall Gmbh Nadelkarte.
US4918383A (en) * 1987-01-20 1990-04-17 Huff Richard E Membrane probe with automatic contact scrub action
US4812745A (en) * 1987-05-29 1989-03-14 Teradyne, Inc. Probe for testing electronic components
JPH0429561Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-08-18 1992-07-17
USH663H (en) 1988-01-13 1989-08-01 High density probe head for chip testing
US5068602A (en) * 1990-09-07 1991-11-26 Tektronix, Inc. DUT board for a semiconductor device tester having a reconfigurable coaxial interconnect grid and method of using same
US5304921A (en) * 1991-08-07 1994-04-19 Hewlett-Packard Company Enhanced grounding system for short-wire lengthed fixture
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5597317A (en) * 1995-08-11 1997-01-28 W. L. Gore & Associates, Inc. Surface mating electrical connector
KR0150334B1 (ko) * 1995-08-17 1998-12-01 남재우 수직형니들을 가지는 프로브카드 및 그 제조방법
US5949244A (en) * 1996-01-03 1999-09-07 Miley; David M. Low tolerance probe card and probe ring systems
US5917330A (en) * 1996-01-17 1999-06-29 Miley; David M. Probe ring having electrical components affixed thereto and related apparatus and processes
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JPH11125646A (ja) * 1997-10-21 1999-05-11 Mitsubishi Electric Corp 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6177805B1 (en) * 1998-11-24 2001-01-23 International Business Machines Corporation High density test connector for disk drives in a high volume manufacturing environment
US6255602B1 (en) 1999-03-15 2001-07-03 Wentworth Laboratories, Inc. Multiple layer electrical interface
US6351133B1 (en) * 1999-03-31 2002-02-26 Adoamtest Corp. Packaging and interconnection of contact structure
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
US6967556B2 (en) * 2003-06-30 2005-11-22 International Business Machines Corporation High power space transformer
US6967557B2 (en) * 2003-08-26 2005-11-22 International Business Machines Corporation Wafer test space transformer
US7252514B2 (en) * 2004-09-02 2007-08-07 International Business Machines Corporation High density space transformer and method of fabricating same
DE102006054735A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings
US7425837B2 (en) * 2006-05-18 2008-09-16 Keithley Instruments, Inc. Spatial transformer for RF and low current interconnect
KR100795909B1 (ko) * 2006-12-12 2008-01-21 삼성전자주식회사 반도체 검사 장치의 프로브 카드
US8970238B2 (en) * 2011-06-17 2015-03-03 Electro Scientific Industries, Inc. Probe module with interleaved serpentine test contacts for electronic device testing
JP6199010B2 (ja) * 2012-05-31 2017-09-20 エス・ブイ・プローブ・プライベート・リミテッドＳｖ Ｐｒｏｂｅ Ｐｔｅ Ｌｔｄ． プローブカード
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493858A (en) * 1966-01-14 1970-02-03 Ibm Inflatable probe apparatus for uniformly contacting and testing microcircuits
US3731191A (en) * 1969-12-22 1973-05-01 Ibm Micro-miniature probe assembly
DE2140060A1 (de) * 1971-08-10 1973-02-22 Bosch Photokino Gmbh Anordnung zur drehzahlregelung eines gleichstrommotors
US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004023987A1 (de) * 2004-05-14 2005-12-08 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004027886A1 (de) * 2004-05-28 2005-12-22 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung

Also Published As

Publication number Publication date
JPS5932740B2 (ja) 1984-08-10
US3911361A (en) 1975-10-07
JPS516678A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-01-20
FR2275781A1 (fr) 1976-01-16
FR2275781B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-04-15
DE2525166A1 (de) 1976-01-15
IT1038694B (it) 1979-11-30

Similar Documents

Publication Publication Date Title
DE2525166C2 (de) Kontakt-Sondenvorrichtung
DE60313862T2 (de) Abgeschirmter kabelanschluss mit auf einer leiterplatte montierten kontaktstiften
EP2434748B1 (de) Bildaufnehmermodul sowie Verfahren zur Herstellung eines Bildaufnehmermoduls
EP0263244B1 (de) Vorrichtung zum elektronischen Prüfen von Leiterplatten mit Kontaktpunkten in extrem feinem Raster (1/20 bis 1/10 Zoll)
DE69800599T2 (de) Gerät zum Unterdrücken von Übersprechen in einem Verbinder
DE69925126T2 (de) Modularer Telekommunikationsverbinder mit Übersprechverringerung
DE3634491C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE2604837A1 (de) Programmierbare schnittstellen- kontakteinrichtung
DE3716240A1 (de) Pruefadapter, insbesondere fuer eine integrierte schaltung
DE10143173A1 (de) Wafersonde
DE4129925C2 (de) Bauelement-Testplatte für eine Halbleiter-Bauelement-Testvorrichtung
DE3536124A1 (de) Kontaktsockel-vorrichtung zum testen von elektronischen bauelementen
DE60124721T2 (de) Federsensoranordnungen
DE112009000415B4 (de) Testsystem mit Hochfrequenzinterposer
DE3017686C2 (de) Elektrische Verbindungsvorrichtung
DE102011001225A1 (de) Anschlussvorrichtung und Anschlussverfahren für hochfrequente Digitalsignale
DE19526961A1 (de) Blindgegenverbinder für eine Testeinrichtung für elektronische Schaltungen
DE69100677T2 (de) Elektrischer Tastkopf mit integraler Zugentlastung und Erdverbindung.
DE69931591T2 (de) Leiterplatte für Modularstecker
EP0582960A1 (de) HF-Koaxial-Steckverbindung
EP0142119A1 (de) Anordnung zur Veränderung der Kontaktabstände eines Kontaktfeldrasters an einem Leiterplattenprüfgerät
DE3535926A1 (de) Mikroschaltungs-taster mit angepasster impedanz
DE10023239A1 (de) Oberflächen-Montage-Vorrichtung für elektrische Verbindungen
DE19945176B4 (de) Anordnung von Federkontakten in einem vorbestimmten Raster
DE3720447A1 (de) Elektrische verbindungen fuer abgeschirmte koaxialleiter

Legal Events

Date Code Title Description
OD Request for examination
8128 New person/name/address of the agent

Representative=s name: NEULAND, J., DIPL.-ING., PAT.-ASS., 7030 BOEBLINGE

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee