DE2445137C3 - Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer Speichermatrix - Google Patents
Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer SpeichermatrixInfo
- Publication number
- DE2445137C3 DE2445137C3 DE2445137A DE2445137A DE2445137C3 DE 2445137 C3 DE2445137 C3 DE 2445137C3 DE 2445137 A DE2445137 A DE 2445137A DE 2445137 A DE2445137 A DE 2445137A DE 2445137 C3 DE2445137 C3 DE 2445137C3
- Authority
- DE
- Germany
- Prior art keywords
- channel
- memory
- gate
- fet
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000015654 memory Effects 0.000 title claims description 128
- 238000000034 method Methods 0.000 title claims description 17
- 239000011159 matrix material Substances 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 230000001133 acceleration Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 description 14
- 239000002800 charge carrier Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008672 reprogramming Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 230000036039 immunity Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/24—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using capacitors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0425—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
- G11C16/16—Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/105—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with vertical doping variation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7885—Hot carrier injection from the channel
Description
Claims (10)
Priority Applications (27)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2445137A DE2445137C3 (de) | 1974-09-20 | 1974-09-20 | Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer Speichermatrix |
DE19752505816 DE2505816C3 (de) | 1974-09-20 | 1975-02-12 | Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer Speichermatrix |
DE2513207A DE2513207C2 (de) | 1974-09-20 | 1975-03-25 | n-Kanal-Speicher-FET |
LU72605A LU72605A1 (de) | 1974-09-20 | 1975-05-28 | |
AT0646575A AT365000B (de) | 1974-09-20 | 1975-08-21 | N-kanal-speicher-fet |
GB3698375A GB1517927A (en) | 1974-09-20 | 1975-09-09 | N-channel field storage transistors |
ZA00755771A ZA755771B (en) | 1974-09-20 | 1975-09-10 | Improvements in or relating to n-channel storage field effect transistors |
CA235,230A CA1070427A (en) | 1974-09-20 | 1975-09-11 | N-channel storage field effect transistors |
AU84797/75A AU498494B2 (en) | 1974-09-20 | 1975-09-12 | N-channel storage fet |
FR7528356A FR2285677A1 (fr) | 1974-09-20 | 1975-09-16 | Transistor a effet de champ de memorisation a canal n |
CH1198075A CH607233A5 (de) | 1974-09-20 | 1975-09-16 | |
IT2734475A IT1042632B (it) | 1974-09-20 | 1975-09-18 | Transtore memorizzatore a effetto di canpo con canale n |
DK419975A DK143923C (da) | 1974-09-20 | 1975-09-18 | Fremgangsmaade til drift af en n-kanal lagerfelteffekttransistor og n-kanal lagerfelteffekttransistor til udnyttelse af fremgangsmaaden |
NL7511017A NL175561C (nl) | 1974-09-20 | 1975-09-18 | Werkwijzen voor het als geheugenelement bedrijven van een veldeffekttranssistor met een n-type inversiekanaal en een door isolerend materiaal omgeven in elektrisch opzicht zwevende geheugenelektrode en met de werkwijzen als geheugenelement te bedrijven veldeffekttransistor. |
SU752174708A SU664586A3 (ru) | 1974-09-20 | 1975-09-19 | Способ управлени -канальным накопительным полевым транзистором |
BE160218A BE833633A (fr) | 1974-09-20 | 1975-09-19 | Transistor a effet de champ de memorisation a canal n |
JP11352275A JPS5157255A (de) | 1974-09-20 | 1975-09-19 | |
DE19762613895 DE2613895A1 (de) | 1974-09-20 | 1976-03-31 | N-kanal-speicher-fet |
DE19762613873 DE2613873A1 (de) | 1974-09-20 | 1976-03-31 | N-kanal-speicher-fet |
DE19762613846 DE2613846A1 (de) | 1974-09-20 | 1976-03-31 | N-kanal-speicher-fet |
DE2638730A DE2638730C2 (de) | 1974-09-20 | 1976-08-27 | n-Kanal-Speicher-FET, Verfahren zum Entladen des Speichergate des n-Kanal-Speicher-FET und Verwendung des n-Kanal-Speicher-FET |
DE2643932A DE2643932C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
DE2643987A DE2643987C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
DE2643947A DE2643947C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
US05/750,860 US4087795A (en) | 1974-09-20 | 1976-12-15 | Memory field effect storage device |
DE19772759039 DE2759039A1 (de) | 1974-09-20 | 1977-12-30 | N-kanal-speicher-fet |
DE2812049A DE2812049C2 (de) | 1974-09-20 | 1978-03-20 | n-Kanal-Speicher-FET |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2445137A DE2445137C3 (de) | 1974-09-20 | 1974-09-20 | Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer Speichermatrix |
DE2638730A DE2638730C2 (de) | 1974-09-20 | 1976-08-27 | n-Kanal-Speicher-FET, Verfahren zum Entladen des Speichergate des n-Kanal-Speicher-FET und Verwendung des n-Kanal-Speicher-FET |
DE2643947A DE2643947C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
DE2643987A DE2643987C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
DE2643932A DE2643932C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
DE19772759039 DE2759039A1 (de) | 1974-09-20 | 1977-12-30 | N-kanal-speicher-fet |
DE2812049A DE2812049C2 (de) | 1974-09-20 | 1978-03-20 | n-Kanal-Speicher-FET |
Publications (3)
Publication Number | Publication Date |
---|---|
DE2445137A1 DE2445137A1 (de) | 1976-09-16 |
DE2445137B2 DE2445137B2 (de) | 1980-06-12 |
DE2445137C3 true DE2445137C3 (de) | 1981-02-26 |
Family
ID=33102626
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2445137A Expired DE2445137C3 (de) | 1974-09-20 | 1974-09-20 | Verfahren zum Betrieb eines n-Kanal-Speicher-FET, n-Kanal-Speicher-FET zur Ausübung des Verfahrens und Anwendung des Verfahrens auf die n-Kanal-Speicher-FETs einer Speichermatrix |
DE2643947A Expired DE2643947C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2643947A Expired DE2643947C2 (de) | 1974-09-20 | 1976-09-29 | n-Kanal-Speicher-FET |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE2445137C3 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2812049C2 (de) * | 1974-09-20 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | n-Kanal-Speicher-FET |
JPS57141969A (en) * | 1981-02-27 | 1982-09-02 | Toshiba Corp | Nonvolatile semiconductor memory |
JPS5864068A (ja) * | 1981-10-14 | 1983-04-16 | Agency Of Ind Science & Technol | 不揮発性半導体メモリの書き込み方法 |
JP2013041891A (ja) * | 2011-08-11 | 2013-02-28 | Toshiba Corp | 半導体装置 |
FR2984600A1 (fr) * | 2011-12-20 | 2013-06-21 | St Microelectronics Rousset | Transistor à grille flottante ayant un rendement d'injection des électrons chauds amélioré. |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3797000A (en) * | 1972-12-29 | 1974-03-12 | Ibm | Non-volatile semiconductor storage device utilizing avalanche injection and extraction of stored information |
US3919711A (en) * | 1973-02-26 | 1975-11-11 | Intel Corp | Erasable floating gate device |
-
1974
- 1974-09-20 DE DE2445137A patent/DE2445137C3/de not_active Expired
-
1976
- 1976-09-29 DE DE2643947A patent/DE2643947C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2445137B2 (de) | 1980-06-12 |
DE2445137A1 (de) | 1976-09-16 |
DE2643947A1 (de) | 1978-03-30 |
DE2643947C2 (de) | 1984-02-16 |
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