DE2423999C3 - Einrichtung zum Ausrichten eines scheibenförmigen Werkstückes in eine vorgegebene Winkellage - Google Patents

Einrichtung zum Ausrichten eines scheibenförmigen Werkstückes in eine vorgegebene Winkellage

Info

Publication number
DE2423999C3
DE2423999C3 DE2423999A DE2423999A DE2423999C3 DE 2423999 C3 DE2423999 C3 DE 2423999C3 DE 2423999 A DE2423999 A DE 2423999A DE 2423999 A DE2423999 A DE 2423999A DE 2423999 C3 DE2423999 C3 DE 2423999C3
Authority
DE
Germany
Prior art keywords
workpiece
presetting table
presetting
semiconductor wafer
angular position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2423999A
Other languages
German (de)
English (en)
Other versions
DE2423999B2 (de
DE2423999A1 (de
Inventor
Karl-Heinz Los Altos Calif. Johannsmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kasper Instruments Inc
Original Assignee
Kasper Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kasper Instruments Inc filed Critical Kasper Instruments Inc
Publication of DE2423999A1 publication Critical patent/DE2423999A1/de
Publication of DE2423999B2 publication Critical patent/DE2423999B2/de
Application granted granted Critical
Publication of DE2423999C3 publication Critical patent/DE2423999C3/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE2423999A 1973-05-21 1974-05-17 Einrichtung zum Ausrichten eines scheibenförmigen Werkstückes in eine vorgegebene Winkellage Expired DE2423999C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US362447A US3865254A (en) 1973-05-21 1973-05-21 Prealignment system for an optical alignment and exposure instrument

Publications (3)

Publication Number Publication Date
DE2423999A1 DE2423999A1 (de) 1974-12-05
DE2423999B2 DE2423999B2 (de) 1981-01-15
DE2423999C3 true DE2423999C3 (de) 1981-11-26

Family

ID=23426159

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2423999A Expired DE2423999C3 (de) 1973-05-21 1974-05-17 Einrichtung zum Ausrichten eines scheibenförmigen Werkstückes in eine vorgegebene Winkellage

Country Status (5)

Country Link
US (1) US3865254A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5753663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2423999C3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2230964B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1452704A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4187052A (en) * 1974-08-17 1980-02-05 Hergeth KG. Maschinenfabrik und Apparatebau Method of opening bales
US3960277A (en) * 1974-09-30 1976-06-01 Flint Alan G Mask plate handling apparatus
US4047627A (en) * 1974-09-30 1977-09-13 Gca Corporation Mask plate handling method
JPS52175A (en) * 1975-06-23 1977-01-05 Hitachi Ltd Loader/unloader
US4024944A (en) * 1975-12-24 1977-05-24 Texas Instruments Incorporated Semiconductor slice prealignment system
CA1097770A (en) * 1977-02-28 1981-03-17 Robert L. Judge Controls for semiconductor wafer orientor
JPS5485679A (en) * 1977-12-20 1979-07-07 Canon Inc Wafer aligning unit
FR2416087A1 (fr) * 1978-02-01 1979-08-31 Seita Dispositif automatique de prelevement d'elements formes sur des pieces, en particulier sur des feuilles de tabac
JPS54157478A (en) * 1978-06-01 1979-12-12 Canon Inc Alignment method
JPS5599738A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Automatic conveying equipment for wafer
US4345836A (en) * 1979-10-22 1982-08-24 Optimetrix Corporation Two-stage wafer prealignment system for an optical alignment and exposure machine
JPS5666036A (en) * 1979-11-05 1981-06-04 Canon Inc Wafer positioner
DD151387A1 (de) 1980-06-02 1981-10-14 Erich Adler Verfahren und vorrichtung zum automatischen transport und zur lageorientierung scheibenfoermiger objekte
US4465416A (en) * 1982-05-17 1984-08-14 The Perkin-Elmer Corporation Wafer handling mechanism
GB2121333B (en) * 1982-06-05 1986-01-22 Service Eng Ltd Trimming ceramic flatware
NL8300220A (nl) * 1983-01-21 1984-08-16 Philips Nv Inrichting voor het stralingslithografisch behandelen van een dun substraat.
EP0129731A1 (en) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Wafer handling system
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
US4570058A (en) * 1983-10-03 1986-02-11 At&T Technologies, Inc. Method and apparatus for automatically handling and identifying semiconductor wafers
JPS60155358A (ja) * 1984-01-23 1985-08-15 Disco Abrasive Sys Ltd 半導体ウエ−ハの表面を研削する方法及び装置
JPS60158626A (ja) * 1984-01-30 1985-08-20 Canon Inc 半導体露光装置
JPS60214912A (ja) * 1985-03-11 1985-10-28 株式会社日立製作所 ダイシング装置
JPS60214911A (ja) * 1985-03-11 1985-10-28 株式会社日立製作所 ダイシング装置
JPS61208841A (ja) * 1985-03-14 1986-09-17 Sony Corp 半導体ウエハの位置合せ装置
US4698284A (en) * 1985-10-25 1987-10-06 M&T Chemicals Inc. Device for aligning a photomask onto a printed wiring board
US4794061A (en) * 1985-10-25 1988-12-27 M&T Chemicals Inc. Device for aligning a photomask onto a printed wiring board
US4765793A (en) * 1986-02-03 1988-08-23 Proconics International, Inc. Apparatus for aligning circular objects
DE3783440T2 (de) * 1986-04-28 1993-08-12 Varian Associates Modulare foerder- und beabeitungsanlage fuer halbleiterwafer.
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPH06101513B2 (ja) * 1987-11-16 1994-12-12 日本電気株式会社 半導体基板処理装置
JPH0727956B2 (ja) * 1989-05-08 1995-03-29 株式会社東芝 基板部材処理装置
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
US6188467B1 (en) * 1997-06-13 2001-02-13 Canon Kabushiki Kaisha Method and apparatus for fabricating semiconductor devices
EP1135795B1 (en) * 1998-12-02 2008-03-12 Newport Corporation Specimen holding robotic arm end effector
EP1052548B1 (en) * 1999-04-21 2005-06-08 ASML Netherlands B.V. Lithographic projection apparatus
TW513617B (en) 1999-04-21 2002-12-11 Asml Corp Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus
EP1052546B1 (en) * 1999-04-21 2004-09-15 ASML Netherlands B.V. Substrate handler for use in lithographic projection apparatus
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
US6676365B2 (en) * 2001-03-16 2004-01-13 Toda Kogyo Corporation Air track conveyor system for disk production
US6612418B2 (en) * 2002-01-14 2003-09-02 General Mills, Inc. System for use in an assembly line
US7037063B2 (en) * 2002-04-18 2006-05-02 Display Manufacturing Services Co., Ltd. Substrate floating apparatus and method of manufacturing liquid crystal display apparatus using the same
US7389622B2 (en) * 2003-01-13 2008-06-24 General Mills, Inc. System for use in an assembly line
KR100956348B1 (ko) * 2003-09-05 2010-05-06 삼성전자주식회사 인라인 반송 시스템
US8834073B2 (en) * 2010-10-29 2014-09-16 Corning Incorporated Transport apparatus having a measuring system and methods therefor
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3109530A (en) * 1960-11-02 1963-11-05 Ass Elect Ind Means for orienting valve bases and similar components
US3198311A (en) * 1962-09-24 1965-08-03 Western Electric Co Apparatus for transferring and orienting articles
US3220331A (en) * 1965-01-27 1965-11-30 Kulicke And Soffa Mfg Company Contact printing mask alignment apparatus for semiconductor wafer geometry
US3490846A (en) * 1967-06-01 1970-01-20 Kasper Instruments Optical alignment and exposure apparatus
US3552584A (en) * 1968-01-03 1971-01-05 Hamco Machine And Electronics Work handling device
US3521953A (en) * 1968-03-13 1970-07-28 Kulicke & Soffa Ind Inc Adjustable separation wafer clamp

Also Published As

Publication number Publication date
US3865254A (en) 1975-02-11
JPS5753663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-11-13
DE2423999B2 (de) 1981-01-15
JPS5021682A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-03-07
FR2230964A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-12-20
GB1452704A (en) 1976-10-13
FR2230964B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-06-25
DE2423999A1 (de) 1974-12-05

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8328 Change in the person/name/address of the agent

Free format text: LIESEGANG, R., DIPL.-ING. DR.-ING., PAT.-ANW., 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee