JPS5021682A - - Google Patents
Info
- Publication number
- JPS5021682A JPS5021682A JP49057239A JP5723974A JPS5021682A JP S5021682 A JPS5021682 A JP S5021682A JP 49057239 A JP49057239 A JP 49057239A JP 5723974 A JP5723974 A JP 5723974A JP S5021682 A JPS5021682 A JP S5021682A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US362447A US3865254A (en) | 1973-05-21 | 1973-05-21 | Prealignment system for an optical alignment and exposure instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5021682A true JPS5021682A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-03-07 |
| JPS5753663B2 JPS5753663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-11-13 |
Family
ID=23426159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49057239A Expired JPS5753663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-05-21 | 1974-05-21 |
Country Status (5)
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52175A (en) * | 1975-06-23 | 1977-01-05 | Hitachi Ltd | Loader/unloader |
| JPS5485679A (en) * | 1977-12-20 | 1979-07-07 | Canon Inc | Wafer aligning unit |
| JPS5599738A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Automatic conveying equipment for wafer |
| JPS6014449A (ja) * | 1983-06-15 | 1985-01-25 | エスヴィージー・リトグラフィー・システムズ・インコーポレイテッド | ウエハ処理機構 |
| JPS60214912A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
| JPS60214911A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
| JPH01129436A (ja) * | 1987-11-16 | 1989-05-22 | Nec Corp | 半導体基板処理装置 |
| JPH02292842A (ja) * | 1989-05-08 | 1990-12-04 | Toshiba Corp | 基板部材処理装置 |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4187052A (en) * | 1974-08-17 | 1980-02-05 | Hergeth KG. Maschinenfabrik und Apparatebau | Method of opening bales |
| US4047627A (en) * | 1974-09-30 | 1977-09-13 | Gca Corporation | Mask plate handling method |
| US3960277A (en) * | 1974-09-30 | 1976-06-01 | Flint Alan G | Mask plate handling apparatus |
| US4024944A (en) * | 1975-12-24 | 1977-05-24 | Texas Instruments Incorporated | Semiconductor slice prealignment system |
| CA1097770A (en) * | 1977-02-28 | 1981-03-17 | Robert L. Judge | Controls for semiconductor wafer orientor |
| FR2416087A1 (fr) * | 1978-02-01 | 1979-08-31 | Seita | Dispositif automatique de prelevement d'elements formes sur des pieces, en particulier sur des feuilles de tabac |
| JPS54157478A (en) * | 1978-06-01 | 1979-12-12 | Canon Inc | Alignment method |
| US4345836A (en) * | 1979-10-22 | 1982-08-24 | Optimetrix Corporation | Two-stage wafer prealignment system for an optical alignment and exposure machine |
| JPS5666036A (en) * | 1979-11-05 | 1981-06-04 | Canon Inc | Wafer positioner |
| DD151387A1 (de) | 1980-06-02 | 1981-10-14 | Erich Adler | Verfahren und vorrichtung zum automatischen transport und zur lageorientierung scheibenfoermiger objekte |
| US4465416A (en) * | 1982-05-17 | 1984-08-14 | The Perkin-Elmer Corporation | Wafer handling mechanism |
| GB2121333B (en) * | 1982-06-05 | 1986-01-22 | Service Eng Ltd | Trimming ceramic flatware |
| NL8300220A (nl) * | 1983-01-21 | 1984-08-16 | Philips Nv | Inrichting voor het stralingslithografisch behandelen van een dun substraat. |
| US4662811A (en) * | 1983-07-25 | 1987-05-05 | Hayden Thomas J | Method and apparatus for orienting semiconductor wafers |
| US4570058A (en) * | 1983-10-03 | 1986-02-11 | At&T Technologies, Inc. | Method and apparatus for automatically handling and identifying semiconductor wafers |
| JPS60155358A (ja) * | 1984-01-23 | 1985-08-15 | Disco Abrasive Sys Ltd | 半導体ウエ−ハの表面を研削する方法及び装置 |
| JPS60158626A (ja) * | 1984-01-30 | 1985-08-20 | Canon Inc | 半導体露光装置 |
| JPS61208841A (ja) * | 1985-03-14 | 1986-09-17 | Sony Corp | 半導体ウエハの位置合せ装置 |
| US4794061A (en) * | 1985-10-25 | 1988-12-27 | M&T Chemicals Inc. | Device for aligning a photomask onto a printed wiring board |
| US4698284A (en) * | 1985-10-25 | 1987-10-06 | M&T Chemicals Inc. | Device for aligning a photomask onto a printed wiring board |
| US4765793A (en) * | 1986-02-03 | 1988-08-23 | Proconics International, Inc. | Apparatus for aligning circular objects |
| JP2639459B2 (ja) * | 1986-04-28 | 1997-08-13 | バリアン・アソシエイツ・インコーポレイテッド | モジューラ半導体ウェーハ移送及び処理装置 |
| US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
| US5217550A (en) * | 1990-09-28 | 1993-06-08 | Dai Nippon Printing Co., Ltd | Alignment transfer method |
| US6188467B1 (en) * | 1997-06-13 | 2001-02-13 | Canon Kabushiki Kaisha | Method and apparatus for fabricating semiconductor devices |
| CN1238882C (zh) * | 1998-12-02 | 2006-01-25 | 纽波特公司 | 试片夹持机械手末端执行器 |
| EP1052548B1 (en) * | 1999-04-21 | 2005-06-08 | ASML Netherlands B.V. | Lithographic projection apparatus |
| TW513617B (en) | 1999-04-21 | 2002-12-11 | Asml Corp | Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus |
| EP1052546B1 (en) * | 1999-04-21 | 2004-09-15 | ASML Netherlands B.V. | Substrate handler for use in lithographic projection apparatus |
| US6357996B2 (en) * | 1999-05-14 | 2002-03-19 | Newport Corporation | Edge gripping specimen prealigner |
| US6676365B2 (en) * | 2001-03-16 | 2004-01-13 | Toda Kogyo Corporation | Air track conveyor system for disk production |
| US6612418B2 (en) * | 2002-01-14 | 2003-09-02 | General Mills, Inc. | System for use in an assembly line |
| US7037063B2 (en) * | 2002-04-18 | 2006-05-02 | Display Manufacturing Services Co., Ltd. | Substrate floating apparatus and method of manufacturing liquid crystal display apparatus using the same |
| US7389622B2 (en) * | 2003-01-13 | 2008-06-24 | General Mills, Inc. | System for use in an assembly line |
| KR100956348B1 (ko) * | 2003-09-05 | 2010-05-06 | 삼성전자주식회사 | 인라인 반송 시스템 |
| US8834073B2 (en) * | 2010-10-29 | 2014-09-16 | Corning Incorporated | Transport apparatus having a measuring system and methods therefor |
| US9889995B1 (en) * | 2017-03-15 | 2018-02-13 | Core Flow Ltd. | Noncontact support platform with blockage detection |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3109530A (en) * | 1960-11-02 | 1963-11-05 | Ass Elect Ind | Means for orienting valve bases and similar components |
| US3198311A (en) * | 1962-09-24 | 1965-08-03 | Western Electric Co | Apparatus for transferring and orienting articles |
| US3220331A (en) * | 1965-01-27 | 1965-11-30 | Kulicke And Soffa Mfg Company | Contact printing mask alignment apparatus for semiconductor wafer geometry |
| US3490846A (en) * | 1967-06-01 | 1970-01-20 | Kasper Instruments | Optical alignment and exposure apparatus |
| US3552584A (en) * | 1968-01-03 | 1971-01-05 | Hamco Machine And Electronics | Work handling device |
| US3521953A (en) * | 1968-03-13 | 1970-07-28 | Kulicke & Soffa Ind Inc | Adjustable separation wafer clamp |
-
1973
- 1973-05-21 US US362447A patent/US3865254A/en not_active Expired - Lifetime
-
1974
- 1974-05-16 GB GB2181574A patent/GB1452704A/en not_active Expired
- 1974-05-17 DE DE2423999A patent/DE2423999C3/de not_active Expired
- 1974-05-20 FR FR7417432A patent/FR2230964B1/fr not_active Expired
- 1974-05-21 JP JP49057239A patent/JPS5753663B2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52175A (en) * | 1975-06-23 | 1977-01-05 | Hitachi Ltd | Loader/unloader |
| JPS5485679A (en) * | 1977-12-20 | 1979-07-07 | Canon Inc | Wafer aligning unit |
| JPS5599738A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Automatic conveying equipment for wafer |
| JPS6014449A (ja) * | 1983-06-15 | 1985-01-25 | エスヴィージー・リトグラフィー・システムズ・インコーポレイテッド | ウエハ処理機構 |
| JPS60214912A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
| JPS60214911A (ja) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
| JPH01129436A (ja) * | 1987-11-16 | 1989-05-22 | Nec Corp | 半導体基板処理装置 |
| JPH02292842A (ja) * | 1989-05-08 | 1990-12-04 | Toshiba Corp | 基板部材処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2423999B2 (de) | 1981-01-15 |
| FR2230964B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-06-25 |
| DE2423999A1 (de) | 1974-12-05 |
| US3865254A (en) | 1975-02-11 |
| DE2423999C3 (de) | 1981-11-26 |
| FR2230964A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-12-20 |
| JPS5753663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-11-13 |
| GB1452704A (en) | 1976-10-13 |