DE2420859B2 - Verfahren zur Aufbringung von Überzügen - Google Patents

Verfahren zur Aufbringung von Überzügen

Info

Publication number
DE2420859B2
DE2420859B2 DE2420859A DE2420859A DE2420859B2 DE 2420859 B2 DE2420859 B2 DE 2420859B2 DE 2420859 A DE2420859 A DE 2420859A DE 2420859 A DE2420859 A DE 2420859A DE 2420859 B2 DE2420859 B2 DE 2420859B2
Authority
DE
Germany
Prior art keywords
coating
masking
substrate
heating element
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2420859A
Other languages
German (de)
English (en)
Other versions
DE2420859A1 (de
Inventor
Peter Hans Grosse Pointe Farms Mich. Hofer (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of DE2420859A1 publication Critical patent/DE2420859A1/de
Publication of DE2420859B2 publication Critical patent/DE2420859B2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE2420859A 1973-05-01 1974-04-30 Verfahren zur Aufbringung von Überzügen Granted DE2420859B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/356,214 US3936531A (en) 1973-05-01 1973-05-01 Masking process with thermal destruction of edges of mask

Publications (2)

Publication Number Publication Date
DE2420859A1 DE2420859A1 (de) 1974-11-21
DE2420859B2 true DE2420859B2 (de) 1975-11-06

Family

ID=23400599

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2420859A Granted DE2420859B2 (de) 1973-05-01 1974-04-30 Verfahren zur Aufbringung von Überzügen

Country Status (5)

Country Link
US (1) US3936531A (enExample)
JP (1) JPS5015061A (enExample)
CA (1) CA1026171A (enExample)
DE (1) DE2420859B2 (enExample)
FR (1) FR2227962B3 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352138A1 (de) * 1973-10-17 1975-04-30 Siemens Ag Verfahren zum herstellen einer halbleiteranordnung
CA1115334A (en) * 1978-06-22 1981-12-29 Eastman Kodak Company Electrographic element provided with electrical connection means
JPH0682926B2 (ja) * 1988-04-22 1994-10-19 日本電気株式会社 多層配線基板の製造方法
WO1990002546A1 (en) * 1988-09-09 1990-03-22 The Ronald T. Dodge Company Pharmaceuticals microencapsulated by vapor deposited polymers and method
US20020066523A1 (en) * 2000-12-05 2002-06-06 Sundstrom Lance L. Attaching devices using polymers
RU2218365C2 (ru) * 2001-07-27 2003-12-10 Федеральное государственное унитарное предприятие "Научно-исследовательский физико-химический институт им. Л.Я.Карпова" Пористая пленка из полипараксилилена и его замещенных, способ ее получения и полупроводниковый прибор с её использованием
JP5231909B2 (ja) * 2008-09-17 2013-07-10 独立行政法人科学技術振興機構 任意の分布形状と分布密度を有する分子または粒子の集団を同時に多種大量生成する方法とその方法に使用するマスク材

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3301707A (en) * 1962-12-27 1967-01-31 Union Carbide Corp Thin film resistors and methods of making thereof
US3379803A (en) * 1964-05-04 1968-04-23 Union Carbide Corp Coating method and apparatus for deposition of polymer-forming vapor under vacuum
US3342754A (en) * 1966-02-18 1967-09-19 Union Carbide Corp Para-xylylene polymers
US3472795A (en) * 1967-03-10 1969-10-14 Union Carbide Corp Polymerization process

Also Published As

Publication number Publication date
DE2420859A1 (de) 1974-11-21
US3936531A (en) 1976-02-03
FR2227962B3 (enExample) 1977-03-04
FR2227962A1 (enExample) 1974-11-29
JPS5015061A (enExample) 1975-02-17
CA1026171A (en) 1978-02-14

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)