DE2352025A1 - Vakuumdichte metall-keramik-loetverbindung - Google Patents
Vakuumdichte metall-keramik-loetverbindungInfo
- Publication number
- DE2352025A1 DE2352025A1 DE19732352025 DE2352025A DE2352025A1 DE 2352025 A1 DE2352025 A1 DE 2352025A1 DE 19732352025 DE19732352025 DE 19732352025 DE 2352025 A DE2352025 A DE 2352025A DE 2352025 A1 DE2352025 A1 DE 2352025A1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- ceramic
- powder
- opening
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- ZMXPKUWNBXIACW-UHFFFAOYSA-N [Fe].[Co].[Mo] Chemical compound [Fe].[Co].[Mo] ZMXPKUWNBXIACW-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/32—Seals for leading-in conductors
- H01J5/34—Seals for leading-in conductors for an individual conductor
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- C—CHEMISTRY; METALLURGY
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10S228/00—Metal fusion bonding
- Y10S228/903—Metal to nonmetal
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
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- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
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- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CH1404373A CH563320A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-10-01 | 1973-10-01 |
Publications (1)
Publication Number | Publication Date |
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DE2352025A1 true DE2352025A1 (de) | 1975-04-24 |
Family
ID=4397461
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19732352025 Pending DE2352025A1 (de) | 1973-10-01 | 1973-10-17 | Vakuumdichte metall-keramik-loetverbindung |
DE7337346U Expired DE7337346U (de) | 1973-10-01 | 1973-10-17 | Vakuumdichtes metall-keramik-bauteil |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE7337346U Expired DE7337346U (de) | 1973-10-01 | 1973-10-17 | Vakuumdichtes metall-keramik-bauteil |
Country Status (9)
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
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US4352714A (en) * | 1980-09-29 | 1982-10-05 | Union Carbide Corporation | Method for making a metal-to-ceramic insulator seal for electrochemical cells |
JPS62217536A (ja) * | 1986-03-19 | 1987-09-25 | Hitachi Ltd | マグネトロン陰極構体 |
US5173354A (en) * | 1990-12-13 | 1992-12-22 | Cornell Research Foundation, Inc. | Non-beading, thin-film, metal-coated ceramic substrate |
US5308925A (en) * | 1992-06-26 | 1994-05-03 | Emerson Electric Co. | Conductive pin assembly for a machine housing |
US5794838A (en) * | 1995-07-14 | 1998-08-18 | Ngk Insulators, Ltd. | Ceramics joined body and method of joining ceramics |
US6111198A (en) * | 1998-06-15 | 2000-08-29 | Olin Aegis | Duplex feedthrough and method therefor |
JP3792440B2 (ja) * | 1999-06-25 | 2006-07-05 | 日本碍子株式会社 | 異種部材の接合方法、および同接合方法により接合された複合部材 |
US6844502B2 (en) * | 2002-05-16 | 2005-01-18 | Emerson Electric Co. | Hermetically sealed current conducting terminal assembly |
US20070251938A1 (en) * | 2006-04-26 | 2007-11-01 | Watlow Electric Manufacturing Company | Ceramic heater and method of securing a thermocouple thereto |
DE102011009862B4 (de) | 2011-01-31 | 2012-11-08 | Heraeus Precious Metals Gmbh & Co. Kg | Cermethaltige Durchführung mit Halteelement für eine medizinisch implantierbare Vorrichtung |
DE102011009865B4 (de) | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Kopfteil für eine medizinisch implantierbare Vorrichtung |
DE102011009856B8 (de) | 2011-01-31 | 2012-12-27 | W.C. Heraeus Gmbh | Elektrische Durchführung und Verfahren zur Herstellung einer cermethaltigen Durchführung für eine medizinisch implantierbare Vorrichtung |
DE102011009867B4 (de) | 2011-01-31 | 2013-09-05 | Heraeus Precious Metals Gmbh & Co. Kg | Keramikdurchführung für eine medizinisch implantierbare Vorrichtung |
DE102011009857B8 (de) | 2011-01-31 | 2013-01-17 | Heraeus Precious Metals Gmbh & Co. Kg | Elektrische Durchführung mit cermethaltigem Verbindungselement für eine aktive, implantierbare, medizinische Vorrichtung |
DE102011009858B8 (de) | 2011-01-31 | 2013-11-07 | Heraeus Precious Metals Gmbh & Co. Kg | Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht |
DE102011009855B8 (de) | 2011-01-31 | 2013-01-03 | Heraeus Precious Metals Gmbh & Co. Kg | Keramikdurchführung mit induktivem Filter |
DE102011009859B4 (de) | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Keramikdurchführung mit Filter |
DE102011009861B4 (de) | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Verfahren zur Herstellung einer cermethaltigen Durchführung |
DE102011009860B4 (de) * | 2011-01-31 | 2013-03-07 | Heraeus Precious Metals Gmbh & Co. Kg | Implantierbare Vorrichtung mit integrierter Keramikdurchführung |
EP2574807B1 (de) * | 2011-09-30 | 2014-11-12 | Maxon Motor AG | Verbindung zwischen einer Welle und einem Nabenbauteil sowie Verfahren zum Herstellen der Verbindung |
DE102011119125B4 (de) | 2011-11-23 | 2014-01-23 | Heraeus Precious Metals Gmbh & Co. Kg | Kontaktierungsanordnung mit Durchführung und Filterstruktur |
US9478959B2 (en) | 2013-03-14 | 2016-10-25 | Heraeus Deutschland GmbH & Co. KG | Laser welding a feedthrough |
US9431801B2 (en) | 2013-05-24 | 2016-08-30 | Heraeus Deutschland GmbH & Co. KG | Method of coupling a feedthrough assembly for an implantable medical device |
US9403023B2 (en) | 2013-08-07 | 2016-08-02 | Heraeus Deutschland GmbH & Co. KG | Method of forming feedthrough with integrated brazeless ferrule |
US9610452B2 (en) | 2013-12-12 | 2017-04-04 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing by sintering |
US9504841B2 (en) | 2013-12-12 | 2016-11-29 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing with ultrasonic welding |
US9610451B2 (en) | 2013-12-12 | 2017-04-04 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing using a gold alloy |
DE102014208729A1 (de) * | 2014-05-09 | 2015-11-12 | Incoatec Gmbh | Zweiteilige Hochspannungs-Vakuumdurchführung für eine Elektronenröhre |
EP4230258B1 (en) | 2020-02-21 | 2025-06-04 | Heraeus Medical Components, LLC | Ferrule with strain relief spacer for implantable medical device |
EP4226968B1 (en) | 2020-02-21 | 2025-04-30 | Heraeus Medical Components, LLC | Ferrule for non-planar medical device housing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2163407A (en) * | 1936-10-10 | 1939-06-20 | Gen Electric | Ceramic-to-metal seal |
US2163410A (en) * | 1937-02-12 | 1939-06-20 | Gen Electric | Ceramic-to-metal seal |
US2917140A (en) * | 1955-11-02 | 1959-12-15 | Herbert A Omley | Metal-to-ceramic seal |
US3137545A (en) * | 1962-03-22 | 1964-06-16 | Gen Electric | Alloy for bonding metals to ceramics |
US3340025A (en) * | 1964-05-04 | 1967-09-05 | Philips Corp | Refractory metal-to-ceramic seal |
US3324543A (en) * | 1965-03-26 | 1967-06-13 | Charles I Mcvey | Pressure bonded ceramic-to-metal gradient seals |
US3418423A (en) * | 1966-12-23 | 1968-12-24 | Philips Corp | Fluorine-resistant electrical terminal |
US3666429A (en) * | 1969-09-29 | 1972-05-30 | Xerox Corp | Metallized and brazed ceramics |
US3700420A (en) * | 1971-04-01 | 1972-10-24 | Gen Electric | Ceramic-to-metal seal |
-
1973
- 1973-10-01 CH CH1404373A patent/CH563320A5/xx not_active IP Right Cessation
- 1973-10-17 DE DE19732352025 patent/DE2352025A1/de active Pending
- 1973-10-17 DE DE7337346U patent/DE7337346U/de not_active Expired
-
1974
- 1974-08-14 AT AT666874A patent/ATA666874A/de not_active Application Discontinuation
- 1974-09-27 IT IT27801/74A patent/IT1022387B/it active
- 1974-09-27 NL NL7412852A patent/NL7412852A/xx not_active Application Discontinuation
- 1974-09-27 GB GB4208174A patent/GB1477521A/en not_active Expired
- 1974-09-27 FR FR7432602A patent/FR2245580A1/fr not_active Withdrawn
- 1974-10-01 JP JP49113240A patent/JPS5062215A/ja active Pending
- 1974-10-01 US US05/511,057 patent/US3979187A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2245580A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-04-25 |
US3979187A (en) | 1976-09-07 |
JPS5062215A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-05-28 |
ATA666874A (de) | 1979-09-15 |
GB1477521A (en) | 1977-06-22 |
IT1022387B (it) | 1978-03-20 |
CH563320A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-06-30 |
NL7412852A (nl) | 1975-04-03 |
DE7337346U (de) | 1976-02-12 |
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