DE102011009858B8 - Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht - Google Patents

Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht Download PDF

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Publication number
DE102011009858B8
DE102011009858B8 DE201110009858 DE102011009858A DE102011009858B8 DE 102011009858 B8 DE102011009858 B8 DE 102011009858B8 DE 201110009858 DE201110009858 DE 201110009858 DE 102011009858 A DE102011009858 A DE 102011009858A DE 102011009858 B8 DE102011009858 B8 DE 102011009858B8
Authority
DE
Germany
Prior art keywords
cermet
bonding layer
implantable device
medically implantable
containing bushing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE201110009858
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English (en)
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DE102011009858A1 (de
DE102011009858B4 (de
Inventor
Goran Pavlovic
Jeremy Glynn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Deutschland GmbH and Co KG
Original Assignee
Heraeus Precious Metals GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Precious Metals GmbH and Co KG filed Critical Heraeus Precious Metals GmbH and Co KG
Priority to DE201110009858 priority Critical patent/DE102011009858B8/de
Priority to US13/361,362 priority patent/US20120193125A1/en
Priority to CN201210021556.XA priority patent/CN102614588B/zh
Publication of DE102011009858A1 publication Critical patent/DE102011009858A1/de
Application granted granted Critical
Publication of DE102011009858B4 publication Critical patent/DE102011009858B4/de
Publication of DE102011009858B8 publication Critical patent/DE102011009858B8/de
Priority to US14/593,637 priority patent/US9504840B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49227—Insulator making
DE201110009858 2011-01-31 2011-01-31 Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht Active DE102011009858B8 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE201110009858 DE102011009858B8 (de) 2011-01-31 2011-01-31 Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht
US13/361,362 US20120193125A1 (en) 2011-01-31 2012-01-30 Cermet-containing bushing for an implantable medical device having a connecting layer
CN201210021556.XA CN102614588B (zh) 2011-01-31 2012-01-31 用于可植入医疗设备的具有连接层的含有金属陶瓷的套管
US14/593,637 US9504840B2 (en) 2011-01-31 2015-01-09 Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201110009858 DE102011009858B8 (de) 2011-01-31 2011-01-31 Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht

Publications (3)

Publication Number Publication Date
DE102011009858A1 DE102011009858A1 (de) 2012-08-02
DE102011009858B4 DE102011009858B4 (de) 2013-09-05
DE102011009858B8 true DE102011009858B8 (de) 2013-11-07

Family

ID=46511364

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201110009858 Active DE102011009858B8 (de) 2011-01-31 2011-01-31 Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht

Country Status (3)

Country Link
US (2) US20120193125A1 (de)
CN (1) CN102614588B (de)
DE (1) DE102011009858B8 (de)

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DE102011009857B8 (de) 2011-01-31 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Elektrische Durchführung mit cermethaltigem Verbindungselement für eine aktive, implantierbare, medizinische Vorrichtung
DE102011009856B8 (de) 2011-01-31 2012-12-27 W.C. Heraeus Gmbh Elektrische Durchführung und Verfahren zur Herstellung einer cermethaltigen Durchführung für eine medizinisch implantierbare Vorrichtung
DE102011009862B4 (de) 2011-01-31 2012-11-08 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung mit Halteelement für eine medizinisch implantierbare Vorrichtung
DE102011009867B4 (de) 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung für eine medizinisch implantierbare Vorrichtung
DE102011009860B4 (de) 2011-01-31 2013-03-07 Heraeus Precious Metals Gmbh & Co. Kg Implantierbare Vorrichtung mit integrierter Keramikdurchführung
DE102011009865B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Kopfteil für eine medizinisch implantierbare Vorrichtung
DE102011009859B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit Filter
DE102011009861B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Verfahren zur Herstellung einer cermethaltigen Durchführung
DE102011009855B8 (de) 2011-01-31 2013-01-03 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit induktivem Filter
DE102011009858B8 (de) 2011-01-31 2013-11-07 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht
DE102011119125B4 (de) 2011-11-23 2014-01-23 Heraeus Precious Metals Gmbh & Co. Kg Kontaktierungsanordnung mit Durchführung und Filterstruktur
US9478959B2 (en) 2013-03-14 2016-10-25 Heraeus Deutschland GmbH & Co. KG Laser welding a feedthrough
US9431801B2 (en) 2013-05-24 2016-08-30 Heraeus Deutschland GmbH & Co. KG Method of coupling a feedthrough assembly for an implantable medical device
US9403023B2 (en) 2013-08-07 2016-08-02 Heraeus Deutschland GmbH & Co. KG Method of forming feedthrough with integrated brazeless ferrule
US9610452B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing by sintering
US9610451B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing using a gold alloy
US9504841B2 (en) 2013-12-12 2016-11-29 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
EP3228354B1 (de) * 2016-04-07 2020-08-05 Heraeus Deutschland GmbH & Co. KG Verfahren zur direkten verbindung eines drahtes mit einer durchführung umfassend einen cermet-leiter und eine zugehörige durchführung
US11173235B2 (en) 2016-07-15 2021-11-16 Cook Regentec Llc Nitrite eluting devices and methods of use thereof
EP3284514B1 (de) 2016-08-17 2019-03-27 Heraeus Deutschland GmbH & Co. KG Elektrische durchführung, insbesondere cermetdurchführung, mit einstückigem durchführungselement aus mehreren bereichen, insbesondere zum verbesserten kontaktieren der durchführung
EP3284512B1 (de) * 2016-08-17 2019-11-13 Heraeus Deutschland GmbH & Co. KG Elektrische durchführung mit einer gesinterten elektrischen verbindung, insbesondere für medizinische implantate
EP3351290B1 (de) * 2017-01-23 2019-06-26 Heraeus Deutschland GmbH & Co. KG Elektrische durchführung mit kontaktelement und verfahren zur herstellung
EP3505216B1 (de) 2018-01-02 2020-07-22 Heraeus Deutschland GmbH & Co. KG Elektrische kontaktierungsvorrichtungsvorrichtung für eine implantierbare medizinische vorrichtung und verfahren zur herstellung
EP3797828A1 (de) 2019-09-27 2021-03-31 Dyconex AG Lösbare dichtung für medizinische implantate
EP3900782B1 (de) 2020-02-21 2023-08-09 Heraeus Medical Components, LLC Hülse mit zugentlastendem abstandshalter für implantierbare medizinische vorrichtung
EP3900783B1 (de) 2020-02-21 2023-08-16 Heraeus Medical Components, LLC Hülse für ein nicht-planares gehäuse einer medizinischen vorrichtung
EP3903877A1 (de) * 2020-04-28 2021-11-03 Heraeus Deutschland GmbH & Co. KG Durchführungssystem
DE102020113106B4 (de) 2020-05-14 2022-03-03 Heraeus Deutschland GmbH & Co. KG Hermetische Beschichtung von Bauteilen
CN112756858A (zh) * 2020-12-29 2021-05-07 深圳市韦德勋光电科技有限公司 一种lcd逻辑板引脚处焊接的防过焊装置及使用方法
US20230085958A1 (en) 2021-09-10 2023-03-23 Greatbatch Ltd. A Ceramic Reinforced Metal Composite For Hermetic Bodies For Implantable Devices

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US9504840B2 (en) 2016-11-29
US20120193125A1 (en) 2012-08-02
DE102011009858A1 (de) 2012-08-02
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DE102011009858B4 (de) 2013-09-05
US20150122875A1 (en) 2015-05-07

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