DE2344493A1 - Loetflussmittel - Google Patents
LoetflussmittelInfo
- Publication number
- DE2344493A1 DE2344493A1 DE19732344493 DE2344493A DE2344493A1 DE 2344493 A1 DE2344493 A1 DE 2344493A1 DE 19732344493 DE19732344493 DE 19732344493 DE 2344493 A DE2344493 A DE 2344493A DE 2344493 A1 DE2344493 A1 DE 2344493A1
- Authority
- DE
- Germany
- Prior art keywords
- soldering flux
- percent
- weight
- soldering
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims description 38
- 238000005476 soldering Methods 0.000 title claims description 33
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 43
- 235000011187 glycerol Nutrition 0.000 claims description 21
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 8
- 239000011975 tartaric acid Substances 0.000 claims description 8
- 235000002906 tartaric acid Nutrition 0.000 claims description 8
- 125000005233 alkylalcohol group Chemical group 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000012190 activator Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000009972 noncorrosive effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 241000723346 Cinnamomum camphora Species 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229960000846 camphor Drugs 0.000 description 1
- 229930008380 camphor Natural products 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002884 skin cream Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29319972A | 1972-09-28 | 1972-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2344493A1 true DE2344493A1 (de) | 1974-04-11 |
Family
ID=23128113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19732344493 Pending DE2344493A1 (de) | 1972-09-28 | 1973-09-04 | Loetflussmittel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3796610A (enrdf_load_stackoverflow) |
| JP (1) | JPS4972157A (enrdf_load_stackoverflow) |
| DE (1) | DE2344493A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2201159B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1414877A (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4000016A (en) * | 1974-11-29 | 1976-12-28 | International Business Machines Corporation | Water soluble fluxes |
| US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
| GB2120964A (en) * | 1982-03-25 | 1983-12-14 | Alpha Metals | Processes of applying solder |
| JPH0394995A (ja) * | 1989-09-05 | 1991-04-19 | Nakajima All Purishijiyon Kk | 研摩剤および水溶性はんだフラックス |
| US5004508A (en) * | 1989-12-12 | 1991-04-02 | International Business Machines Corporation | Thermally dissipated soldering flux |
| US4995921A (en) * | 1990-05-11 | 1991-02-26 | Motorola, Inc. | Solder pastes using alcohol blends as rheological aids |
| US5122200A (en) * | 1990-09-17 | 1992-06-16 | Motorola, Inc. | Method of cleaning printed circuit boards using formic acid |
| US5092943A (en) * | 1990-09-17 | 1992-03-03 | Motorola, Inc. | Method of cleaning printed circuit boards using water |
| US7052558B1 (en) | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
| JP5468199B2 (ja) * | 2006-11-22 | 2014-04-09 | 日立化成株式会社 | 導電性接着剤組成物、電子部品搭載基板及び半導体装置 |
-
1972
- 1972-09-28 US US00293199A patent/US3796610A/en not_active Expired - Lifetime
-
1973
- 1973-07-31 GB GB3633573A patent/GB1414877A/en not_active Expired
- 1973-08-06 JP JP48087691A patent/JPS4972157A/ja active Pending
- 1973-09-04 DE DE19732344493 patent/DE2344493A1/de active Pending
- 1973-09-27 FR FR7335248A patent/FR2201159B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4972157A (enrdf_load_stackoverflow) | 1974-07-12 |
| US3796610A (en) | 1974-03-12 |
| FR2201159A1 (enrdf_load_stackoverflow) | 1974-04-26 |
| FR2201159B1 (enrdf_load_stackoverflow) | 1978-02-10 |
| GB1414877A (en) | 1975-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2820656C3 (de) | Lötflußmittel und dessen Anwendung | |
| DE69522993T2 (de) | Flussmittel und Verfahren zum Weichlöten | |
| DE10039684A1 (de) | Ätzlösung für Nickel oder Nickellegierungen | |
| DE69213840T2 (de) | Bad zur stromlosen Beschichtung mit einer Zinn-Blei-Legierung | |
| DE2044494B2 (de) | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik | |
| DE2810523A1 (de) | Leiterplatten fuer gedruckte schaltkreise und verfahren zu ihrer herstellung | |
| DE69114930T2 (de) | Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten. | |
| DE2536404A1 (de) | Saure waessrige loesung fuer die selektive entfernung von zinn oder zinn-blei-legierungen von kupfersubstraten | |
| DE1808161A1 (de) | Verfahren zum Aufbringen eines gedruckten Leitungsmusters auf ein elektrisch isolierendes Substrat | |
| DE2344493A1 (de) | Loetflussmittel | |
| DE1943519A1 (de) | Halbleiterbauelement | |
| DE2847070A1 (de) | Verfahren zur behandlung eines mit additiv aufplattierten gedruckten leiterzuegen versehenen substrates | |
| DE2535375A1 (de) | Loetflussmittel | |
| DE2137329A1 (de) | Lotflußmittel | |
| DE3645211C2 (de) | Flußmittel für das Löten von Leiterplatten | |
| DE1752137C3 (de) | Verfahren zum Löten von mikrominiaturisierten Schaltkreisen und Flußmittel zur Durchführung des Verfahrens | |
| EP1082471A1 (de) | Verfahren zum überziehen von oberflächen auf kupfer oder einer kupferlegierung mit einer zinn- oder zinnlegierungsschicht | |
| DE4132545A1 (de) | Loet-flussmittel vom rueckstandsarmen typ | |
| DE4333127A1 (de) | Verfahren zum Schutz von lötfähigen Kupfer- und Kupferlegierungsoberflächen vor Korrosion | |
| DE102008033348A1 (de) | Oberflächenbehandlungsmittel | |
| EP0009131B1 (de) | Verfahren zur in situ Änderung der Zusammensetzungen von Lötlegierungen | |
| DE60126979T2 (de) | Verfahren zur herstellung einer lötung zwischen metallischen kugeln eines elektronischen bauelements und kontaktflecken einer schaltung und lötofen dafür | |
| DE2048738A1 (de) | Verzinnungsverfahren fur Lotstellen elektrischer Bauelemente | |
| DE69012941T2 (de) | Verfahren und material zum schützen und zum verbessern der lötbarkeit von metallischen oberflächen. | |
| DE2114927B2 (de) | Lötflußmittel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHJ | Non-payment of the annual fee |