DE2304412A1 - Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen - Google Patents

Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Info

Publication number
DE2304412A1
DE2304412A1 DE2304412A DE2304412A DE2304412A1 DE 2304412 A1 DE2304412 A1 DE 2304412A1 DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A1 DE2304412 A1 DE 2304412A1
Authority
DE
Germany
Prior art keywords
components
component combinations
moisture
plastic film
potting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2304412A
Other languages
German (de)
English (en)
Inventor
Ferdinand Utner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2304412A priority Critical patent/DE2304412A1/de
Priority to LU68391A priority patent/LU68391A1/xx
Priority to AT869073A priority patent/AT327345B/de
Priority to GB5554773A priority patent/GB1418949A/en
Priority to AU63520/73A priority patent/AU6352073A/en
Priority to NL7317195A priority patent/NL7317195A/xx
Priority to BR9911/73A priority patent/BR7309911D0/pt
Priority to SE7400046A priority patent/SE385757B/xx
Priority to ZA740310A priority patent/ZA74310B/xx
Priority to CH85774A priority patent/CH562512A5/xx
Priority to IT19802/74A priority patent/IT1006156B/it
Priority to DD176196A priority patent/DD109475A5/xx
Priority to FR7402874A priority patent/FR2215780B1/fr
Priority to SU1997125A priority patent/SU528892A3/ru
Priority to ES422705A priority patent/ES422705A1/es
Priority to ES422706A priority patent/ES422706A1/es
Priority to JP49011926A priority patent/JPS49105161A/ja
Priority to CS632A priority patent/CS170484B2/cs
Priority to BE140354A priority patent/BE810374A/xx
Publication of DE2304412A1 publication Critical patent/DE2304412A1/de
Priority to DE19752535173 priority patent/DE2535173A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
DE2304412A 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen Pending DE2304412A1 (de)

Priority Applications (20)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen
LU68391A LU68391A1 (xx) 1973-01-30 1973-09-10
AT869073A AT327345B (de) 1973-01-30 1973-10-11 Verfahren zur herstellung einer feuchtedichten umhullung fur elektrische bauelemente oder bauelementekombinationen
GB5554773A GB1418949A (en) 1973-01-30 1973-11-30 Electrical component assemblies
AU63520/73A AU6352073A (en) 1973-01-30 1973-12-12 Electrical component assemblies
NL7317195A NL7317195A (xx) 1973-01-30 1973-12-14
BR9911/73A BR7309911D0 (pt) 1973-01-30 1973-12-18 Envoltorio a prova de unidade para elementos de construcacao eletricos ou combinacoes dos mesmos e pprocesso para sua fabricacao
SE7400046A SE385757B (sv) 1973-01-30 1974-01-03 Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje
ZA740310A ZA74310B (en) 1973-01-30 1974-01-16 Improvements in or relating to electrical component assemblies
CH85774A CH562512A5 (xx) 1973-01-30 1974-01-22
IT19802/74A IT1006156B (it) 1973-01-30 1974-01-25 Involucro a tenuta di umidita per componenti elettrici o combinazioni di componenti elettrici
DD176196A DD109475A5 (xx) 1973-01-30 1974-01-25
FR7402874A FR2215780B1 (xx) 1973-01-30 1974-01-29
SU1997125A SU528892A3 (ru) 1973-01-30 1974-01-29 Способ герметизации электрических деталей с однонаправленными выводами
ES422705A ES422705A1 (es) 1973-01-30 1974-01-29 Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.
ES422706A ES422706A1 (es) 1973-01-30 1974-01-29 Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos.
JP49011926A JPS49105161A (xx) 1973-01-30 1974-01-30
CS632A CS170484B2 (xx) 1973-01-30 1974-01-30
BE140354A BE810374A (fr) 1973-01-30 1974-01-30 Enveloppe etanche a l'humidite pour composants ou combinaisons de composants electriques
DE19752535173 DE2535173A1 (de) 1973-01-30 1975-08-06 Verfahren zum herstellen einer feuchtedichten umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number Publication Date
DE2304412A1 true DE2304412A1 (de) 1974-08-01

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2304412A Pending DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Country Status (18)

Country Link
JP (1) JPS49105161A (xx)
AT (1) AT327345B (xx)
AU (1) AU6352073A (xx)
BE (1) BE810374A (xx)
BR (1) BR7309911D0 (xx)
CH (1) CH562512A5 (xx)
CS (1) CS170484B2 (xx)
DD (1) DD109475A5 (xx)
DE (1) DE2304412A1 (xx)
ES (2) ES422705A1 (xx)
FR (1) FR2215780B1 (xx)
GB (1) GB1418949A (xx)
IT (1) IT1006156B (xx)
LU (1) LU68391A1 (xx)
NL (1) NL7317195A (xx)
SE (1) SE385757B (xx)
SU (1) SU528892A3 (xx)
ZA (1) ZA74310B (xx)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2750357A1 (de) * 1976-11-09 1978-05-11 Minnesota Mining & Mfg Material zur herstellung von schutzumhuellungen fuer elektronische bauteile
DE2830472A1 (de) * 1978-07-11 1980-01-24 Siemens Ag Verfahren zum serienmaessigen umhuellen elektrischer bauelemente, insbesondere kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896A1 (de) * 1983-12-23 1985-07-11 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum schutz von anzeigeelementen und mit diesen verbundenen schaltungen vor stoerungen durch elektrostatische entladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies Ag Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2750357A1 (de) * 1976-11-09 1978-05-11 Minnesota Mining & Mfg Material zur herstellung von schutzumhuellungen fuer elektronische bauteile
DE2830472A1 (de) * 1978-07-11 1980-01-24 Siemens Ag Verfahren zum serienmaessigen umhuellen elektrischer bauelemente, insbesondere kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896A1 (de) * 1983-12-23 1985-07-11 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum schutz von anzeigeelementen und mit diesen verbundenen schaltungen vor stoerungen durch elektrostatische entladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung

Also Published As

Publication number Publication date
BE810374A (fr) 1974-05-16
AU6352073A (en) 1975-06-12
ATA869073A (de) 1975-04-15
FR2215780A1 (xx) 1974-08-23
FR2215780B1 (xx) 1977-09-23
IT1006156B (it) 1976-09-30
BR7309911D0 (pt) 1974-10-22
ES422705A1 (es) 1976-04-16
JPS49105161A (xx) 1974-10-04
SU528892A3 (ru) 1976-09-15
ZA74310B (en) 1974-11-27
NL7317195A (xx) 1974-08-01
DD109475A5 (xx) 1974-11-05
CS170484B2 (xx) 1976-08-27
AT327345B (de) 1976-01-26
CH562512A5 (xx) 1975-05-30
SE385757B (sv) 1976-07-19
GB1418949A (en) 1975-12-24
ES422706A1 (es) 1976-04-16
LU68391A1 (xx) 1973-11-22

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Legal Events

Date Code Title Description
OHW Rejection