DE2252833A1 - Zusammengesetzte halbleitervorrichtung und verfahren zur herstellung derselben - Google Patents

Zusammengesetzte halbleitervorrichtung und verfahren zur herstellung derselben

Info

Publication number
DE2252833A1
DE2252833A1 DE2252833A DE2252833A DE2252833A1 DE 2252833 A1 DE2252833 A1 DE 2252833A1 DE 2252833 A DE2252833 A DE 2252833A DE 2252833 A DE2252833 A DE 2252833A DE 2252833 A1 DE2252833 A1 DE 2252833A1
Authority
DE
Germany
Prior art keywords
conductors
square
base part
semiconductor device
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2252833A
Other languages
German (de)
English (en)
Inventor
Shinzo Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8596771A external-priority patent/JPS559825B2/ja
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of DE2252833A1 publication Critical patent/DE2252833A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE2252833A 1971-10-30 1972-10-27 Zusammengesetzte halbleitervorrichtung und verfahren zur herstellung derselben Pending DE2252833A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8596771A JPS559825B2 (OSRAM) 1971-10-30 1971-10-30
US29985572A 1972-10-24 1972-10-24
US00404730A US3857168A (en) 1971-10-30 1973-10-09 Square cylindrical packaged semiconductor device

Publications (1)

Publication Number Publication Date
DE2252833A1 true DE2252833A1 (de) 1973-05-24

Family

ID=27305009

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2252833A Pending DE2252833A1 (de) 1971-10-30 1972-10-27 Zusammengesetzte halbleitervorrichtung und verfahren zur herstellung derselben

Country Status (4)

Country Link
US (2) US3801881A (OSRAM)
CA (1) CA976664A (OSRAM)
DE (1) DE2252833A1 (OSRAM)
FR (1) FR2158332B1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
JPS55120152A (en) * 1979-03-09 1980-09-16 Fujitsu Ltd Semiconductor device
JPS5615059U (OSRAM) * 1979-07-11 1981-02-09
JPS5875859A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 半導体装置
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
US5160810A (en) * 1990-05-07 1992-11-03 Synergy Microwave Corporation Universal surface mount package
US5122621A (en) * 1990-05-07 1992-06-16 Synergy Microwave Corporation Universal surface mount package
JP3166251B2 (ja) * 1991-12-18 2001-05-14 株式会社村田製作所 セラミック多層電子部品の製造方法
US6200407B1 (en) * 1994-08-18 2001-03-13 Rockwell Technologies, Llc Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB939966A (en) * 1960-12-21 1963-10-16 Gen Electric Co Ltd Improvements in or relating to glass-to-metal seals
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
US3405224A (en) * 1966-04-20 1968-10-08 Nippon Electric Co Sealed enclosure for electronic device
US3560180A (en) * 1968-05-15 1971-02-02 Philco Ford Corp Glass metal sealing technique
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3715635A (en) * 1971-06-25 1973-02-06 Bendix Corp High frequency matched impedance microcircuit holder
US3706841A (en) * 1971-09-17 1972-12-19 Joseph F Novak Method and apparatus for converting monochrome pictures to multi-color pictures electronically

Also Published As

Publication number Publication date
FR2158332A1 (OSRAM) 1973-06-15
US3857168A (en) 1974-12-31
FR2158332B1 (OSRAM) 1978-09-29
US3801881A (en) 1974-04-02
CA976664A (en) 1975-10-21

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Legal Events

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