FR2158332B1 - - Google Patents
Info
- Publication number
- FR2158332B1 FR2158332B1 FR7238317A FR7238317A FR2158332B1 FR 2158332 B1 FR2158332 B1 FR 2158332B1 FR 7238317 A FR7238317 A FR 7238317A FR 7238317 A FR7238317 A FR 7238317A FR 2158332 B1 FR2158332 B1 FR 2158332B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W76/153—
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- H10W70/658—
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- H10W76/157—
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- H10W72/075—
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- H10W72/5522—
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- H10W90/754—
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- H10W90/756—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8596771A JPS559825B2 (OSRAM) | 1971-10-30 | 1971-10-30 | |
| US29985572A | 1972-10-24 | 1972-10-24 | |
| US00404730A US3857168A (en) | 1971-10-30 | 1973-10-09 | Square cylindrical packaged semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2158332A1 FR2158332A1 (OSRAM) | 1973-06-15 |
| FR2158332B1 true FR2158332B1 (OSRAM) | 1978-09-29 |
Family
ID=27305009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7238317A Expired FR2158332B1 (OSRAM) | 1971-10-30 | 1972-10-27 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US3801881A (OSRAM) |
| CA (1) | CA976664A (OSRAM) |
| DE (1) | DE2252833A1 (OSRAM) |
| FR (1) | FR2158332B1 (OSRAM) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3864810A (en) * | 1972-09-27 | 1975-02-11 | Minnesota Mining & Mfg | Process and composite leadless chip carriers with external connections |
| US3916434A (en) * | 1972-11-30 | 1975-10-28 | Power Hybrids Inc | Hermetically sealed encapsulation of semiconductor devices |
| US3898594A (en) * | 1973-11-02 | 1975-08-05 | Trw Inc | Microwave semiconductor device package |
| JPS55120152A (en) * | 1979-03-09 | 1980-09-16 | Fujitsu Ltd | Semiconductor device |
| JPS5615059U (OSRAM) * | 1979-07-11 | 1981-02-09 | ||
| JPS5875859A (ja) * | 1981-10-30 | 1983-05-07 | Fujitsu Ltd | 半導体装置 |
| JPS6376444A (ja) * | 1986-09-19 | 1988-04-06 | Nec Corp | チツプキヤリア |
| US5122621A (en) * | 1990-05-07 | 1992-06-16 | Synergy Microwave Corporation | Universal surface mount package |
| US5160810A (en) * | 1990-05-07 | 1992-11-03 | Synergy Microwave Corporation | Universal surface mount package |
| JP3166251B2 (ja) * | 1991-12-18 | 2001-05-14 | 株式会社村田製作所 | セラミック多層電子部品の製造方法 |
| US6200407B1 (en) * | 1994-08-18 | 2001-03-13 | Rockwell Technologies, Llc | Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB939966A (en) * | 1960-12-21 | 1963-10-16 | Gen Electric Co Ltd | Improvements in or relating to glass-to-metal seals |
| GB1015909A (en) * | 1963-12-30 | 1966-01-05 | Gen Micro Electronics Inc | Method of and product for packaging electronic devices |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
| US3405224A (en) * | 1966-04-20 | 1968-10-08 | Nippon Electric Co | Sealed enclosure for electronic device |
| US3560180A (en) * | 1968-05-15 | 1971-02-02 | Philco Ford Corp | Glass metal sealing technique |
| BE755950A (fr) * | 1969-09-11 | 1971-03-09 | Philips Nv | Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation |
| US3715635A (en) * | 1971-06-25 | 1973-02-06 | Bendix Corp | High frequency matched impedance microcircuit holder |
| US3706841A (en) * | 1971-09-17 | 1972-12-19 | Joseph F Novak | Method and apparatus for converting monochrome pictures to multi-color pictures electronically |
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1972
- 1972-10-24 US US00299855A patent/US3801881A/en not_active Expired - Lifetime
- 1972-10-27 DE DE2252833A patent/DE2252833A1/de active Pending
- 1972-10-27 FR FR7238317A patent/FR2158332B1/fr not_active Expired
- 1972-10-30 CA CA155,194A patent/CA976664A/en not_active Expired
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1973
- 1973-10-09 US US00404730A patent/US3857168A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US3801881A (en) | 1974-04-02 |
| DE2252833A1 (de) | 1973-05-24 |
| CA976664A (en) | 1975-10-21 |
| US3857168A (en) | 1974-12-31 |
| FR2158332A1 (OSRAM) | 1973-06-15 |