CA976664A - Square cylindrical packaged semiconductor device - Google Patents

Square cylindrical packaged semiconductor device

Info

Publication number
CA976664A
CA976664A CA155,194A CA155194A CA976664A CA 976664 A CA976664 A CA 976664A CA 155194 A CA155194 A CA 155194A CA 976664 A CA976664 A CA 976664A
Authority
CA
Canada
Prior art keywords
semiconductor device
packaged semiconductor
square cylindrical
cylindrical packaged
square
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA155,194A
Other languages
English (en)
Inventor
Shinzo Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8596771A external-priority patent/JPS559825B2/ja
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Application granted granted Critical
Publication of CA976664A publication Critical patent/CA976664A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/153—
    • H10W70/658—
    • H10W76/157—
    • H10W72/075—
    • H10W72/5522—
    • H10W90/754—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
CA155,194A 1971-10-30 1972-10-30 Square cylindrical packaged semiconductor device Expired CA976664A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8596771A JPS559825B2 (OSRAM) 1971-10-30 1971-10-30
US29985572A 1972-10-24 1972-10-24
US00404730A US3857168A (en) 1971-10-30 1973-10-09 Square cylindrical packaged semiconductor device

Publications (1)

Publication Number Publication Date
CA976664A true CA976664A (en) 1975-10-21

Family

ID=27305009

Family Applications (1)

Application Number Title Priority Date Filing Date
CA155,194A Expired CA976664A (en) 1971-10-30 1972-10-30 Square cylindrical packaged semiconductor device

Country Status (4)

Country Link
US (2) US3801881A (OSRAM)
CA (1) CA976664A (OSRAM)
DE (1) DE2252833A1 (OSRAM)
FR (1) FR2158332B1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
JPS55120152A (en) * 1979-03-09 1980-09-16 Fujitsu Ltd Semiconductor device
JPS5615059U (OSRAM) * 1979-07-11 1981-02-09
JPS5875859A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 半導体装置
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
US5122621A (en) * 1990-05-07 1992-06-16 Synergy Microwave Corporation Universal surface mount package
US5160810A (en) * 1990-05-07 1992-11-03 Synergy Microwave Corporation Universal surface mount package
JP3166251B2 (ja) * 1991-12-18 2001-05-14 株式会社村田製作所 セラミック多層電子部品の製造方法
US6200407B1 (en) * 1994-08-18 2001-03-13 Rockwell Technologies, Llc Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB939966A (en) * 1960-12-21 1963-10-16 Gen Electric Co Ltd Improvements in or relating to glass-to-metal seals
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
US3405224A (en) * 1966-04-20 1968-10-08 Nippon Electric Co Sealed enclosure for electronic device
US3560180A (en) * 1968-05-15 1971-02-02 Philco Ford Corp Glass metal sealing technique
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3715635A (en) * 1971-06-25 1973-02-06 Bendix Corp High frequency matched impedance microcircuit holder
US3706841A (en) * 1971-09-17 1972-12-19 Joseph F Novak Method and apparatus for converting monochrome pictures to multi-color pictures electronically

Also Published As

Publication number Publication date
US3801881A (en) 1974-04-02
DE2252833A1 (de) 1973-05-24
FR2158332B1 (OSRAM) 1978-09-29
US3857168A (en) 1974-12-31
FR2158332A1 (OSRAM) 1973-06-15

Similar Documents

Publication Publication Date Title
CA974663A (en) Semiconductor device package
CA961173A (en) Semiconductor device package
AU466735B2 (en) Semi-conductor device
CA933671A (en) Semiconductor device
AU465865B2 (en) Semiconductor device
AU473052B2 (en) Semiconductor device
CA976664A (en) Square cylindrical packaged semiconductor device
CA963174A (en) Semiconductor device
CA1006624A (en) Semiconductor device
AU459156B2 (en) Monolithic semiconductor device
CA1000404A (en) Semiconductor memory device
AU463708B2 (en) Semiconductor device
AU474165B2 (en) Semiconductor device
CA970882A (en) Semiconductor device packaging
CA968467A (en) Semiconductor device package
CA869748A (en) Semiconductor device
CA878787A (en) Semiconductor device
CA888441A (en) Semiconductor device
CA866990A (en) Semiconductor device
CA863535A (en) Semiconductor device
CA881782A (en) Semiconductor device
CA881781A (en) Semiconductor device
CA874134A (en) Semiconductor device
CA881188A (en) Semiconductor device
CA876989A (en) Semiconductor device