DE2246152C2 - Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken - Google Patents

Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken

Info

Publication number
DE2246152C2
DE2246152C2 DE2246152A DE2246152A DE2246152C2 DE 2246152 C2 DE2246152 C2 DE 2246152C2 DE 2246152 A DE2246152 A DE 2246152A DE 2246152 A DE2246152 A DE 2246152A DE 2246152 C2 DE2246152 C2 DE 2246152C2
Authority
DE
Germany
Prior art keywords
mask
signals
lines
objects
another
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2246152A
Other languages
German (de)
English (en)
Other versions
DE2246152A1 (de
Inventor
Einar Skau Mathisen
Robert Louis Poughkeepsie N.Y. Moore
Leonard Stephen Wappingers Falls N.Y. Sheiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2246152A1 publication Critical patent/DE2246152A1/de
Application granted granted Critical
Publication of DE2246152C2 publication Critical patent/DE2246152C2/de
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/975Substrate or mask aligning feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
DE2246152A 1971-12-01 1972-09-20 Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken Expired DE2246152C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20373671A 1971-12-01 1971-12-01

Publications (2)

Publication Number Publication Date
DE2246152A1 DE2246152A1 (de) 1973-06-07
DE2246152C2 true DE2246152C2 (de) 1983-11-17

Family

ID=22755117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2246152A Expired DE2246152C2 (de) 1971-12-01 1972-09-20 Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken

Country Status (5)

Country Link
US (1) US3796497A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5325476B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2246152C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2164177A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1414658A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2935265A1 (de) * 1978-09-01 1980-03-13 Canon Kk Ausrichtvorrichtung
DE102004014054A1 (de) * 2004-03-23 2005-10-20 Daimler Chrysler Ag Verfahren und Vorrichtung zum Ausrichten eines Werkstücks

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070117A (en) * 1972-06-12 1978-01-24 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
US3955072A (en) * 1971-03-22 1976-05-04 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask
JPS549900B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-10-13 1979-04-28
US3943359A (en) * 1973-06-15 1976-03-09 Hitachi, Ltd. Apparatus for relatively positioning a plurality of objects by the use of a scanning optoelectric microscope
US3885877A (en) * 1973-10-11 1975-05-27 Ibm Electro-optical fine alignment process
US3865483A (en) * 1974-03-21 1975-02-11 Ibm Alignment illumination system
US3903363A (en) * 1974-05-31 1975-09-02 Western Electric Co Automatic positioning system and method
CA1075795A (en) * 1974-10-04 1980-04-15 N.V. Philips Gloeilampenfabrieken Automatic machine tool
US4052603A (en) * 1974-12-23 1977-10-04 International Business Machines Corporation Object positioning process and apparatus
JPS593791B2 (ja) * 1975-04-07 1984-01-26 キヤノン株式会社 物体の像認識方法
US3989384A (en) * 1975-05-30 1976-11-02 The United States Of America As Represented By The Secretary Of The Army System for measuring small angular motions
JPS5212577A (en) * 1975-07-21 1977-01-31 Nippon Kogaku Kk <Nikon> Automatic location device
US3986007A (en) * 1975-08-20 1976-10-12 The Bendix Corporation Method and apparatus for calibrating mechanical-visual part manipulating system
JPS52109875A (en) * 1976-02-25 1977-09-14 Hitachi Ltd Position matching system for mask and wafer and its unit
JPS607764B2 (ja) * 1976-04-28 1985-02-27 キヤノン株式会社 走査型光検出装置
JPS5952535B2 (ja) * 1977-01-21 1984-12-20 キヤノン株式会社 光学装置
JPS6011325B2 (ja) * 1977-01-21 1985-03-25 キヤノン株式会社 走査装置
US4199219A (en) * 1977-04-22 1980-04-22 Canon Kabushiki Kaisha Device for scanning an object with a light beam
DE2843282A1 (de) * 1977-10-05 1979-04-12 Canon Kk Fotoelektrische erfassungsvorrichtung
US4213117A (en) * 1977-11-28 1980-07-15 Hitachi, Ltd. Method and apparatus for detecting positions of chips on a semiconductor wafer
JPS5478581A (en) * 1977-12-05 1979-06-22 Toshiba Mach Co Ltd Centering method in lathe and its device
US4172664A (en) * 1977-12-30 1979-10-30 International Business Machines Corporation High precision pattern registration and overlay measurement system and process
DE2816324C2 (de) * 1978-04-14 1983-06-23 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zur automatischen Lageerkennung von Halbleiterchips
DE2907774A1 (de) * 1979-02-28 1980-09-11 Siemens Ag Verfahren zur automatischen lageerkennung von halbleiterelementen
DE2822269C2 (de) * 1978-05-22 1983-12-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zur automatischen Ausrichtung von zwei aufeinander einzujustierenden Objekten
JPS54157478A (en) * 1978-06-01 1979-12-12 Canon Inc Alignment method
DE2845603C2 (de) * 1978-10-19 1982-12-09 Censor Patent- und Versuchs-Anstalt, 9490 Vaduz Verfahren und Einrichtung zum Projektionskopieren
US4383757A (en) * 1979-04-02 1983-05-17 Optimetrix Corporation Optical focusing system
US4540278A (en) * 1979-04-02 1985-09-10 Optimetrix Corporation Optical focusing system
US4247763A (en) * 1979-05-02 1981-01-27 Honeywell Inc. Grid scan range finding apparatus
JPS55162227A (en) * 1979-06-04 1980-12-17 Hitachi Ltd Microprojection exposure device
US4309813A (en) * 1979-12-26 1982-01-12 Harris Corporation Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits
CA1171555A (en) 1981-05-15 1984-07-24 Ronald S. Hershel Apparatus for projecting a series of images onto dies of a semiconductor wafer
US4391494A (en) * 1981-05-15 1983-07-05 General Signal Corporation Apparatus for projecting a series of images onto dies of a semiconductor wafer
NL8220224A (nl) * 1981-05-15 1983-04-05 Gen Signal Corp Inrichting voor het projecteren van een reeks beelden op vormplaatsen van een halfgeleiderwafel.
US4444492A (en) * 1982-05-15 1984-04-24 General Signal Corporation Apparatus for projecting a series of images onto dies of a semiconductor wafer
DE3335164C2 (de) * 1982-09-28 1994-06-09 Komatsu Mfg Co Ltd Verfahren zur Positionierung von Blechmaterial in einer Stanzeinrichtung
JPS5972727A (ja) * 1982-10-19 1984-04-24 Matsushita Electric Ind Co Ltd 位置合わせ用テ−ブル
JPS59101827A (ja) * 1982-12-01 1984-06-12 Canon Inc 検知光学系
US4636626A (en) * 1983-01-14 1987-01-13 Nippon Kogaku K.K. Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication
US4634876A (en) * 1983-05-13 1987-01-06 Canon Kabushiki Kaisha Object position detecting apparatus using accumulation type sensor
US4566796A (en) * 1983-08-24 1986-01-28 Harris Corporation Method of determining position on a wafer
JPS6052021A (ja) * 1983-08-31 1985-03-23 Canon Inc 位置検出方法
JPH0619280B2 (ja) * 1983-09-24 1994-03-16 名古屋大学長 光学式自動位置決め装置
US4555968A (en) * 1984-06-07 1985-12-03 Preco Industries, Inc. Web fed die cutting press having automatic 3-axis die registration system
US4828392A (en) * 1985-03-13 1989-05-09 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
US4771180A (en) * 1985-10-11 1988-09-13 Matsushita Electric Industrial Co. Ltd. Exposure apparatus including an optical system for aligning a reticle and a wafer
US5140366A (en) * 1987-05-29 1992-08-18 Canon Kabushiki Kaisha Exposure apparatus with a function for controlling alignment by use of latent images
JPH0617774B2 (ja) * 1987-06-22 1994-03-09 大日本スクリ−ン製造株式会社 微小高低差測定装置
US4972498A (en) * 1988-07-07 1990-11-20 Grumman Aerospace Corporation Alignment system for an optical matched filter correlator
US5106432A (en) * 1989-05-16 1992-04-21 Oki Electric Industry Co., Ltd. Wafer alignment mark utilizing parallel grooves and process
US5216529A (en) * 1992-01-15 1993-06-01 Bell Communications Research, Inc. Holographic code division multiple access
JPH05323141A (ja) * 1992-05-20 1993-12-07 Furukawa Electric Co Ltd:The 光部品の製造方法
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
US5385289A (en) * 1994-02-08 1995-01-31 Digital Equipment Corporation Embedded features for registration measurement in electronics manufacturing
US5457880A (en) * 1994-02-08 1995-10-17 Digital Equipment Corporation Embedded features for monitoring electronics assembly manufacturing processes
JP3445100B2 (ja) * 1997-06-02 2003-09-08 キヤノン株式会社 位置検出方法及び位置検出装置
US6327513B1 (en) 1998-04-16 2001-12-04 Vlsi Technology, Inc. Methods and apparatus for calculating alignment of layers during semiconductor processing
JP2001080141A (ja) * 1999-09-14 2001-03-27 Sony Corp 印刷制御装置及び方法、プリンタ装置及び印刷方法、印刷システム及び印刷方法
US8632590B2 (en) 1999-10-20 2014-01-21 Anulex Technologies, Inc. Apparatus and methods for the treatment of the intervertebral disc
US7615076B2 (en) 1999-10-20 2009-11-10 Anulex Technologies, Inc. Method and apparatus for the treatment of the intervertebral disc annulus
US7004970B2 (en) 1999-10-20 2006-02-28 Anulex Technologies, Inc. Methods and devices for spinal disc annulus reconstruction and repair
US7228428B2 (en) * 2001-12-14 2007-06-05 Xerox Corporation Method and apparatus for embedding encrypted images of signatures and other data on checks
GB2388896A (en) * 2002-05-21 2003-11-26 Sharp Kk An apparatus for and method of aligning a structure
US7988297B2 (en) 2007-10-19 2011-08-02 Look Dynamics, Inc. Non-rigidly coupled, overlapping, non-feedback, optical systems for spatial filtering of fourier transform optical patterns and image shape content characterization
TWI381255B (zh) * 2008-12-04 2013-01-01 Ind Tech Res Inst 雙面光學片滾壓對位量測系統及其方法
JP5795777B2 (ja) * 2010-02-26 2015-10-14 マイクロニック エービー パターンアライメントを行うための方法および装置
US8614797B2 (en) * 2011-06-27 2013-12-24 Infineon Technologies Ag Wafer orientation sensor
US20140175049A1 (en) * 2012-12-21 2014-06-26 Apple Inc. Pre-patterned film-based resist
CN117236400A (zh) 2017-09-20 2023-12-15 视觉动力公司 数据处理阵列

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1261120B (de) * 1965-08-20 1968-02-15 Telefunken Patent Verfahren und Vorrichtung zum gegenseitigen Justieren von Halbleiterscheiben gegen Masken
US3475805A (en) * 1967-06-26 1969-11-04 Ibm Apparatus for positioning articles on substrates
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
US3539260A (en) * 1967-10-02 1970-11-10 Texas Instruments Inc Method and apparatus for automatic alignment of coherent optical spatial frequency filters
US3497705A (en) * 1968-02-12 1970-02-24 Itek Corp Mask alignment system using radial patterns and flying spot scanning
US3535527A (en) * 1968-04-26 1970-10-20 North American Rockwell Digital correlation pattern tracker with single axis scanning
US3612698A (en) * 1969-05-01 1971-10-12 Ibm Automatic holographic wafer positioning system and method
US3683195A (en) * 1971-03-22 1972-08-08 Kasper Instruments Apparatus for the automatic alignment of two superimposed objects,e.g. a semiconductor wafer and mask

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2935265A1 (de) * 1978-09-01 1980-03-13 Canon Kk Ausrichtvorrichtung
DE102004014054A1 (de) * 2004-03-23 2005-10-20 Daimler Chrysler Ag Verfahren und Vorrichtung zum Ausrichten eines Werkstücks
DE102004014054B4 (de) * 2004-03-23 2009-09-03 Daimler Ag Verfahren zum Ausrichten eines Werkstücks

Also Published As

Publication number Publication date
JPS4864884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-09-07
DE2246152A1 (de) 1973-06-07
JPS5325476B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-07-27
US3796497A (en) 1974-03-12
GB1414658A (en) 1975-11-19
FR2164177A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-07-27

Similar Documents

Publication Publication Date Title
DE2246152C2 (de) Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken
DE69827608T2 (de) Ausrichtungsvorrichtung und lithographischer apparat mit einer solchen vorrichtung
DE3114682C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE3047822C2 (de) Vorrichtung zur Verarbeitung optischer Information
DE2431960C3 (de) Verfahren zum Erzeugen einer strukturierten Schicht auf einem Substrat mit Hilfe von Photoätzprozessen sowie Einrichtung zur Durchführung dieses Verfahrens
DE2905636C2 (de) Verfahren zum Kopieren von Masken auf ein Werkstück
DE3507778A1 (de) Vorrichtung und verfahren zur eichung eines mikroskopischen bearbeitungssystems mit hilfe einer justierplatte
DE2260229C3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP0002668B1 (de) Einrichtung zur optischen Abstandsmessung
DE2439987A1 (de) Verfahren zum ausrichten von objekten durch elektrooptische vorrichtungen
DE69724331T2 (de) Verfahren zur Herstellung eines Düsenkörpers und Arbeitsgerät
DE19611726B4 (de) Blindstruktur zur Außeraxial-Belichtung
DE2047316C3 (de) Verfahren zur Herstellung einer Speicherelektrode und Einrichtung zur Durchführung des Verfahrens
DE112021000658T5 (de) Laserbearbeitungsgerät und Laserbearbeitungsverfahren
DE112004002561T5 (de) Verfahren, Vorrichtung und Beugungsgitter zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, durch Änderung besagten Beugungsgitters
DE112021000747T5 (de) Laserbearbeitungsgerät und Laserbearbeitungsverfahren
DE3404063C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE2820482C2 (de) Vorrichtung zum Scharfeinstellen eines optischen Auslesesystems
WO1980001721A1 (en) Process and attachment for adjusting the image surface and/or the object surface in optical copying unit
EP0135673B1 (de) Verfahren und Vorrichtung zur Festlegung einer Koordinate auf einer Oberfläche eines Festkörpers
DE69018556T2 (de) Belichtungsvorrichtung.
DE19544753A1 (de) Elektronenstrahl-Schreibverfahren und -Schreibvorrichtung
DE3248382A1 (de) Verfahren und vorrichtung zum ausrichten
DE2151528A1 (de) Verfahren und Vorrichtung zur Abtastung eines interferometrischen Linienmusters
EP0128993B1 (de) Verfahren zum Feststellen von Referenzdaten zum Zwecke der Korrektur von mechanischen Bewegungen beim Schreiben von Linien mit einem Schreiblaserstrahl in einem metallisierten Raster und Vorrichtung zur Durchführung des Verfahrens

Legal Events

Date Code Title Description
OD Request for examination
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee