DE2246152C2 - Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken - Google Patents
Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und MaskenInfo
- Publication number
- DE2246152C2 DE2246152C2 DE2246152A DE2246152A DE2246152C2 DE 2246152 C2 DE2246152 C2 DE 2246152C2 DE 2246152 A DE2246152 A DE 2246152A DE 2246152 A DE2246152 A DE 2246152A DE 2246152 C2 DE2246152 C2 DE 2246152C2
- Authority
- DE
- Germany
- Prior art keywords
- mask
- signals
- lines
- objects
- another
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 33
- 235000012431 wafers Nutrition 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 17
- 238000001228 spectrum Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000009466 transformation Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20373671A | 1971-12-01 | 1971-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2246152A1 DE2246152A1 (de) | 1973-06-07 |
DE2246152C2 true DE2246152C2 (de) | 1983-11-17 |
Family
ID=22755117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2246152A Expired DE2246152C2 (de) | 1971-12-01 | 1972-09-20 | Verfahren und Vorrichtung zum gegenseitigen Ausrichten von Halbleiterplättchen und Masken |
Country Status (5)
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2935265A1 (de) * | 1978-09-01 | 1980-03-13 | Canon Kk | Ausrichtvorrichtung |
DE102004014054A1 (de) * | 2004-03-23 | 2005-10-20 | Daimler Chrysler Ag | Verfahren und Vorrichtung zum Ausrichten eines Werkstücks |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4070117A (en) * | 1972-06-12 | 1978-01-24 | Kasper Instruments, Inc. | Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask |
US3955072A (en) * | 1971-03-22 | 1976-05-04 | Kasper Instruments, Inc. | Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask |
JPS549900B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-10-13 | 1979-04-28 | ||
US3943359A (en) * | 1973-06-15 | 1976-03-09 | Hitachi, Ltd. | Apparatus for relatively positioning a plurality of objects by the use of a scanning optoelectric microscope |
US3885877A (en) * | 1973-10-11 | 1975-05-27 | Ibm | Electro-optical fine alignment process |
US3865483A (en) * | 1974-03-21 | 1975-02-11 | Ibm | Alignment illumination system |
US3903363A (en) * | 1974-05-31 | 1975-09-02 | Western Electric Co | Automatic positioning system and method |
CA1075795A (en) * | 1974-10-04 | 1980-04-15 | N.V. Philips Gloeilampenfabrieken | Automatic machine tool |
US4052603A (en) * | 1974-12-23 | 1977-10-04 | International Business Machines Corporation | Object positioning process and apparatus |
JPS593791B2 (ja) * | 1975-04-07 | 1984-01-26 | キヤノン株式会社 | 物体の像認識方法 |
US3989384A (en) * | 1975-05-30 | 1976-11-02 | The United States Of America As Represented By The Secretary Of The Army | System for measuring small angular motions |
JPS5212577A (en) * | 1975-07-21 | 1977-01-31 | Nippon Kogaku Kk <Nikon> | Automatic location device |
US3986007A (en) * | 1975-08-20 | 1976-10-12 | The Bendix Corporation | Method and apparatus for calibrating mechanical-visual part manipulating system |
JPS52109875A (en) * | 1976-02-25 | 1977-09-14 | Hitachi Ltd | Position matching system for mask and wafer and its unit |
JPS607764B2 (ja) * | 1976-04-28 | 1985-02-27 | キヤノン株式会社 | 走査型光検出装置 |
JPS5952535B2 (ja) * | 1977-01-21 | 1984-12-20 | キヤノン株式会社 | 光学装置 |
JPS6011325B2 (ja) * | 1977-01-21 | 1985-03-25 | キヤノン株式会社 | 走査装置 |
US4199219A (en) * | 1977-04-22 | 1980-04-22 | Canon Kabushiki Kaisha | Device for scanning an object with a light beam |
DE2843282A1 (de) * | 1977-10-05 | 1979-04-12 | Canon Kk | Fotoelektrische erfassungsvorrichtung |
US4213117A (en) * | 1977-11-28 | 1980-07-15 | Hitachi, Ltd. | Method and apparatus for detecting positions of chips on a semiconductor wafer |
JPS5478581A (en) * | 1977-12-05 | 1979-06-22 | Toshiba Mach Co Ltd | Centering method in lathe and its device |
US4172664A (en) * | 1977-12-30 | 1979-10-30 | International Business Machines Corporation | High precision pattern registration and overlay measurement system and process |
DE2816324C2 (de) * | 1978-04-14 | 1983-06-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zur automatischen Lageerkennung von Halbleiterchips |
DE2907774A1 (de) * | 1979-02-28 | 1980-09-11 | Siemens Ag | Verfahren zur automatischen lageerkennung von halbleiterelementen |
DE2822269C2 (de) * | 1978-05-22 | 1983-12-01 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur automatischen Ausrichtung von zwei aufeinander einzujustierenden Objekten |
JPS54157478A (en) * | 1978-06-01 | 1979-12-12 | Canon Inc | Alignment method |
DE2845603C2 (de) * | 1978-10-19 | 1982-12-09 | Censor Patent- und Versuchs-Anstalt, 9490 Vaduz | Verfahren und Einrichtung zum Projektionskopieren |
US4383757A (en) * | 1979-04-02 | 1983-05-17 | Optimetrix Corporation | Optical focusing system |
US4540278A (en) * | 1979-04-02 | 1985-09-10 | Optimetrix Corporation | Optical focusing system |
US4247763A (en) * | 1979-05-02 | 1981-01-27 | Honeywell Inc. | Grid scan range finding apparatus |
JPS55162227A (en) * | 1979-06-04 | 1980-12-17 | Hitachi Ltd | Microprojection exposure device |
US4309813A (en) * | 1979-12-26 | 1982-01-12 | Harris Corporation | Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits |
CA1171555A (en) | 1981-05-15 | 1984-07-24 | Ronald S. Hershel | Apparatus for projecting a series of images onto dies of a semiconductor wafer |
US4391494A (en) * | 1981-05-15 | 1983-07-05 | General Signal Corporation | Apparatus for projecting a series of images onto dies of a semiconductor wafer |
NL8220224A (nl) * | 1981-05-15 | 1983-04-05 | Gen Signal Corp | Inrichting voor het projecteren van een reeks beelden op vormplaatsen van een halfgeleiderwafel. |
US4444492A (en) * | 1982-05-15 | 1984-04-24 | General Signal Corporation | Apparatus for projecting a series of images onto dies of a semiconductor wafer |
DE3335164C2 (de) * | 1982-09-28 | 1994-06-09 | Komatsu Mfg Co Ltd | Verfahren zur Positionierung von Blechmaterial in einer Stanzeinrichtung |
JPS5972727A (ja) * | 1982-10-19 | 1984-04-24 | Matsushita Electric Ind Co Ltd | 位置合わせ用テ−ブル |
JPS59101827A (ja) * | 1982-12-01 | 1984-06-12 | Canon Inc | 検知光学系 |
US4636626A (en) * | 1983-01-14 | 1987-01-13 | Nippon Kogaku K.K. | Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication |
US4634876A (en) * | 1983-05-13 | 1987-01-06 | Canon Kabushiki Kaisha | Object position detecting apparatus using accumulation type sensor |
US4566796A (en) * | 1983-08-24 | 1986-01-28 | Harris Corporation | Method of determining position on a wafer |
JPS6052021A (ja) * | 1983-08-31 | 1985-03-23 | Canon Inc | 位置検出方法 |
JPH0619280B2 (ja) * | 1983-09-24 | 1994-03-16 | 名古屋大学長 | 光学式自動位置決め装置 |
US4555968A (en) * | 1984-06-07 | 1985-12-03 | Preco Industries, Inc. | Web fed die cutting press having automatic 3-axis die registration system |
US4828392A (en) * | 1985-03-13 | 1989-05-09 | Matsushita Electric Industrial Co., Ltd. | Exposure apparatus |
US4771180A (en) * | 1985-10-11 | 1988-09-13 | Matsushita Electric Industrial Co. Ltd. | Exposure apparatus including an optical system for aligning a reticle and a wafer |
US5140366A (en) * | 1987-05-29 | 1992-08-18 | Canon Kabushiki Kaisha | Exposure apparatus with a function for controlling alignment by use of latent images |
JPH0617774B2 (ja) * | 1987-06-22 | 1994-03-09 | 大日本スクリ−ン製造株式会社 | 微小高低差測定装置 |
US4972498A (en) * | 1988-07-07 | 1990-11-20 | Grumman Aerospace Corporation | Alignment system for an optical matched filter correlator |
US5106432A (en) * | 1989-05-16 | 1992-04-21 | Oki Electric Industry Co., Ltd. | Wafer alignment mark utilizing parallel grooves and process |
US5216529A (en) * | 1992-01-15 | 1993-06-01 | Bell Communications Research, Inc. | Holographic code division multiple access |
JPH05323141A (ja) * | 1992-05-20 | 1993-12-07 | Furukawa Electric Co Ltd:The | 光部品の製造方法 |
US5729331A (en) * | 1993-06-30 | 1998-03-17 | Nikon Corporation | Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus |
US5385289A (en) * | 1994-02-08 | 1995-01-31 | Digital Equipment Corporation | Embedded features for registration measurement in electronics manufacturing |
US5457880A (en) * | 1994-02-08 | 1995-10-17 | Digital Equipment Corporation | Embedded features for monitoring electronics assembly manufacturing processes |
JP3445100B2 (ja) * | 1997-06-02 | 2003-09-08 | キヤノン株式会社 | 位置検出方法及び位置検出装置 |
US6327513B1 (en) | 1998-04-16 | 2001-12-04 | Vlsi Technology, Inc. | Methods and apparatus for calculating alignment of layers during semiconductor processing |
JP2001080141A (ja) * | 1999-09-14 | 2001-03-27 | Sony Corp | 印刷制御装置及び方法、プリンタ装置及び印刷方法、印刷システム及び印刷方法 |
US8632590B2 (en) | 1999-10-20 | 2014-01-21 | Anulex Technologies, Inc. | Apparatus and methods for the treatment of the intervertebral disc |
US7615076B2 (en) | 1999-10-20 | 2009-11-10 | Anulex Technologies, Inc. | Method and apparatus for the treatment of the intervertebral disc annulus |
US7004970B2 (en) | 1999-10-20 | 2006-02-28 | Anulex Technologies, Inc. | Methods and devices for spinal disc annulus reconstruction and repair |
US7228428B2 (en) * | 2001-12-14 | 2007-06-05 | Xerox Corporation | Method and apparatus for embedding encrypted images of signatures and other data on checks |
GB2388896A (en) * | 2002-05-21 | 2003-11-26 | Sharp Kk | An apparatus for and method of aligning a structure |
US7988297B2 (en) | 2007-10-19 | 2011-08-02 | Look Dynamics, Inc. | Non-rigidly coupled, overlapping, non-feedback, optical systems for spatial filtering of fourier transform optical patterns and image shape content characterization |
TWI381255B (zh) * | 2008-12-04 | 2013-01-01 | Ind Tech Res Inst | 雙面光學片滾壓對位量測系統及其方法 |
JP5795777B2 (ja) * | 2010-02-26 | 2015-10-14 | マイクロニック エービー | パターンアライメントを行うための方法および装置 |
US8614797B2 (en) * | 2011-06-27 | 2013-12-24 | Infineon Technologies Ag | Wafer orientation sensor |
US20140175049A1 (en) * | 2012-12-21 | 2014-06-26 | Apple Inc. | Pre-patterned film-based resist |
CN117236400A (zh) | 2017-09-20 | 2023-12-15 | 视觉动力公司 | 数据处理阵列 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1261120B (de) * | 1965-08-20 | 1968-02-15 | Telefunken Patent | Verfahren und Vorrichtung zum gegenseitigen Justieren von Halbleiterscheiben gegen Masken |
US3475805A (en) * | 1967-06-26 | 1969-11-04 | Ibm | Apparatus for positioning articles on substrates |
US3466514A (en) * | 1967-06-26 | 1969-09-09 | Ibm | Method and apparatus for positioning objects in preselected orientations |
US3539260A (en) * | 1967-10-02 | 1970-11-10 | Texas Instruments Inc | Method and apparatus for automatic alignment of coherent optical spatial frequency filters |
US3497705A (en) * | 1968-02-12 | 1970-02-24 | Itek Corp | Mask alignment system using radial patterns and flying spot scanning |
US3535527A (en) * | 1968-04-26 | 1970-10-20 | North American Rockwell | Digital correlation pattern tracker with single axis scanning |
US3612698A (en) * | 1969-05-01 | 1971-10-12 | Ibm | Automatic holographic wafer positioning system and method |
US3683195A (en) * | 1971-03-22 | 1972-08-08 | Kasper Instruments | Apparatus for the automatic alignment of two superimposed objects,e.g. a semiconductor wafer and mask |
-
1971
- 1971-12-01 US US00203736A patent/US3796497A/en not_active Expired - Lifetime
-
1972
- 1972-09-20 DE DE2246152A patent/DE2246152C2/de not_active Expired
- 1972-11-14 FR FR7242137A patent/FR2164177A5/fr not_active Expired
- 1972-11-22 GB GB5404672A patent/GB1414658A/en not_active Expired
- 1972-11-28 JP JP11861272A patent/JPS5325476B2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2935265A1 (de) * | 1978-09-01 | 1980-03-13 | Canon Kk | Ausrichtvorrichtung |
DE102004014054A1 (de) * | 2004-03-23 | 2005-10-20 | Daimler Chrysler Ag | Verfahren und Vorrichtung zum Ausrichten eines Werkstücks |
DE102004014054B4 (de) * | 2004-03-23 | 2009-09-03 | Daimler Ag | Verfahren zum Ausrichten eines Werkstücks |
Also Published As
Publication number | Publication date |
---|---|
JPS4864884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-09-07 |
DE2246152A1 (de) | 1973-06-07 |
JPS5325476B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-07-27 |
US3796497A (en) | 1974-03-12 |
GB1414658A (en) | 1975-11-19 |
FR2164177A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OD | Request for examination | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |