DE2238099B2 - Gedruckte schaltung - Google Patents
Gedruckte schaltungInfo
- Publication number
- DE2238099B2 DE2238099B2 DE19722238099 DE2238099A DE2238099B2 DE 2238099 B2 DE2238099 B2 DE 2238099B2 DE 19722238099 DE19722238099 DE 19722238099 DE 2238099 A DE2238099 A DE 2238099A DE 2238099 B2 DE2238099 B2 DE 2238099B2
- Authority
- DE
- Germany
- Prior art keywords
- gold
- molybdenum
- nickel
- layer
- manganese
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16845871A | 1971-08-02 | 1971-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2238099A1 DE2238099A1 (de) | 1973-02-15 |
DE2238099B2 true DE2238099B2 (de) | 1973-06-28 |
Family
ID=22611563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19722238099 Pending DE2238099B2 (de) | 1971-08-02 | 1972-08-02 | Gedruckte schaltung |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS4824256A (enrdf_load_stackoverflow) |
DE (1) | DE2238099B2 (enrdf_load_stackoverflow) |
FR (1) | FR2148167A1 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51129672A (en) * | 1975-04-11 | 1976-11-11 | Hitachi Chemical Co Ltd | Method of manufacturing ceramic circuit board |
AT398675B (de) * | 1989-08-29 | 1995-01-25 | Austria Tech & System Tech | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
DE19910078A1 (de) * | 1999-03-08 | 2000-09-28 | Bosch Gmbh Robert | Verfahren zur Erhöung der Fertigungssicherheit von Lötverbindungen |
-
1972
- 1972-08-01 FR FR7227725A patent/FR2148167A1/fr not_active Withdrawn
- 1972-08-02 DE DE19722238099 patent/DE2238099B2/de active Pending
- 1972-08-02 JP JP7699272A patent/JPS4824256A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS4824256A (enrdf_load_stackoverflow) | 1973-03-29 |
DE2238099A1 (de) | 1973-02-15 |
FR2148167A1 (en) | 1973-03-11 |
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