FR2148167A1 - Electronic device - composed of a dielectric substrate with molybdenum contg circuit pattern and gold plated - Google Patents

Electronic device - composed of a dielectric substrate with molybdenum contg circuit pattern and gold plated

Info

Publication number
FR2148167A1
FR2148167A1 FR7227725A FR7227725A FR2148167A1 FR 2148167 A1 FR2148167 A1 FR 2148167A1 FR 7227725 A FR7227725 A FR 7227725A FR 7227725 A FR7227725 A FR 7227725A FR 2148167 A1 FR2148167 A1 FR 2148167A1
Authority
FR
France
Prior art keywords
contg
circuit pattern
dielectric substrate
molybdenum
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7227725A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2148167A1 publication Critical patent/FR2148167A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Die Bonding (AREA)
  • Non-Insulated Conductors (AREA)
FR7227725A 1971-08-02 1972-08-01 Electronic device - composed of a dielectric substrate with molybdenum contg circuit pattern and gold plated Withdrawn FR2148167A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16845871A 1971-08-02 1971-08-02

Publications (1)

Publication Number Publication Date
FR2148167A1 true FR2148167A1 (en) 1973-03-11

Family

ID=22611563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7227725A Withdrawn FR2148167A1 (en) 1971-08-02 1972-08-01 Electronic device - composed of a dielectric substrate with molybdenum contg circuit pattern and gold plated

Country Status (3)

Country Link
JP (1) JPS4824256A (enrdf_load_stackoverflow)
DE (1) DE2238099B2 (enrdf_load_stackoverflow)
FR (1) FR2148167A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000054561A1 (de) * 1999-03-08 2000-09-14 Robert Bosch Gmbh Verfahren zur erhöhung der fertigungssicherheit von lötverbindungen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51129672A (en) * 1975-04-11 1976-11-11 Hitachi Chemical Co Ltd Method of manufacturing ceramic circuit board
AT398675B (de) * 1989-08-29 1995-01-25 Austria Tech & System Tech Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000054561A1 (de) * 1999-03-08 2000-09-14 Robert Bosch Gmbh Verfahren zur erhöhung der fertigungssicherheit von lötverbindungen
US6488199B1 (en) 1999-03-08 2002-12-03 Robert Bosch Gmbh Method for improving the manufacturing safety of weld joints

Also Published As

Publication number Publication date
DE2238099B2 (de) 1973-06-28
JPS4824256A (enrdf_load_stackoverflow) 1973-03-29
DE2238099A1 (de) 1973-02-15

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Legal Events

Date Code Title Description
ST Notification of lapse