JPS556814A - Led laminated substrate - Google Patents

Led laminated substrate

Info

Publication number
JPS556814A
JPS556814A JP7834478A JP7834478A JPS556814A JP S556814 A JPS556814 A JP S556814A JP 7834478 A JP7834478 A JP 7834478A JP 7834478 A JP7834478 A JP 7834478A JP S556814 A JPS556814 A JP S556814A
Authority
JP
Japan
Prior art keywords
nickel
hardness
thickness
foil
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7834478A
Other languages
Japanese (ja)
Inventor
Seiichi Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7834478A priority Critical patent/JPS556814A/en
Publication of JPS556814A publication Critical patent/JPS556814A/en
Pending legal-status Critical Current

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  • Led Device Packages (AREA)

Abstract

PURPOSE: To reduce the circuit substrate forming process while eliminating the control of thickness and hardness of the nickel by bonding a nickel foil having a specified thickness and hardness on the insulated base material.
CONSTITUTION: A nickel foil with a thickness of 9 to 15 μ and a hardness exceeding 90 micro Vickers necessary for the LED pellet junction is directly bonded on an insulated based material made of phenol, paper epoxy, glass cloth epoxy or the like. With such an arrangement, it is possible to eliminate the complicated control of the thickness and the hardness in the case of nickel plating. With the formation of desired nickel pattern simply by photoetching, a substrated can be obtained in accordance with the specifications of finishing nickel. The substrate in accordance with the metal and silver finishing specifications can be obtained through direct metal or silver plating on the substrate with the nickel pattern formed. An aluminium foil may be used in place of the nickel foil.
COPYRIGHT: (C)1980,JPO&Japio
JP7834478A 1978-06-28 1978-06-28 Led laminated substrate Pending JPS556814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7834478A JPS556814A (en) 1978-06-28 1978-06-28 Led laminated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7834478A JPS556814A (en) 1978-06-28 1978-06-28 Led laminated substrate

Publications (1)

Publication Number Publication Date
JPS556814A true JPS556814A (en) 1980-01-18

Family

ID=13659360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7834478A Pending JPS556814A (en) 1978-06-28 1978-06-28 Led laminated substrate

Country Status (1)

Country Link
JP (1) JPS556814A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766540U (en) * 1980-10-06 1982-04-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766540U (en) * 1980-10-06 1982-04-21

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