DE2237804A1 - Kontinuierliches redox-verfahren und vorrichtung zum loesen von kupfer - Google Patents
Kontinuierliches redox-verfahren und vorrichtung zum loesen von kupferInfo
- Publication number
- DE2237804A1 DE2237804A1 DE19722237804 DE2237804A DE2237804A1 DE 2237804 A1 DE2237804 A1 DE 2237804A1 DE 19722237804 DE19722237804 DE 19722237804 DE 2237804 A DE2237804 A DE 2237804A DE 2237804 A1 DE2237804 A1 DE 2237804A1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- solution
- etching solution
- etching
- alkaline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010949 copper Substances 0.000 title claims description 91
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 90
- 229910052802 copper Inorganic materials 0.000 title claims description 90
- 238000000034 method Methods 0.000 title claims description 21
- 238000005530 etching Methods 0.000 claims description 130
- 230000005484 gravity Effects 0.000 claims description 25
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 22
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 239000007800 oxidant agent Substances 0.000 claims description 15
- 150000002500 ions Chemical class 0.000 claims description 12
- 229910021529 ammonia Inorganic materials 0.000 claims description 11
- 229910001431 copper ion Inorganic materials 0.000 claims description 10
- 230000007935 neutral effect Effects 0.000 claims description 7
- 239000002738 chelating agent Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- 239000000908 ammonium hydroxide Substances 0.000 claims description 4
- 150000003863 ammonium salts Chemical class 0.000 claims description 4
- -1 copper (I) ions Chemical class 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical group OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- 229960001484 edetic acid Drugs 0.000 claims description 3
- 238000006479 redox reaction Methods 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008929 regeneration Effects 0.000 description 4
- 238000011069 regeneration method Methods 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003518 caustics Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004254 Ammonium phosphate Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 235000019289 ammonium phosphates Nutrition 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- GEHMBYLTCISYNY-UHFFFAOYSA-N Ammonium sulfamate Chemical class [NH4+].NS([O-])(=O)=O GEHMBYLTCISYNY-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical class [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- AWZACWPILWGEQL-UHFFFAOYSA-M azanium;copper(1+);sulfate Chemical compound [NH4+].[Cu+].[O-]S([O-])(=O)=O AWZACWPILWGEQL-UHFFFAOYSA-M 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23243472A | 1972-03-07 | 1972-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2237804A1 true DE2237804A1 (de) | 1973-09-13 |
Family
ID=22873091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722237804 Withdrawn DE2237804A1 (de) | 1972-03-07 | 1972-08-01 | Kontinuierliches redox-verfahren und vorrichtung zum loesen von kupfer |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE787332A (OSRAM) |
| DE (1) | DE2237804A1 (OSRAM) |
| FR (1) | FR2174816A1 (OSRAM) |
| IT (1) | IT964977B (OSRAM) |
| NL (1) | NL175439C (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012204070A1 (de) * | 2012-03-15 | 2013-09-19 | Krones Ag | Pumpe mit Gleitringdichtung in Kombination mit einer Vorrichtung zum Spülen einer Gleitringdichtung einer Pumpe mit Spülwasser und entsprechendes Verfahren |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3999564A (en) * | 1976-01-09 | 1976-12-28 | Pesek Engineering & Mfg. Co. | Continuous etching and etched material recovery system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2049245A5 (en) * | 1969-06-04 | 1971-03-26 | Macdermid Inc | Metal-free etching soln. for copper coatings |
-
1972
- 1972-08-01 DE DE19722237804 patent/DE2237804A1/de not_active Withdrawn
- 1972-08-08 FR FR7228554A patent/FR2174816A1/fr active Granted
- 1972-08-08 BE BE787332A patent/BE787332A/xx not_active IP Right Cessation
- 1972-08-16 NL NL7211192A patent/NL175439C/xx not_active IP Right Cessation
- 1972-08-22 IT IT6969772A patent/IT964977B/it active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012204070A1 (de) * | 2012-03-15 | 2013-09-19 | Krones Ag | Pumpe mit Gleitringdichtung in Kombination mit einer Vorrichtung zum Spülen einer Gleitringdichtung einer Pumpe mit Spülwasser und entsprechendes Verfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| NL175439C (nl) | 1984-11-01 |
| NL175439B (nl) | 1984-06-01 |
| FR2174816B1 (OSRAM) | 1974-10-25 |
| NL7211192A (OSRAM) | 1973-09-11 |
| IT964977B (it) | 1974-01-31 |
| FR2174816A1 (en) | 1973-10-19 |
| BE787332A (fr) | 1972-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0728853B1 (de) | Verfahren und Anlage zum Regenerieren von Sulfatelektrolyt bei der Stahlband-Verzinkung | |
| DE3022962C2 (de) | Verfahren zum Regenerieren einer chemischen Verkupferungslösung | |
| DE2837219C2 (OSRAM) | ||
| US3705061A (en) | Continuous redox process for dissolving copper | |
| DE69606505T2 (de) | Verfahren zum Beizen von Stahl | |
| EP0158910B1 (de) | Verfahren zur Rückgewinnung von Kupfer aus einer ammoniakalischen Kupfer-Ätzlösung und Rekonditionierung derselben | |
| DE2759952C2 (de) | Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades | |
| DE4124814C2 (de) | Verfahren und Vorrichtung zum galvanischen Abscheiden eines elektrisch leitenden Materiales auf einem Substrat | |
| EP0178347B1 (de) | Verfahren zum automatischen Regenerieren von Kupferchlorid-Ätzlösungen | |
| EP0320798B1 (de) | Verfahren zur Entschlammung von Phosphatierungsbädern und Vorrichtung für dieses Verfahren | |
| DE3340343C2 (OSRAM) | ||
| EP0453706A2 (de) | Entgiftung verbrauchter fotografischer Prozessbäder und Waschwässer mittels anodischer Oxidation | |
| DE2250072A1 (de) | Verfahren zur rueckgewinnung von kupfer aus verbrauchten aetzloesungen, sowie einrichtung zur durchfuehrung des verfahrens | |
| CH626409A5 (OSRAM) | ||
| DE2237804A1 (de) | Kontinuierliches redox-verfahren und vorrichtung zum loesen von kupfer | |
| DE4318168A1 (de) | Verfahren zum direkten elektrochemischen Raffinieren von Kupferabfällen | |
| EP0240589B1 (de) | Verfahren zur Regenerierung eines stromlosen Verkupferungsbades und Vorrichtung zur Durchführung desselben | |
| DE2708321A1 (de) | Verfahren zur entfernung von jod | |
| DE3339263A1 (de) | Regenerierungsvorrichtung fuer photographische fixiermittel, nach rueckgewinnung des silbers | |
| DE2929305C2 (de) | Verfahren und Vorrichtung zur kontinuierlichen galvanischen Abscheidung von Mangan auf Stahl | |
| CH674020A5 (OSRAM) | ||
| EP0137123A2 (de) | Ammoniumsulfathaltige Ätzlösung sowie Verfahren zur Regeneration der Ätzlösung | |
| DE4218843C2 (de) | Verfahren zur Regeneration eines ammoniakalischen Ätzmittels sowie Vorrichtung zur Durchführung dieses Verfahrens | |
| DE2363462C3 (de) | Verfahren zum galvanischen Abscheiden von Weichgoldschichten | |
| DE3018511C2 (de) | Verfahren für die chemische Vernickelung von Metallkörpern |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: EISENFUEHR, G., DIPL.-ING. SPEISER, D., DIPL.-ING. |
|
| 8178 | Suspension cancelled | ||
| 8130 | Withdrawal |