DE2152541C3 - Leiterplattenstapel - Google Patents
LeiterplattenstapelInfo
- Publication number
- DE2152541C3 DE2152541C3 DE2152541A DE2152541A DE2152541C3 DE 2152541 C3 DE2152541 C3 DE 2152541C3 DE 2152541 A DE2152541 A DE 2152541A DE 2152541 A DE2152541 A DE 2152541A DE 2152541 C3 DE2152541 C3 DE 2152541C3
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- circuit board
- plate
- cavity
- stack according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002826 coolant Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims 3
- 235000010678 Paulownia tomentosa Nutrition 0.000 claims 1
- 240000002834 Paulownia tomentosa Species 0.000 claims 1
- 210000005069 ears Anatomy 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000012809 cooling fluid Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8287370A | 1970-10-22 | 1970-10-22 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2152541A1 DE2152541A1 (de) | 1972-08-31 |
| DE2152541B2 DE2152541B2 (de) | 1974-03-07 |
| DE2152541C3 true DE2152541C3 (de) | 1974-09-26 |
Family
ID=22173994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2152541A Expired DE2152541C3 (de) | 1970-10-22 | 1971-10-21 | Leiterplattenstapel |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3648113A (enExample) |
| JP (1) | JPS526462B1 (enExample) |
| CA (1) | CA923213A (enExample) |
| DE (1) | DE2152541C3 (enExample) |
| FR (1) | FR2109696A5 (enExample) |
| GB (1) | GB1312404A (enExample) |
| IL (1) | IL37186A (enExample) |
| IT (1) | IT938913B (enExample) |
| SE (1) | SE369573B (enExample) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6508824A (enExample) * | 1964-07-08 | 1966-01-10 | ||
| DE2062666A1 (de) * | 1970-12-19 | 1972-07-06 | Bbc Brown Boveri & Cie | Aus Bausteinen aufgebaute Stromrichteranlage |
| FR2157094A5 (enExample) * | 1971-10-18 | 1973-06-01 | Thomson Csf | |
| JPS4994507A (enExample) * | 1973-01-17 | 1974-09-07 | ||
| DE2335735A1 (de) * | 1973-07-13 | 1975-01-30 | Forster Electronic Gmbh | Textbearbeitungsgeraet fuer fernsteuerbare schreibmaschinen |
| US3956673A (en) * | 1974-02-14 | 1976-05-11 | Lockheed Aircraft Corporation | Printed circuit modules cooled by rack with forced air |
| US3904933A (en) * | 1974-10-23 | 1975-09-09 | Control Data Corp | Cooling apparatus for electronic modules |
| US4006388A (en) * | 1975-03-03 | 1977-02-01 | Hughes Aircraft Company | Thermally controlled electronic system package |
| DE2536957C2 (de) * | 1975-08-20 | 1983-05-11 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektronisches Bauelement |
| US4122508A (en) * | 1977-09-06 | 1978-10-24 | Altec Corporation | Modular printed circuit board assembly having cooling means incorporated therein |
| US4135225A (en) * | 1977-09-19 | 1979-01-16 | Welsh James W | Pivotal structural enclosure |
| US4186422A (en) * | 1978-08-01 | 1980-01-29 | The Singer Company | Modular electronic system with cooling means and stackable electronic circuit unit therefor |
| GB2033668B (en) * | 1978-11-11 | 1983-01-06 | Ferranti Ltd | Circuit assemblies |
| US4283754A (en) * | 1979-03-26 | 1981-08-11 | Bunker Ramo Corporation | Cooling system for multiwafer high density circuit |
| US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
| DE3536963A1 (de) * | 1985-10-17 | 1987-04-23 | Diehl Gmbh & Co | Baugruppenanordnung |
| FR2651636B1 (fr) * | 1989-09-06 | 1996-08-02 | Segem | Bac electronique modulaire a ventilation incorporee. |
| US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
| US5099254A (en) * | 1990-03-22 | 1992-03-24 | Raytheon Company | Modular transmitter and antenna array system |
| US5159529A (en) * | 1991-05-15 | 1992-10-27 | International Business Machines Corporation | Composite liquid cooled plate for electronic equipment |
| US5274530A (en) * | 1992-05-29 | 1993-12-28 | Anderson William B | Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules |
| US5343359A (en) * | 1992-11-19 | 1994-08-30 | Cray Research, Inc. | Apparatus for cooling daughter boards |
| JP2658805B2 (ja) * | 1993-06-30 | 1997-09-30 | 日本電気株式会社 | 電磁シールド用筐体 |
| US5767443A (en) * | 1993-07-10 | 1998-06-16 | Micron Technology, Inc. | Multi-die encapsulation device |
| US5482109A (en) * | 1994-03-15 | 1996-01-09 | E-Systems, Inc. | Modular heat exchanger |
| US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
| DE19514545A1 (de) * | 1995-04-20 | 1996-10-24 | Daimler Benz Ag | Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen |
| SE9502498D0 (sv) * | 1995-07-07 | 1995-07-07 | Volvo Penta Ab | Cooling of heat-sensitive components |
| US5726857A (en) * | 1996-02-22 | 1998-03-10 | Cray Research, Inc. | Apparatus and method for mounting edge connectors within a circuit module |
| US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
| US5761035A (en) * | 1996-06-28 | 1998-06-02 | Motorola, Inc. | Circuit board apparatus and method for spray-cooling a circuit board |
| US6252302B1 (en) | 1996-09-19 | 2001-06-26 | Warren M. Farnworth | Heat transfer material for an improved die edge contacting socket |
| US5886872A (en) * | 1997-04-23 | 1999-03-23 | Compaq Computer Corporation | Pivotable support and heat sink apparatus removably connectable without tools to a computer processor |
| US6169247B1 (en) * | 1998-06-11 | 2001-01-02 | Lucent Technologies Inc. | Enclosure for electronic components |
| US6297960B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
| EP0992430A3 (en) * | 1998-10-07 | 2000-09-13 | Negesat Di Boer Fabrizio & C. SNC | Housing providing cooling for equipment aboard aircraft or spacecraft |
| US7019244B2 (en) * | 2002-04-20 | 2006-03-28 | Hewlett-Packard Development Company, L.P. | Electrostatic precipitator |
| FR2845821B1 (fr) | 2002-10-11 | 2005-12-02 | Thales Sa | Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique |
| DE202004006552U1 (de) * | 2004-04-26 | 2004-07-08 | Knürr AG | Kühlungssystem für Geräte- und Netzwerkschränke |
| EP1965424A3 (en) * | 2004-11-24 | 2011-06-29 | Danfoss Silicon Power GmbH | A flow distribution module and a stack of flow distribution modules |
| WO2007029253A2 (en) | 2005-09-06 | 2007-03-15 | Beyond Blades Ltd. | 3-dimensional multi-layered modular computer architecture |
| US7671801B2 (en) * | 2005-09-19 | 2010-03-02 | Raytheon Company | Armor for an electronically scanned array |
| US7324336B2 (en) * | 2005-09-27 | 2008-01-29 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
| US7365974B2 (en) * | 2005-10-14 | 2008-04-29 | Smiths Aerospace Llc | Method for electronics equipment cooling having improved EMI control and reduced weight |
| US7365976B2 (en) * | 2006-03-24 | 2008-04-29 | Fujitsu Limited | Electronic apparatus |
| FR2905556B1 (fr) * | 2006-08-30 | 2009-06-26 | Thales Sa | Baie electronique associant convection naturelle et circulation d'air force pour son refroidissement |
| US7995346B2 (en) * | 2008-03-06 | 2011-08-09 | Northrop Grumman Systems Corporation | Ruggedized, self aligning, sliding air seal for removable electronic units |
| FR2934906B1 (fr) * | 2008-08-05 | 2010-09-03 | Thales Sa | Calculateur embarque equipe d'un dispositif de refroidissement aeraulique autonome |
| US8174826B2 (en) | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
| US8279597B2 (en) | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
| US8179674B2 (en) | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
| US8358503B2 (en) | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
| US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
| US20120170224A1 (en) * | 2010-12-29 | 2012-07-05 | Src, Inc. | Circuit board frame with integral heat sink for enhanced thermal transfer |
| WO2014039212A1 (en) | 2012-09-07 | 2014-03-13 | David Smith | Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment |
| US11421921B2 (en) | 2012-09-07 | 2022-08-23 | David Lane Smith | Cooling electronic devices installed in a subsurface environment |
| TWI507772B (zh) | 2013-06-26 | 2015-11-11 | E Ink Holdings Inc | 電子裝置 |
| US9826640B2 (en) | 2013-06-26 | 2017-11-21 | E Ink Holdings Inc. | Electronic apparatus |
| US9426931B2 (en) | 2014-02-07 | 2016-08-23 | Lockheed Martin Corporation | Fluid-flow-through cooling of circuit boards |
| US9357670B2 (en) | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
| US9560789B2 (en) | 2014-06-24 | 2017-01-31 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US11744041B2 (en) | 2014-06-24 | 2023-08-29 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
| US9258926B2 (en) | 2014-06-24 | 2016-02-09 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US11191186B2 (en) | 2014-06-24 | 2021-11-30 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
| US9408332B2 (en) | 2014-06-24 | 2016-08-02 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US9699939B2 (en) | 2014-06-24 | 2017-07-04 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US9950628B2 (en) * | 2016-03-09 | 2018-04-24 | Ford Global Technologies, Llc | Power-module assembly with dummy module |
| US10017073B2 (en) | 2016-03-09 | 2018-07-10 | Ford Global Technologies, Llc | Coolant channels for power module assemblies |
| US9961808B2 (en) | 2016-03-09 | 2018-05-01 | Ford Global Technologies, Llc | Power electronics system |
| US11502349B2 (en) | 2020-08-31 | 2022-11-15 | Borgwarner, Inc. | Cooling manifold assembly |
| US20240314930A1 (en) * | 2023-03-14 | 2024-09-19 | Samsung Electronics Co., Ltd. | Computing system with connecting boards |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3124720A (en) * | 1964-03-10 | Modular electronic assemblies with cooling means | ||
| US2942856A (en) * | 1959-01-13 | 1960-06-28 | Kenneth E Woodward | Fluid-cooled electrical module assembly |
| US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
-
1970
- 1970-10-22 US US3648113D patent/US3648113A/en not_active Expired - Lifetime
-
1971
- 1971-06-29 IL IL3718671A patent/IL37186A/xx unknown
- 1971-07-02 CA CA117273A patent/CA923213A/en not_active Expired
- 1971-07-20 GB GB3392471A patent/GB1312404A/en not_active Expired
- 1971-08-16 FR FR7129820A patent/FR2109696A5/fr not_active Expired
- 1971-08-19 JP JP6265171A patent/JPS526462B1/ja active Pending
- 1971-10-01 IT IT2939471A patent/IT938913B/it active
- 1971-10-21 SE SE1338071A patent/SE369573B/xx unknown
- 1971-10-21 DE DE2152541A patent/DE2152541C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS526462B1 (enExample) | 1977-02-22 |
| DE2152541A1 (de) | 1972-08-31 |
| US3648113A (en) | 1972-03-07 |
| FR2109696A5 (enExample) | 1972-05-26 |
| JPS477969A (enExample) | 1972-04-27 |
| CA923213A (en) | 1973-03-20 |
| IT938913B (it) | 1973-02-10 |
| IL37186A (en) | 1974-01-14 |
| IL37186A0 (en) | 1971-08-25 |
| SE369573B (enExample) | 1974-09-02 |
| DE2152541B2 (de) | 1974-03-07 |
| GB1312404A (en) | 1973-04-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EGA | New person/name/address of the applicant | ||
| 8328 | Change in the person/name/address of the agent |
Free format text: OEDEKOVEN, W., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN |