DE2147607C3 - Halbleitereinrichtung - Google Patents

Halbleitereinrichtung

Info

Publication number
DE2147607C3
DE2147607C3 DE2147607A DE2147607A DE2147607C3 DE 2147607 C3 DE2147607 C3 DE 2147607C3 DE 2147607 A DE2147607 A DE 2147607A DE 2147607 A DE2147607 A DE 2147607A DE 2147607 C3 DE2147607 C3 DE 2147607C3
Authority
DE
Germany
Prior art keywords
semiconductor device
insulating part
soldered
intermediate piece
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2147607A
Other languages
German (de)
English (en)
Other versions
DE2147607A1 (de
DE2147607B2 (https=
Inventor
William Vincent Somerset N.J. Fitzgerald Jun. (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE2147607A1 publication Critical patent/DE2147607A1/de
Publication of DE2147607B2 publication Critical patent/DE2147607B2/de
Application granted granted Critical
Publication of DE2147607C3 publication Critical patent/DE2147607C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE2147607A 1970-09-23 1971-09-23 Halbleitereinrichtung Expired DE2147607C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7459170A 1970-09-23 1970-09-23

Publications (3)

Publication Number Publication Date
DE2147607A1 DE2147607A1 (de) 1972-03-30
DE2147607B2 DE2147607B2 (https=) 1974-08-29
DE2147607C3 true DE2147607C3 (de) 1975-05-07

Family

ID=22120406

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2147607A Expired DE2147607C3 (de) 1970-09-23 1971-09-23 Halbleitereinrichtung

Country Status (5)

Country Link
US (1) US3641398A (https=)
JP (1) JPS5229591B1 (https=)
CA (1) CA922817A (https=)
DE (1) DE2147607C3 (https=)
GB (1) GB1352621A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808474A (en) * 1970-10-29 1974-04-30 Texas Instruments Inc Semiconductor devices
US3748544A (en) * 1972-02-14 1973-07-24 Plessey Inc Laminated ceramic high-frequency semiconductor package
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US3943556A (en) * 1973-07-30 1976-03-09 Motorola, Inc. Method of making a high frequency semiconductor package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
EP0131004A1 (en) * 1982-12-24 1985-01-16 Plessey Overseas Limited Microwave packages
JPS6092829U (ja) * 1983-11-30 1985-06-25 アルプス電気株式会社 マイクロ波トランジスタの取付構造体
US6335863B1 (en) 1998-01-16 2002-01-01 Sumitomo Electric Industries, Ltd. Package for semiconductors, and semiconductor module that employs the package
US6933443B2 (en) * 2004-01-28 2005-08-23 Infineon Technologies North America Corp. Method for bonding ceramic to copper, without creating a bow in the copper
CN101627450B (zh) * 2007-03-08 2013-10-30 日本电气株式会社 电容元件、印刷布线板、半导体封装以及半导体电路
JP7782228B2 (ja) * 2021-11-29 2025-12-09 日本電気株式会社 サンプルホルダおよび超伝導量子計算機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387190A (en) * 1965-08-19 1968-06-04 Itt High frequency power transistor having electrodes forming transmission lines
US3449640A (en) * 1967-03-24 1969-06-10 Itt Simplified stacked semiconductor device
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package

Also Published As

Publication number Publication date
GB1352621A (en) 1974-05-08
CA922817A (en) 1973-03-13
DE2147607A1 (de) 1972-03-30
US3641398A (en) 1972-02-08
DE2147607B2 (https=) 1974-08-29
JPS5229591B1 (https=) 1977-08-03

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee