DE2147607B2 - - Google Patents
Info
- Publication number
- DE2147607B2 DE2147607B2 DE2147607A DE2147607A DE2147607B2 DE 2147607 B2 DE2147607 B2 DE 2147607B2 DE 2147607 A DE2147607 A DE 2147607A DE 2147607 A DE2147607 A DE 2147607A DE 2147607 B2 DE2147607 B2 DE 2147607B2
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7459170A | 1970-09-23 | 1970-09-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2147607A1 DE2147607A1 (de) | 1972-03-30 |
| DE2147607B2 true DE2147607B2 (https=) | 1974-08-29 |
| DE2147607C3 DE2147607C3 (de) | 1975-05-07 |
Family
ID=22120406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2147607A Expired DE2147607C3 (de) | 1970-09-23 | 1971-09-23 | Halbleitereinrichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3641398A (https=) |
| JP (1) | JPS5229591B1 (https=) |
| CA (1) | CA922817A (https=) |
| DE (1) | DE2147607C3 (https=) |
| GB (1) | GB1352621A (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3808474A (en) * | 1970-10-29 | 1974-04-30 | Texas Instruments Inc | Semiconductor devices |
| US3748544A (en) * | 1972-02-14 | 1973-07-24 | Plessey Inc | Laminated ceramic high-frequency semiconductor package |
| US3784884A (en) * | 1972-11-03 | 1974-01-08 | Motorola Inc | Low parasitic microwave package |
| US3943556A (en) * | 1973-07-30 | 1976-03-09 | Motorola, Inc. | Method of making a high frequency semiconductor package |
| JPS5272170A (en) * | 1975-12-12 | 1977-06-16 | Nec Corp | Package for semiconductor elements |
| FR2506075A1 (fr) * | 1981-05-18 | 1982-11-19 | Radiotechnique Compelec | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
| EP0131004A1 (en) * | 1982-12-24 | 1985-01-16 | Plessey Overseas Limited | Microwave packages |
| JPS6092829U (ja) * | 1983-11-30 | 1985-06-25 | アルプス電気株式会社 | マイクロ波トランジスタの取付構造体 |
| US6335863B1 (en) | 1998-01-16 | 2002-01-01 | Sumitomo Electric Industries, Ltd. | Package for semiconductors, and semiconductor module that employs the package |
| US6933443B2 (en) * | 2004-01-28 | 2005-08-23 | Infineon Technologies North America Corp. | Method for bonding ceramic to copper, without creating a bow in the copper |
| CN101627450B (zh) * | 2007-03-08 | 2013-10-30 | 日本电气株式会社 | 电容元件、印刷布线板、半导体封装以及半导体电路 |
| JP7782228B2 (ja) * | 2021-11-29 | 2025-12-09 | 日本電気株式会社 | サンプルホルダおよび超伝導量子計算機 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3387190A (en) * | 1965-08-19 | 1968-06-04 | Itt | High frequency power transistor having electrodes forming transmission lines |
| US3449640A (en) * | 1967-03-24 | 1969-06-10 | Itt | Simplified stacked semiconductor device |
| US3478161A (en) * | 1968-03-13 | 1969-11-11 | Rca Corp | Strip-line power transistor package |
-
1970
- 1970-09-23 US US74591A patent/US3641398A/en not_active Expired - Lifetime
-
1971
- 1971-07-29 CA CA119481A patent/CA922817A/en not_active Expired
- 1971-09-08 GB GB4179671A patent/GB1352621A/en not_active Expired
- 1971-09-22 JP JP46074146A patent/JPS5229591B1/ja active Pending
- 1971-09-23 DE DE2147607A patent/DE2147607C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1352621A (en) | 1974-05-08 |
| CA922817A (en) | 1973-03-13 |
| DE2147607A1 (de) | 1972-03-30 |
| DE2147607C3 (de) | 1975-05-07 |
| US3641398A (en) | 1972-02-08 |
| JPS5229591B1 (https=) | 1977-08-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EHJ | Ceased/non-payment of the annual fee |