GB1352621A - High frequency semiconductor device - Google Patents

High frequency semiconductor device

Info

Publication number
GB1352621A
GB1352621A GB4179671A GB4179671A GB1352621A GB 1352621 A GB1352621 A GB 1352621A GB 4179671 A GB4179671 A GB 4179671A GB 4179671 A GB4179671 A GB 4179671A GB 1352621 A GB1352621 A GB 1352621A
Authority
GB
United Kingdom
Prior art keywords
substrate
electrode
transistor
molybdenum
joints
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4179671A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1352621A publication Critical patent/GB1352621A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB4179671A 1970-09-23 1971-09-08 High frequency semiconductor device Expired GB1352621A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7459170A 1970-09-23 1970-09-23

Publications (1)

Publication Number Publication Date
GB1352621A true GB1352621A (en) 1974-05-08

Family

ID=22120406

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4179671A Expired GB1352621A (en) 1970-09-23 1971-09-08 High frequency semiconductor device

Country Status (5)

Country Link
US (1) US3641398A (https=)
JP (1) JPS5229591B1 (https=)
CA (1) CA922817A (https=)
DE (1) DE2147607C3 (https=)
GB (1) GB1352621A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808474A (en) * 1970-10-29 1974-04-30 Texas Instruments Inc Semiconductor devices
US3748544A (en) * 1972-02-14 1973-07-24 Plessey Inc Laminated ceramic high-frequency semiconductor package
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US3943556A (en) * 1973-07-30 1976-03-09 Motorola, Inc. Method of making a high frequency semiconductor package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
EP0131004A1 (en) * 1982-12-24 1985-01-16 Plessey Overseas Limited Microwave packages
JPS6092829U (ja) * 1983-11-30 1985-06-25 アルプス電気株式会社 マイクロ波トランジスタの取付構造体
US6335863B1 (en) 1998-01-16 2002-01-01 Sumitomo Electric Industries, Ltd. Package for semiconductors, and semiconductor module that employs the package
US6933443B2 (en) * 2004-01-28 2005-08-23 Infineon Technologies North America Corp. Method for bonding ceramic to copper, without creating a bow in the copper
CN101627450B (zh) * 2007-03-08 2013-10-30 日本电气株式会社 电容元件、印刷布线板、半导体封装以及半导体电路
JP7782228B2 (ja) * 2021-11-29 2025-12-09 日本電気株式会社 サンプルホルダおよび超伝導量子計算機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387190A (en) * 1965-08-19 1968-06-04 Itt High frequency power transistor having electrodes forming transmission lines
US3449640A (en) * 1967-03-24 1969-06-10 Itt Simplified stacked semiconductor device
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package

Also Published As

Publication number Publication date
CA922817A (en) 1973-03-13
DE2147607A1 (de) 1972-03-30
DE2147607C3 (de) 1975-05-07
US3641398A (en) 1972-02-08
DE2147607B2 (https=) 1974-08-29
JPS5229591B1 (https=) 1977-08-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee