DE2145647C3 - Verfahren zum Herstellen von Mustern auf einem Substrat - Google Patents

Verfahren zum Herstellen von Mustern auf einem Substrat

Info

Publication number
DE2145647C3
DE2145647C3 DE2145647A DE2145647A DE2145647C3 DE 2145647 C3 DE2145647 C3 DE 2145647C3 DE 2145647 A DE2145647 A DE 2145647A DE 2145647 A DE2145647 A DE 2145647A DE 2145647 C3 DE2145647 C3 DE 2145647C3
Authority
DE
Germany
Prior art keywords
substrate
photoresist
exposed
dirt
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2145647A
Other languages
German (de)
English (en)
Other versions
DE2145647B2 (de
DE2145647A1 (de
Inventor
Gary Lee Christensen
Donald Henry Gittelman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE2145647A1 publication Critical patent/DE2145647A1/de
Publication of DE2145647B2 publication Critical patent/DE2145647B2/de
Application granted granted Critical
Publication of DE2145647C3 publication Critical patent/DE2145647C3/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/949—Energy beam treating radiation resist on semiconductor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE2145647A 1970-09-18 1971-09-13 Verfahren zum Herstellen von Mustern auf einem Substrat Expired DE2145647C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7348670A 1970-09-18 1970-09-18

Publications (3)

Publication Number Publication Date
DE2145647A1 DE2145647A1 (de) 1972-04-20
DE2145647B2 DE2145647B2 (de) 1973-08-02
DE2145647C3 true DE2145647C3 (de) 1974-02-21

Family

ID=22113977

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2145647A Expired DE2145647C3 (de) 1970-09-18 1971-09-13 Verfahren zum Herstellen von Mustern auf einem Substrat

Country Status (9)

Country Link
US (1) US3705055A (https=)
JP (1) JPS5417139B1 (https=)
BE (1) BE772619A (https=)
CA (1) CA944998A (https=)
DE (1) DE2145647C3 (https=)
FR (1) FR2107713A5 (https=)
GB (1) GB1361637A (https=)
IT (1) IT942608B (https=)
NL (1) NL7112810A (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767490A (en) * 1971-06-29 1973-10-23 Ibm Process for etching organic coating layers
GB1513368A (en) * 1974-07-08 1978-06-07 Vickers Ltd Processing of radiation-sensitive members
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
US4115184A (en) * 1975-12-29 1978-09-19 Northern Telecom Limited Method of plasma etching
US4243865A (en) * 1976-05-14 1981-01-06 Data General Corporation Process for treating material in plasma environment
DE2726813C2 (de) * 1976-06-17 1984-02-23 Motorola, Inc., 60196 Schaumburg, Ill. Verfahren zur Herstellung eines mit einem Muster versehenen Substrats
US5024918A (en) * 1976-12-23 1991-06-18 Texas Instruments Incorporated Heat activated dry development of photoresist by means of active oxygen atmosphere
US4092442A (en) * 1976-12-30 1978-05-30 International Business Machines Corporation Method of depositing thin films utilizing a polyimide mask
US4292384A (en) * 1977-09-30 1981-09-29 Horizons Research Incorporated Gaseous plasma developing and etching process employing low voltage DC generation
US4201579A (en) * 1978-06-05 1980-05-06 Motorola, Inc. Method for removing photoresist by hydrogen plasma
US4241165A (en) * 1978-09-05 1980-12-23 Motorola, Inc. Plasma development process for photoresist
US4277321A (en) * 1979-04-23 1981-07-07 Bell Telephone Laboratories, Incorporated Treating multilayer printed wiring boards
US4307178A (en) * 1980-04-30 1981-12-22 International Business Machines Corporation Plasma develoment of resists
US4509162A (en) * 1980-10-28 1985-04-02 Quixote Corporation High density recording medium
US4536271A (en) * 1983-12-29 1985-08-20 Mobil Oil Corporation Method of plasma treating a polymer film to change its properties
JPS62129846A (ja) * 1985-12-02 1987-06-12 Dainippon Screen Mfg Co Ltd フオトレジストの塗布方法及び塗布装置
US4749640A (en) * 1986-09-02 1988-06-07 Monsanto Company Integrated circuit manufacturing process
US5049408A (en) * 1989-11-07 1991-09-17 Gte Laboratories Incorporated Method for coating phosphor particles using aluminum isopropoxide precursors and an isothermal fluidized bed
US4999219A (en) * 1989-11-07 1991-03-12 Gte Laboratories Incorporated Method for coating phosphor particles using aluminum isopropoxide precursors and an isothermal fluidized bed
US5198634A (en) * 1990-05-21 1993-03-30 Mattson Brad S Plasma contamination removal process
US8029105B2 (en) * 2007-10-17 2011-10-04 Eastman Kodak Company Ambient plasma treatment of printer components

Also Published As

Publication number Publication date
IT942608B (it) 1973-04-02
CA944998A (en) 1974-04-09
GB1361637A (en) 1974-07-30
DE2145647B2 (de) 1973-08-02
US3705055A (en) 1972-12-05
BE772619A (fr) 1972-01-17
DE2145647A1 (de) 1972-04-20
FR2107713A5 (https=) 1972-05-05
NL7112810A (https=) 1972-03-21
JPS5417139B1 (https=) 1979-06-27

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977