DE2047458A1 - Selbstjustierender Kontaktierungs rahmen - Google Patents
Selbstjustierender Kontaktierungs rahmenInfo
- Publication number
- DE2047458A1 DE2047458A1 DE19702047458 DE2047458A DE2047458A1 DE 2047458 A1 DE2047458 A1 DE 2047458A1 DE 19702047458 DE19702047458 DE 19702047458 DE 2047458 A DE2047458 A DE 2047458A DE 2047458 A1 DE2047458 A1 DE 2047458A1
- Authority
- DE
- Germany
- Prior art keywords
- central axis
- frame
- self
- substrate
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005524 ceramic coating Methods 0.000 claims 1
- 229910000464 lead oxide Inorganic materials 0.000 claims 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000006060 molten glass Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86196669A | 1969-09-29 | 1969-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2047458A1 true DE2047458A1 (de) | 1971-04-08 |
Family
ID=25337244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19702047458 Pending DE2047458A1 (de) | 1969-09-29 | 1970-09-26 | Selbstjustierender Kontaktierungs rahmen |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2047458A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2062766A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1258870A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2631904A1 (de) * | 1975-07-15 | 1977-02-10 | Allegheny Ludlum Ind Inc | Zuleitungsstreifen fuer integrierte schaltungsplatten und verfahren zu dessen herstellung |
| FR2486307A1 (fr) * | 1980-07-02 | 1982-01-08 | Fairchild Camera Instr Co | Embase du genre boitier ou support pour microplaquette a semi-conducteurs |
| EP0104051A3 (en) * | 1982-09-22 | 1985-09-18 | Fujitsu Limited | Noise protection for a packaged semiconductor device |
-
1970
- 1970-09-24 GB GB1258870D patent/GB1258870A/en not_active Expired
- 1970-09-26 DE DE19702047458 patent/DE2047458A1/de active Pending
- 1970-09-29 FR FR7035115A patent/FR2062766A5/fr not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2631904A1 (de) * | 1975-07-15 | 1977-02-10 | Allegheny Ludlum Ind Inc | Zuleitungsstreifen fuer integrierte schaltungsplatten und verfahren zu dessen herstellung |
| FR2486307A1 (fr) * | 1980-07-02 | 1982-01-08 | Fairchild Camera Instr Co | Embase du genre boitier ou support pour microplaquette a semi-conducteurs |
| EP0104051A3 (en) * | 1982-09-22 | 1985-09-18 | Fujitsu Limited | Noise protection for a packaged semiconductor device |
| US4598307A (en) * | 1982-09-22 | 1986-07-01 | Fujitsu Limited | Integrated circuit device having package with bypass capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2062766A5 (enrdf_load_stackoverflow) | 1971-06-25 |
| GB1258870A (enrdf_load_stackoverflow) | 1971-12-30 |
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