DE19983376T1 - Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen - Google Patents

Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen

Info

Publication number
DE19983376T1
DE19983376T1 DE19983376T DE19983376T DE19983376T1 DE 19983376 T1 DE19983376 T1 DE 19983376T1 DE 19983376 T DE19983376 T DE 19983376T DE 19983376 T DE19983376 T DE 19983376T DE 19983376 T1 DE19983376 T1 DE 19983376T1
Authority
DE
Germany
Prior art keywords
liquid
electronic components
wide range
temperature change
quick response
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19983376T
Other languages
German (de)
English (en)
Inventor
Mark F Malinoski
Thomas P Jones
Brian Annis
Jonathan E Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Design Inc
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Publication of DE19983376T1 publication Critical patent/DE19983376T1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Control Of Temperature (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19983376T 1998-07-14 1999-07-14 Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen Ceased DE19983376T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9271598P 1998-07-14 1998-07-14
PCT/US1999/015848 WO2000004396A1 (en) 1998-07-14 1999-07-14 Apparatus, method and system of liquid-based, wide range, fast response temperature cycling control of electronic devices

Publications (1)

Publication Number Publication Date
DE19983376T1 true DE19983376T1 (de) 2001-06-28

Family

ID=22234720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983376T Ceased DE19983376T1 (de) 1998-07-14 1999-07-14 Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen

Country Status (6)

Country Link
US (4) US6389225B1 (enExample)
JP (1) JP5000803B2 (enExample)
KR (1) KR100681981B1 (enExample)
AU (1) AU4991899A (enExample)
DE (1) DE19983376T1 (enExample)
WO (1) WO2000004396A1 (enExample)

Families Citing this family (154)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6489793B2 (en) * 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6389225B1 (en) * 1998-07-14 2002-05-14 Delta Design, Inc. Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device
US6993418B2 (en) * 1999-03-16 2006-01-31 Sigma Systems Corporation Method and apparatus for latent temperature control for a device under test
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
JP2002033362A (ja) * 2000-07-17 2002-01-31 Matsushita Electric Ind Co Ltd 半導体検査装置
EP1312106A1 (en) * 2000-07-21 2003-05-21 Temptronic Corporation Temperature-controlled thermal platform for automated testing
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US7225864B2 (en) * 2001-02-08 2007-06-05 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
US7069984B2 (en) * 2001-02-08 2006-07-04 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
US6577146B2 (en) * 2001-04-25 2003-06-10 International Business Machines Corporation Method of burning in an integrated circuit chip package
JP4119104B2 (ja) * 2001-07-12 2008-07-16 株式会社アドバンテスト ヒータ付プッシャ、電子部品ハンドリング装置および電子部品の温度制御方法
CN1568432A (zh) * 2001-08-13 2005-01-19 霍尼韦尔国际公司 使用沟槽为晶片承载的半导体器件提供电流控制
US7700379B2 (en) * 2001-08-13 2010-04-20 Finisar Corporation Methods of conducting wafer level burn-in of electronic devices
US8039277B2 (en) * 2001-08-13 2011-10-18 Finisar Corporation Providing current control over wafer borne semiconductor devices using overlayer patterns
EP1432546A4 (en) 2001-08-31 2006-06-07 Cascade Microtech Inc OPTICAL TESTING APPARATUS
AU2002259063A1 (en) * 2001-09-27 2003-04-07 Advanced Micro Devices, Inc. Method and apparatus for temperature control of a device during testing
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6951846B2 (en) * 2002-03-07 2005-10-04 The United States Of America As Represented By The Secretary Of The Army Artemisinins with improved stability and bioavailability for therapeutic drug development and application
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US6825681B2 (en) * 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6889509B1 (en) 2002-09-13 2005-05-10 Isothermal Systems Research Inc. Coolant recovery system
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
US6857283B2 (en) 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
JP4659328B2 (ja) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US6906924B2 (en) * 2003-05-16 2005-06-14 Hewlett-Packard Development Company, L.P. Temperature-controlled rework system
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US20040264519A1 (en) * 2003-06-24 2004-12-30 Morrell John Alan Filter bypass method and system for chiller loop to control purity levels
WO2005017543A1 (ja) * 2003-08-18 2005-02-24 Advantest Corporation 温度制御装置及び温度制御方法
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7355428B2 (en) * 2004-01-14 2008-04-08 Delta Design, Inc. Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
DE202005021434U1 (de) 2004-06-07 2008-03-20 Cascade Microtech, Inc., Beaverton Thermooptische Einspannvorrichtung
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
US7788939B2 (en) * 2004-07-15 2010-09-07 Parker-Hannifin Corporation Azeotrope spray cooling system
WO2006076315A1 (en) * 2005-01-14 2006-07-20 Delta Design, Inc. Heat sink pedestal with interface medium chamber
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
JP2008537322A (ja) * 2005-03-04 2008-09-11 テンプトロニック コーポレイション チャックシステムにおける温度制御のための装置および方法
US20070294047A1 (en) * 2005-06-11 2007-12-20 Leonard Hayden Calibration system
US20070030019A1 (en) * 2005-08-04 2007-02-08 Micron Technology, Inc. Power sink for IC temperature control
JP2007042958A (ja) * 2005-08-05 2007-02-15 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP4315141B2 (ja) 2005-09-09 2009-08-19 セイコーエプソン株式会社 電子部品の温度制御装置並びにハンドラ装置
US20070132471A1 (en) * 2005-12-13 2007-06-14 Carlson Gregory F Method and apparatus for testing integrated circuits over a range of temperatures
US8025097B2 (en) * 2006-05-18 2011-09-27 Centipede Systems, Inc. Method and apparatus for setting and controlling temperature
US7930814B2 (en) * 2006-07-26 2011-04-26 Raytheon Company Manufacturing method for a septum polarizer
US7557328B2 (en) * 2006-09-25 2009-07-07 Tokyo Electron Limited High rate method for stable temperature control of a substrate
US7589520B2 (en) * 2006-12-05 2009-09-15 Delta Design, Inc. Soak profiling
US8151872B2 (en) 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
US8785823B2 (en) * 2007-07-11 2014-07-22 International Business Machines Corporation Extending the operating temperature range of high power devices
KR101047832B1 (ko) * 2007-07-30 2011-07-08 가부시키가이샤 아드반테스트 전자 디바이스의 온도제어장치 및 온도제어방법
JP4947467B2 (ja) * 2007-09-21 2012-06-06 株式会社アドバンテスト 電子部品試験装置および電子部品の試験方法
DE102007047679B4 (de) * 2007-10-05 2011-03-10 Multitest Elektronische Systeme Gmbh Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's, mit Wärmeleitkörper
DE102007047740B4 (de) * 2007-10-05 2010-11-04 Multitest Elektronische Systeme Gmbh Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8117480B2 (en) * 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US20090262455A1 (en) * 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US7830164B2 (en) * 2008-04-22 2010-11-09 Honeywell International Inc. Ducted test socket
WO2009148942A2 (en) 2008-06-03 2009-12-10 Teradyne, Inc. Processing storage devices
US8087823B2 (en) * 2008-08-18 2012-01-03 International Business Machines Corporation Method for monitoring thermal control
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8275483B2 (en) * 2009-07-23 2012-09-25 Siemens Industry, Inc. Demand flow pumping
DE102009045291A1 (de) * 2009-10-02 2011-04-07 Ers Electronic Gmbh Vorrichtung zur Konditionierung von Halbleiterchips und Testverfahren unter Verwendung der Vorrichtung
US9383406B2 (en) 2009-11-30 2016-07-05 Essai, Inc. Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
US20110127254A1 (en) * 2009-11-30 2011-06-02 Cypress Technology Llc Electric Heating Systems and Associated Methods
CN102822060B (zh) 2010-01-28 2015-07-22 艾利丹尼森公司 标签施加带系统
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
CN102539946A (zh) * 2010-12-23 2012-07-04 思达科技股份有限公司 测试设备
US8700221B2 (en) 2010-12-30 2014-04-15 Fluid Handling Llc Method and apparatus for pump control using varying equivalent system characteristic curve, AKA an adaptive control curve
WO2013064865A1 (en) * 2011-11-04 2013-05-10 Freescale Semiconductor, Inc. Method of controlling a thermal budget of an integrated circuit device, an integrated circuit, a thermal control module and an electronic device therefor
CN103162979B (zh) * 2011-12-08 2015-08-05 英业达股份有限公司 测试液冷式热交换器的方法
EP2791750B1 (en) 2011-12-16 2020-05-06 Fluid Handling LLC. Dynamic linear control methods and apparatus for variable speed pump control
US9927190B2 (en) * 2012-01-12 2018-03-27 Lacon Systems Ltd. Method of controlling a chiller
CN102590679B (zh) * 2012-02-29 2014-06-04 华为技术有限公司 一种温变试验装置
TWI460446B (zh) * 2012-09-28 2014-11-11 Via Tech Inc 晶片測試方法及測試夾頭
KR20140065507A (ko) * 2012-11-15 2014-05-30 삼성전기주식회사 반도체 소자의 시험 장치 및 반도체 소자의 시험 방법
BR112015011894A2 (pt) * 2012-12-21 2017-07-11 Ericsson Telefon Ab L M módulo de carga eletrônica e método e sistema para o mesmo
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US9047060B2 (en) * 2013-08-16 2015-06-02 Adlink Technology Inc. Heating element and circuit module stack structure
US9766287B2 (en) * 2014-10-22 2017-09-19 Teradyne, Inc. Thermal control
WO2016069800A1 (en) * 2014-10-28 2016-05-06 Essai, Inc. Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
DE112015005925B4 (de) 2015-02-23 2023-06-15 Hitachi High-Tech Corporation Nucleinsäure-Analysator
WO2017015052A1 (en) 2015-07-21 2017-01-26 Delta Design, Inc. Continuous fluidic thermal interface material dispensing
US9841459B2 (en) * 2015-10-26 2017-12-12 Test21 Taiwan Co., Ltd. Device and method for controlling IC temperature
US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
US11280827B2 (en) * 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
US10126359B2 (en) * 2017-01-12 2018-11-13 Sensata Technologies Free piston stirling cooler temperature control system for semiconductor test
US10677842B2 (en) 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10514416B2 (en) 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
JP2021508061A (ja) 2017-12-19 2021-02-25 ボストン・セミ・イクイップメント, エルエルシーBoston Semi Equipment, Llc キットを用いないピックアンドプレースハンドラ
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
CN110187726B (zh) * 2019-05-17 2020-08-18 安徽京仪自动化装备技术有限公司 一种用于半导体温控装置的温度控制算法
DE102019128942A1 (de) * 2019-10-28 2021-04-29 Infineon Technologies Ag Prober mit Kühlmechanismus zum direkten Kühlen einer zu prüfenden Vorrichtung
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
DE102021101240A1 (de) * 2021-01-21 2022-07-21 TDK Europe GmbH Testvorrichtung und Verfahren zum Betrieb der Testvorrichtung
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
US11480593B1 (en) * 2021-07-30 2022-10-25 Rohde & Schwarz Gmbh & Co. Kg Measurement system and method of determining an energy usage parameter of an electronic device under test
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
KR20250137115A (ko) 2022-10-21 2025-09-17 에이이엠 홀딩스 리미티드 영역들의 독립적인 제어를 위한 서멀 헤드
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US12085609B1 (en) * 2023-08-23 2024-09-10 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12013432B1 (en) 2023-08-23 2024-06-18 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12000885B1 (en) 2023-12-20 2024-06-04 Aem Singapore Pte. Ltd. Multiplexed thermal control wafer and coldplate

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710251A (en) * 1971-04-07 1973-01-09 Collins Radio Co Microelectric heat exchanger pedestal
US3922527A (en) 1974-12-26 1975-11-25 Nat Forge Co Temperature control apparatus
US3971876A (en) 1974-12-26 1976-07-27 National Forge Company Temperature control apparatus
US4324285A (en) 1979-03-12 1982-04-13 Martin Marietta Corporation Apparatus for heating and cooling devices under test
US4330809A (en) 1979-12-31 1982-05-18 Crown International, Inc. Thermal protection circuit for the die of a transistor
DE3263256D1 (en) 1981-07-08 1985-05-30 Fujitsu Ltd Device for testing semiconductor devices at a high temperature
US4637020A (en) 1983-08-01 1987-01-13 Fairchild Semiconductor Corporation Method and apparatus for monitoring automated testing of electronic circuits
US4744408A (en) 1984-11-30 1988-05-17 Herzog-Hart Corporation Temperature control method and apparatus
US4686627A (en) 1984-12-24 1987-08-11 Honeywell Inc. Electrical test apparatus
US4734872A (en) 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
DE3683284D1 (de) 1985-09-23 1992-02-13 Sharetree Systems Ltd Ofen zum einbrennen integrierter schaltungen.
US4777434A (en) 1985-10-03 1988-10-11 Amp Incorporated Microelectronic burn-in system
DE3536098A1 (de) 1985-10-09 1987-04-09 Siemens Ag Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements
US4784213A (en) 1986-04-08 1988-11-15 Temptronic Corporation Mixing valve air source
US4713612A (en) 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
US5084671A (en) 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
BE1000697A6 (fr) 1987-10-28 1989-03-14 Irish Transformers Ltd Appareil pour tester des circuits electriques integres.
US4870355A (en) 1988-01-11 1989-09-26 Thermonics Incorporated Thermal fixture for testing integrated circuits
US4926118A (en) 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
JPH02304378A (ja) * 1989-05-18 1990-12-18 Fujitsu Ltd バーンイン装置
US5099908A (en) 1989-07-13 1992-03-31 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5297621A (en) 1989-07-13 1994-03-29 American Electronic Analysis Method and apparatus for maintaining electrically operating device temperatures
US5309090A (en) 1990-09-06 1994-05-03 Lipp Robert J Apparatus for heating and controlling temperature in an integrated circuit chip
JP2544015Y2 (ja) 1990-10-15 1997-08-13 株式会社アドバンテスト Ｉｃ試験装置
JP2547022Y2 (ja) 1990-10-12 1997-09-03 株式会社アドバンテスト Ｉｃ試験装置
US5263775A (en) 1991-02-01 1993-11-23 Aetrium, Inc. Apparatus for handling devices under varying temperatures
US5143450A (en) 1991-02-01 1992-09-01 Aetrium, Inc. Apparatus for handling devices under varying temperatures
JPH04328476A (ja) 1991-04-30 1992-11-17 Toshiba Corp Ｌｓｉ
US5126656A (en) 1991-05-31 1992-06-30 Ej Systems, Inc. Burn-in tower
US5164661A (en) 1991-05-31 1992-11-17 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
CA2073886A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
CA2073899A1 (en) 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
US5210485A (en) 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
GB2258356B (en) 1991-07-31 1995-02-22 Metron Designs Ltd Method and apparatus for conditioning an electronic component having a characteristic subject to variation with temperature
US5233161A (en) 1991-10-31 1993-08-03 Hughes Aircraft Company Method for self regulating CMOS digital microcircuit burn-in without ovens
US5324916A (en) 1991-11-01 1994-06-28 Hewlett-Packard Company System and method for dynamic power compensation
US5457400A (en) 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
US5266778A (en) 1992-05-29 1993-11-30 Hollister, Inc. Dynamic temperature control for use with a heating and/or cooling system including at least one temperature sensor
US5205132A (en) 1992-06-12 1993-04-27 Thermonics Incorporated Computer-implemented method and system for precise temperature control of a device under test
US5287292A (en) 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
US5420521A (en) * 1992-10-27 1995-05-30 Ej Systems, Inc. Burn-in module
JPH06225904A (ja) * 1992-12-10 1994-08-16 Akio Okamoto 眼球角膜冷却手術装置
KR100291109B1 (ko) 1993-05-31 2001-06-01 히가시 데쓰로 반도체 웨이퍼의 버언 인 검사기능을 구비한 프로우브 검사 및 리페어장치, 및 반도체 웨이퍼의 버언 인 검사장치
US5420520A (en) 1993-06-11 1995-05-30 International Business Machines Corporation Method and apparatus for testing of integrated circuit chips
JPH07113841A (ja) * 1993-10-15 1995-05-02 Hitachi Ltd 温度サイクル試験方法及びその実施装置
JP2606602B2 (ja) * 1993-11-30 1997-05-07 日本電気株式会社 冷却試験装置
US5510723A (en) 1994-03-01 1996-04-23 Micron Custom Manufacturing, Inc. Usa Diced semiconductor device handler
JP2998557B2 (ja) * 1994-03-24 2000-01-11 日立電子エンジニアリング株式会社 恒温槽の常温コントロール装置
US5552744A (en) 1994-08-11 1996-09-03 Ltx Corporation High speed IDDQ monitor circuit
US5582235A (en) 1994-08-11 1996-12-10 Micro Control Company Temperature regulator for burn-in board components
JP2986381B2 (ja) 1994-08-16 1999-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子チップ温度制御装置及び方法
JPH08203866A (ja) * 1995-01-23 1996-08-09 Sony Corp 低温処理装置およびこれを用いた低温処理方法
JPH08304509A (ja) 1995-04-28 1996-11-22 Advantest Corp 半導体試験装置
JPH08334545A (ja) * 1995-06-07 1996-12-17 Hitachi Ltd 半導体装置の測定装置
WO1997014762A1 (en) * 1995-10-20 1997-04-24 Minnesota Mining And Manufacturing Company Hydrofluoroethers as low temperature refrigerants
US5847293A (en) 1995-12-04 1998-12-08 Aetrium Incorporated Test handler for DUT's
JP2935344B2 (ja) * 1996-04-24 1999-08-16 日本電気株式会社 光半導体素子の温度特性試験装置
WO1998005060A1 (en) 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing
JPH10135315A (ja) * 1996-10-29 1998-05-22 Tokyo Electron Ltd 試料載置台の温度制御装置及び検査装置
JP3454647B2 (ja) * 1996-11-07 2003-10-06 東芝キヤリア株式会社 空気調和機
US5911897A (en) 1997-01-13 1999-06-15 Micro Control Company Temperature control for high power burn-in for integrated circuits
DE19700839C2 (de) 1997-01-13 2000-06-08 Siemens Ag Chuckanordnung
US5821505A (en) 1997-04-04 1998-10-13 Unisys Corporation Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
US5844208A (en) 1997-04-04 1998-12-01 Unisys Corporation Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
US5864176A (en) 1997-04-04 1999-01-26 Unisys Corporation Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces
US6389225B1 (en) * 1998-07-14 2002-05-14 Delta Design, Inc. Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device

Also Published As

Publication number Publication date
US6498899B2 (en) 2002-12-24
KR100681981B1 (ko) 2007-02-15
US20030047305A1 (en) 2003-03-13
US6389225B1 (en) 2002-05-14
JP2002520622A (ja) 2002-07-09
JP5000803B2 (ja) 2012-08-15
AU4991899A (en) 2000-02-07
WO2000004396A1 (en) 2000-01-27
US6549026B1 (en) 2003-04-15
US20020033391A1 (en) 2002-03-21
KR20010071916A (ko) 2001-07-31
US6862405B2 (en) 2005-03-01

Similar Documents

Publication Publication Date Title
DE19983376T1 (de) Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen
DE69629297D1 (de) Verfahren und vorrichtung zur thermischen konditionierung von substraten mit passivem gas
DE59910320D1 (de) Verfahren und Vorrichtung zur Messung einer Zustandsgrösse
DE60028319D1 (de) System und Verfahren zur Kommunikation mit einer integrierten Schaltung
DE69435097D1 (de) Verfahren und Vorrichtung für Temperaturmessung mit Nutzung der Infrarottechnik
DE60034032D1 (de) Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten
DE69826527D1 (de) Vorrichtung zur komplettierung einer unterirdischen bohrung und verfahren zu deren verwendung
DE69421546D1 (de) Verfahren und vorrichtung zum kalibrieren einer verstarkungsschaltung
DE69607532D1 (de) Verfahren und Vorrichtung zur Leistungsüberwachung einer Lasersenderanordnung
DE59811093D1 (de) Verfahren und schaltung zur funktionsüberwachung einer sensorbrücke
DE69419305D1 (de) Verfahren und Vorrichtung zur Kontrolle der Winkelabweichung einer optischen Sensoranordnung
DE69533308D1 (de) Verfahren und zugehöriger Schaltkreis zur Feststellung einer Schaltungsunterbrechung
DE69734582D1 (de) Druckempfindlicher klebstoff mit ausgezeichneter wärmebeständigkeit und wärmeleitfähigkeit, klebstoffschichten und verfahren zur sicherung von elektronischen komponenten gegen wärmeausstrahlende komponenten unter verwendung desselben
DE69724138D1 (de) Gerät und dazugehöriges verfahren zur kalibrierung einer vorrichtung
DE59712178D1 (de) Verfahren und Vorrichtung zum Messen der Temperatur an einer Kochstelle mit einem Leiterbahntemperatursensor
DE69932787D1 (de) Elektronische Vorrichtung und Verfahren zur Steuerung von Versorgungsspannung einer elektronischen Vorrichtung
DE60333056D1 (de) Vorrichtung und Verfahren zur Akkommodation der Fehlfunktion einer Schubsteuerungsvorrichtung
DE59809907D1 (de) Verfahren und Vorrichtung zur Erkennung und Korrektur einer Faserorientierungs-Querprofil-Veränderung
DE60133478D1 (de) Verfahren und vorrichtung zur versorgung von spritzeinrichtungen und spritzanlage mit einer solchen vorrichtung
DE59001260D1 (de) Verfahren und vorrichtung zur ueberpruefung der funktionsfaehigkeit einer abgassondenheizung und deren zuleitungssystem.
DE69919463D1 (de) Verfahren und Vorrichtung zur Kontrolle einer Vielzahl von Heizelementen einer Fixiervorrichtung
DE60014566D1 (de) Vorrichtung und Verfahren zur Steuerung der Geschwindigkeit für ein Kuvertiersystem
DE69900310D1 (de) Verfahren zur Anordnung der Leitungsführung einer zentralen Taktgeberschaltung auf einem integrierten Schaltkreis sowie zugehörige Vorrichtungen
DE69411778D1 (de) Verfahren und Vorrichtung zur Messung einer Temperaturverteilung
DE4496920T1 (de) Verfahren und Vorrichtung zur Übergabe von Netzwerkbauteilsfunktionen zwischen Netzwerkbauteilen

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: DELTA DESIGN,INC., POWAY, CALIF., US

8110 Request for examination paragraph 44
8131 Rejection