DE19544721C1 - Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor - Google Patents

Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor

Info

Publication number
DE19544721C1
DE19544721C1 DE19544721A DE19544721A DE19544721C1 DE 19544721 C1 DE19544721 C1 DE 19544721C1 DE 19544721 A DE19544721 A DE 19544721A DE 19544721 A DE19544721 A DE 19544721A DE 19544721 C1 DE19544721 C1 DE 19544721C1
Authority
DE
Germany
Prior art keywords
layer
electrode layer
gate
structured
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19544721A
Other languages
German (de)
English (en)
Inventor
Udo Dipl Phys Dr Schwalke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19544721A priority Critical patent/DE19544721C1/de
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT96945866T priority patent/ATE206558T1/de
Priority to KR10-1998-0703763A priority patent/KR100395973B1/ko
Priority to DE59607846T priority patent/DE59607846D1/de
Priority to EP96945866A priority patent/EP0864172B1/de
Priority to PCT/DE1996/002121 priority patent/WO1997020336A2/de
Priority to US09/077,476 priority patent/US6037196A/en
Priority to JP9520052A priority patent/JP2000501237A/ja
Priority to TW085113940A priority patent/TW313699B/zh
Application granted granted Critical
Publication of DE19544721C1 publication Critical patent/DE19544721C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
    • H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE19544721A 1995-11-30 1995-11-30 Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor Expired - Fee Related DE19544721C1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19544721A DE19544721C1 (de) 1995-11-30 1995-11-30 Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor
KR10-1998-0703763A KR100395973B1 (ko) 1995-11-30 1996-11-07 적어도하나이상의mos트랜지스터를가진집적회로장치를제조하기위한방법
DE59607846T DE59607846D1 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos-transistor
EP96945866A EP0864172B1 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos-transistor
AT96945866T ATE206558T1 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos- transistor
PCT/DE1996/002121 WO1997020336A2 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos-transistor
US09/077,476 US6037196A (en) 1995-11-30 1996-11-07 Process for producing an integrated circuit device with at least one MOS transistor
JP9520052A JP2000501237A (ja) 1995-11-30 1996-11-07 少なくとも１個のｍｏｓトランジスタを有する集積回路装置の製造方法
TW085113940A TW313699B (bg) 1995-11-30 1996-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19544721A DE19544721C1 (de) 1995-11-30 1995-11-30 Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor

Publications (1)

Publication Number Publication Date
DE19544721C1 true DE19544721C1 (de) 1997-04-30

Family

ID=7778860

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19544721A Expired - Fee Related DE19544721C1 (de) 1995-11-30 1995-11-30 Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit mindestens einem MOS-Transistor
DE59607846T Expired - Lifetime DE59607846D1 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos-transistor

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59607846T Expired - Lifetime DE59607846D1 (de) 1995-11-30 1996-11-07 Verfahren zur herstellung einer integrierten schaltungsanordnung mit mindestens einem mos-transistor

Country Status (8)

Country Link
US (1) US6037196A (bg)
EP (1) EP0864172B1 (bg)
JP (1) JP2000501237A (bg)
KR (1) KR100395973B1 (bg)
AT (1) ATE206558T1 (bg)
DE (2) DE19544721C1 (bg)
TW (1) TW313699B (bg)
WO (1) WO1997020336A2 (bg)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333205B1 (en) * 1999-08-16 2001-12-25 Micron Technology, Inc. CMOS imager with selectively silicided gates
KR100328710B1 (ko) * 1999-08-23 2002-03-20 박종섭 인덕터 및 그의 제조방법
JP4794782B2 (ja) * 2001-09-18 2011-10-19 セイコーインスツル株式会社 電圧検出回路、及び電子機器
US6649457B2 (en) * 2001-09-24 2003-11-18 Sharp Laboratories Of America, Inc. Method for SOI device isolation
JP4193097B2 (ja) * 2002-02-18 2008-12-10 日本電気株式会社 半導体装置およびその製造方法
US6855988B2 (en) * 2002-07-08 2005-02-15 Viciciv Technology Semiconductor switching devices
DE10248723A1 (de) * 2002-10-18 2004-05-06 Infineon Technologies Ag Integrierte Schaltungsanordnung mit Kondensatoren und mit vorzugsweise planaren Transistoren und Herstellungsverfahren
US6913959B2 (en) * 2003-06-23 2005-07-05 Advanced Micro Devices, Inc. Method of manufacturing a semiconductor device having a MESA structure
US7202123B1 (en) 2004-07-02 2007-04-10 Advanced Micro Devices, Inc. Mesa isolation technology for extremely thin silicon-on-insulator semiconductor devices
JP5337380B2 (ja) * 2007-01-26 2013-11-06 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123266A (ja) * 1982-12-28 1984-07-17 Toshiba Corp Ｍｉｓトランジスタ及びその製造方法
US5144390A (en) * 1988-09-02 1992-09-01 Texas Instruments Incorporated Silicon-on insulator transistor with internal body node to source node connection
JP2510710B2 (ja) * 1988-12-13 1996-06-26 三菱電機株式会社 絶縁体基板上の半導体層に形成されたｍｏｓ型電界効果トランジスタ
US5047356A (en) * 1990-02-16 1991-09-10 Hughes Aircraft Company High speed silicon-on-insulator device and process of fabricating same
US5102809A (en) * 1990-10-11 1992-04-07 Texas Instruments Incorporated SOI BICMOS process
US5177028A (en) * 1991-10-22 1993-01-05 Micron Technology, Inc. Trench isolation method having a double polysilicon gate formed on mesas

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
CHOI, J.H., PARK, Y.-J., MIN, H.-S.: Extremely Thin Film (10mm) SOI MOSFET Characteristics Including Inversion Layer to Accumulation layer Tunneling, in: IEDM 94, S. 645-647 *
COLINGE, J.P.: Silicon-On-Insulator Technology: Materials To VLSI, Kluwer Academie Publishers, Boston, Dordrecht, London 1991, S. 94-98 *
GILBERT, P.V., SUN, S.-W.: A Pelox Isolated Sub-0.5 Micron Thin-Film SOI Technology, in: 1995 Symposium on VLSI Technology Digest of Technical Papers, S. 37-38 *
HWANG, J.M., WISE, R., YEE, E., HOUSTON, T., POLLACK, G.B.: Ultra-Thin Film SOI/CMOS With Selective-EPI Source/Drain For Low Series Resistance, High Drive Current, in: 1994 Symposium on VLSI Technology Digest of Technical Papers, S. 33-34 *

Also Published As

Publication number Publication date
EP0864172A2 (de) 1998-09-16
US6037196A (en) 2000-03-14
KR100395973B1 (ko) 2003-10-17
ATE206558T1 (de) 2001-10-15
WO1997020336A3 (de) 1997-08-28
DE59607846D1 (de) 2001-11-08
TW313699B (bg) 1997-08-21
WO1997020336A2 (de) 1997-06-05
JP2000501237A (ja) 2000-02-02
KR19990071491A (ko) 1999-09-27
EP0864172B1 (de) 2001-10-04

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee