DE19530989C1 - Verfahren zum Filmstrippen - Google Patents
Verfahren zum FilmstrippenInfo
- Publication number
- DE19530989C1 DE19530989C1 DE19530989A DE19530989A DE19530989C1 DE 19530989 C1 DE19530989 C1 DE 19530989C1 DE 19530989 A DE19530989 A DE 19530989A DE 19530989 A DE19530989 A DE 19530989A DE 19530989 C1 DE19530989 C1 DE 19530989C1
- Authority
- DE
- Germany
- Prior art keywords
- resist
- solvent
- film
- records
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 81
- 230000008569 process Effects 0.000 title claims abstract description 52
- 239000002904 solvent Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 230000008961 swelling Effects 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 238000011010 flushing procedure Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 239000008237 rinsing water Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 abstract description 19
- 239000002245 particle Substances 0.000 abstract description 3
- 239000002351 wastewater Substances 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 238000001311 chemical methods and process Methods 0.000 abstract 1
- 238000010924 continuous production Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 15
- 239000007921 spray Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000002518 antifoaming agent Substances 0.000 description 4
- 239000004575 stone Substances 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- MQRJBSHKWOFOGF-UHFFFAOYSA-L disodium;carbonate;hydrate Chemical compound O.[Na+].[Na+].[O-]C([O-])=O MQRJBSHKWOFOGF-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 150000004027 organic amino compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Medical Uses (AREA)
- Laminated Bodies (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19530989A DE19530989C1 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Filmstrippen |
| JP50980697A JP4035165B2 (ja) | 1995-08-23 | 1996-08-21 | フィルム剥離方法 |
| ES96929287T ES2135914T3 (es) | 1995-08-23 | 1996-08-21 | Procedimiento para la separacion de films. |
| AT96929287T ATE182694T1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
| US09/011,253 US6059919A (en) | 1995-08-23 | 1996-08-21 | Film-stripping process |
| PCT/EP1996/003662 WO1997008589A1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
| EP96929287A EP0830642B1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
| CA002226520A CA2226520A1 (en) | 1995-08-23 | 1996-08-21 | Method for film stripping |
| DE59602561T DE59602561D1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19530989A DE19530989C1 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Filmstrippen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19530989C1 true DE19530989C1 (de) | 1997-03-13 |
Family
ID=7770176
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19530989A Expired - Fee Related DE19530989C1 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Filmstrippen |
| DE59602561T Expired - Lifetime DE59602561D1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59602561T Expired - Lifetime DE59602561D1 (de) | 1995-08-23 | 1996-08-21 | Verfahren zum filmstrippen |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6059919A (enExample) |
| EP (1) | EP0830642B1 (enExample) |
| JP (1) | JP4035165B2 (enExample) |
| AT (1) | ATE182694T1 (enExample) |
| CA (1) | CA2226520A1 (enExample) |
| DE (2) | DE19530989C1 (enExample) |
| ES (1) | ES2135914T3 (enExample) |
| WO (1) | WO1997008589A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1133506A (ja) | 1997-07-24 | 1999-02-09 | Tadahiro Omi | 流体処理装置及び洗浄処理システム |
| TW464970B (en) * | 1999-04-21 | 2001-11-21 | Sharp Kk | Ultrasonic cleaning device and resist-stripping device |
| JP2002075947A (ja) | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
| JP2006088033A (ja) * | 2004-09-24 | 2006-04-06 | Future Vision:Kk | ウェット処理装置 |
| KR101226514B1 (ko) | 2006-06-22 | 2013-01-25 | 엘지디스플레이 주식회사 | 박막트랜지스터 제조방법 |
| GB0718839D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | method of patterning a mesoporous nano particulate layer |
| GB0718840D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | Method of patterning vapour deposition by printing |
| CN102350860B (zh) * | 2011-07-06 | 2014-04-09 | 奥士康精密电路（惠州）有限公司 | 一种pcb板制备过程中改善油墨入孔的方法 |
| KR101414402B1 (ko) * | 2012-06-05 | 2014-07-01 | 노바테크 (주) | 필름 박리 방법 및 필름 박리 시스템 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3011061A1 (de) * | 1980-03-21 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur intensivierung von spuel- und reinigungsprozessen fuer perforationen in formstuecken in spuel- und reinigungsautomaten |
| DE3201880A1 (de) * | 1982-01-22 | 1983-08-04 | Egbert 6106 Erzhausen Kühnert | Verfahren zum rueckstandsfreien entschichten von leiterplatten und vorrichtung zur durchfuehrung des verfahrens |
| DE3916694A1 (de) * | 1989-05-23 | 1990-11-29 | Schering Ag | Anordnung zur chemischen behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten, sowie dazugehoeriges verfahren |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3450262A (en) * | 1966-12-20 | 1969-06-17 | Gene Hirs | Method of filtering |
| IT1021078B (it) * | 1973-07-12 | 1978-01-30 | Cooper H | Trattamento di fluidi con onde acustiche |
| US3958587A (en) * | 1974-12-19 | 1976-05-25 | Buckbee-Mears Company | Manifold for fluid distribution and removal |
| DE3002732A1 (de) * | 1980-01-25 | 1981-08-13 | Siemens AG, 1000 Berlin und 8000 München | Horizontal-durchlauf-tauchbad |
| US4784169A (en) * | 1984-01-13 | 1988-11-15 | Chemcut Corporation | Apparatus for treating articles with solution to remove solids and then filtering the solution |
| DE8401675U1 (de) * | 1984-01-21 | 1985-10-10 | Theimer, Siegfried, 6484 Birstein | Durchlaufentwicklungsgerät |
| DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
| DE3782205T2 (de) * | 1986-07-23 | 1993-02-25 | Sumitomo Heavy Industries | Behandlung einer photoresistmaterialien enthaltenden abfalloesung. |
| US4810390A (en) * | 1986-10-10 | 1989-03-07 | Ciba-Geigy Corporation | Separation and purification of pigment suspensions and suspensions of pigment intermediates by a membrane separation process |
| US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
| DE8703114U1 (de) * | 1987-02-25 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Einrichtung zur Reinigung oder chemischen Behandlung von Werkstücken |
| US5063951A (en) * | 1990-07-19 | 1991-11-12 | International Business Machines Corporation | Fluid treatment device |
| DE4141403A1 (de) * | 1991-12-16 | 1993-06-17 | Hoechst Ag | Verfahren zum entschichten von lichtvernetzten photoresistschablonen |
| US5294259A (en) * | 1992-05-18 | 1994-03-15 | International Business Machines Corporation | Fluid treatment device |
| JP3320549B2 (ja) * | 1994-04-26 | 2002-09-03 | 岩手東芝エレクトロニクス株式会社 | 被膜除去方法および被膜除去剤 |
| DE4432402C2 (de) * | 1994-08-30 | 1998-07-02 | Ersa Loettechnik Gmbh | Schwall-Lötdüse zum flußmittelfreien Löten |
| JPH09103732A (ja) * | 1995-09-06 | 1997-04-22 | Internatl Business Mach Corp <Ibm> | 流体供給装置 |
-
1995
- 1995-08-23 DE DE19530989A patent/DE19530989C1/de not_active Expired - Fee Related
-
1996
- 1996-08-21 ES ES96929287T patent/ES2135914T3/es not_active Expired - Lifetime
- 1996-08-21 JP JP50980697A patent/JP4035165B2/ja not_active Expired - Lifetime
- 1996-08-21 WO PCT/EP1996/003662 patent/WO1997008589A1/de not_active Ceased
- 1996-08-21 US US09/011,253 patent/US6059919A/en not_active Expired - Lifetime
- 1996-08-21 EP EP96929287A patent/EP0830642B1/de not_active Expired - Lifetime
- 1996-08-21 DE DE59602561T patent/DE59602561D1/de not_active Expired - Lifetime
- 1996-08-21 AT AT96929287T patent/ATE182694T1/de active
- 1996-08-21 CA CA002226520A patent/CA2226520A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3011061A1 (de) * | 1980-03-21 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur intensivierung von spuel- und reinigungsprozessen fuer perforationen in formstuecken in spuel- und reinigungsautomaten |
| DE3201880A1 (de) * | 1982-01-22 | 1983-08-04 | Egbert 6106 Erzhausen Kühnert | Verfahren zum rueckstandsfreien entschichten von leiterplatten und vorrichtung zur durchfuehrung des verfahrens |
| DE3916694A1 (de) * | 1989-05-23 | 1990-11-29 | Schering Ag | Anordnung zur chemischen behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten, sowie dazugehoeriges verfahren |
Non-Patent Citations (1)
| Title |
|---|
| Römpps Chemie-Lexikon, 8. Auflage, Franckh`sche Verlagsbuchhandlung Stuttgart, 1987, S. 3451 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0830642A1 (de) | 1998-03-25 |
| DE59602561D1 (de) | 1999-09-02 |
| EP0830642B1 (de) | 1999-07-28 |
| ES2135914T3 (es) | 1999-11-01 |
| JP2000500242A (ja) | 2000-01-11 |
| ATE182694T1 (de) | 1999-08-15 |
| US6059919A (en) | 2000-05-09 |
| CA2226520A1 (en) | 1997-03-06 |
| WO1997008589A1 (de) | 1997-03-06 |
| JP4035165B2 (ja) | 2008-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of patent without earlier publication of application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |