DE1916554B2 - Verfahren zum Herstellen von Halbleitergleichrichteranordnungen - Google Patents

Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Info

Publication number
DE1916554B2
DE1916554B2 DE1916554A DE1916554A DE1916554B2 DE 1916554 B2 DE1916554 B2 DE 1916554B2 DE 1916554 A DE1916554 A DE 1916554A DE 1916554 A DE1916554 A DE 1916554A DE 1916554 B2 DE1916554 B2 DE 1916554B2
Authority
DE
Germany
Prior art keywords
conductor
semiconductor
structures
parts
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1916554A
Other languages
German (de)
English (en)
Other versions
DE1916554C3 (enExample
DE1916554A1 (de
Inventor
Winfried 8542 Roth Schierz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Priority to DE1916554A priority Critical patent/DE1916554B2/de
Priority to US008996A priority patent/US3916433A/en
Priority to ES377012A priority patent/ES377012A1/es
Priority to BR217351/70A priority patent/BR7017351D0/pt
Priority to FR7011113A priority patent/FR2042218A5/fr
Priority to GB05121/70A priority patent/GB1300334A/en
Priority to CH477470A priority patent/CH522956A/de
Publication of DE1916554A1 publication Critical patent/DE1916554A1/de
Priority to CH1598071A priority patent/CH545005A/de
Priority to US00196291A priority patent/US3783346A/en
Priority to US00375535A priority patent/US3854198A/en
Publication of DE1916554B2 publication Critical patent/DE1916554B2/de
Application granted granted Critical
Publication of DE1916554C3 publication Critical patent/DE1916554C3/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Rectifiers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE1916554A 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen Granted DE1916554B2 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE1916554A DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen
US008996A US3916433A (en) 1969-04-01 1970-02-05 Semiconductor arrangement and method of production
ES377012A ES377012A1 (es) 1969-04-01 1970-02-18 Perfeccionamientos en las disposiciones de semiconductores.
BR217351/70A BR7017351D0 (pt) 1969-04-01 1970-03-10 Dispositivo semicondutor e processo para sua fabricacao
FR7011113A FR2042218A5 (enExample) 1969-04-01 1970-03-27
GB05121/70A GB1300334A (en) 1969-04-01 1970-03-31 Semi-conductor arrangement and method of production
CH477470A CH522956A (de) 1969-04-01 1970-04-01 Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung
CH1598071A CH545005A (de) 1969-04-01 1971-11-03 Halbleiter-Anordnung
US00196291A US3783346A (en) 1969-04-01 1971-11-08 Semiconductor arrangement
US00375535A US3854198A (en) 1969-04-01 1973-07-02 Semiconductor arrangement and method of production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1916554A DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Publications (3)

Publication Number Publication Date
DE1916554A1 DE1916554A1 (de) 1971-02-11
DE1916554B2 true DE1916554B2 (de) 1974-07-04
DE1916554C3 DE1916554C3 (enExample) 1977-08-04

Family

ID=5729950

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1916554A Granted DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Country Status (7)

Country Link
US (1) US3916433A (enExample)
BR (1) BR7017351D0 (enExample)
CH (1) CH522956A (enExample)
DE (1) DE1916554B2 (enExample)
ES (1) ES377012A1 (enExample)
FR (1) FR2042218A5 (enExample)
GB (1) GB1300334A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2278160A1 (fr) * 1974-07-08 1976-02-06 Radiotechnique Compelec Languettes de connexion en forme de peigne pour transistors de puissance
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
DE3245762A1 (de) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement in modulbauweise
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US5761028A (en) * 1996-05-02 1998-06-02 Chrysler Corporation Transistor connection assembly having IGBT (X) cross ties

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting

Also Published As

Publication number Publication date
CH522956A (de) 1972-05-15
GB1300334A (en) 1972-12-20
US3916433A (en) 1975-10-28
ES377012A1 (es) 1972-05-16
FR2042218A5 (enExample) 1971-02-05
BR7017351D0 (pt) 1973-01-16
DE1916554A1 (de) 1971-02-11

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee
BI Miscellaneous see part 2