FR2278160A1 - Languettes de connexion en forme de peigne pour transistors de puissance - Google Patents

Languettes de connexion en forme de peigne pour transistors de puissance

Info

Publication number
FR2278160A1
FR2278160A1 FR7423644A FR7423644A FR2278160A1 FR 2278160 A1 FR2278160 A1 FR 2278160A1 FR 7423644 A FR7423644 A FR 7423644A FR 7423644 A FR7423644 A FR 7423644A FR 2278160 A1 FR2278160 A1 FR 2278160A1
Authority
FR
France
Prior art keywords
power transistors
shaped connection
connection tabs
comb shaped
comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7423644A
Other languages
English (en)
Other versions
FR2278160B1 (fr
Inventor
Bernard Roger
Michel Ayel
Francis Debar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7423644A priority Critical patent/FR2278160A1/fr
Priority to US05/590,439 priority patent/US4013337A/en
Priority to CA230,653A priority patent/CA1038087A/fr
Priority to GB28274/75A priority patent/GB1511158A/en
Priority to JP8285075A priority patent/JPS5712294B2/ja
Priority to DE19752530348 priority patent/DE2530348A1/de
Publication of FR2278160A1 publication Critical patent/FR2278160A1/fr
Application granted granted Critical
Publication of FR2278160B1 publication Critical patent/FR2278160B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Die Bonding (AREA)
FR7423644A 1974-07-08 1974-07-08 Languettes de connexion en forme de peigne pour transistors de puissance Granted FR2278160A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR7423644A FR2278160A1 (fr) 1974-07-08 1974-07-08 Languettes de connexion en forme de peigne pour transistors de puissance
US05/590,439 US4013337A (en) 1974-07-08 1975-06-26 Connection lugs in the form of a comb for power transistors
CA230,653A CA1038087A (fr) 1974-07-08 1975-07-03 Broches de raccordement en forme de peigne pour transistors de puissance
GB28274/75A GB1511158A (en) 1974-07-08 1975-07-04 Connection means for semiconductor devices
JP8285075A JPS5712294B2 (fr) 1974-07-08 1975-07-07
DE19752530348 DE2530348A1 (de) 1974-07-08 1975-07-08 Verbindungszungen in form eines kammes fuer leistungstransistoren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7423644A FR2278160A1 (fr) 1974-07-08 1974-07-08 Languettes de connexion en forme de peigne pour transistors de puissance

Publications (2)

Publication Number Publication Date
FR2278160A1 true FR2278160A1 (fr) 1976-02-06
FR2278160B1 FR2278160B1 (fr) 1980-07-25

Family

ID=9141004

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7423644A Granted FR2278160A1 (fr) 1974-07-08 1974-07-08 Languettes de connexion en forme de peigne pour transistors de puissance

Country Status (6)

Country Link
US (1) US4013337A (fr)
JP (1) JPS5712294B2 (fr)
CA (1) CA1038087A (fr)
DE (1) DE2530348A1 (fr)
FR (1) FR2278160A1 (fr)
GB (1) GB1511158A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042398U (ja) * 1983-09-01 1985-03-25 鹿島建設株式会社 汚水処理材
US6179047B1 (en) * 1998-12-10 2001-01-30 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2830698A (en) * 1955-04-25 1958-04-15 Erie Resistor Corp Condenser
US2985704A (en) * 1957-05-02 1961-05-23 Hamilton Watch Co Battery clip
US2985705A (en) * 1957-10-23 1961-05-23 Hamilton Watch Co Battery clip
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
DE1916554B2 (de) * 1969-04-01 1974-07-04 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Also Published As

Publication number Publication date
CA1038087A (fr) 1978-09-05
JPS5140076A (fr) 1976-04-03
US4013337A (en) 1977-03-22
FR2278160B1 (fr) 1980-07-25
JPS5712294B2 (fr) 1982-03-10
GB1511158A (en) 1978-05-17
DE2530348A1 (de) 1976-01-22

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Legal Events

Date Code Title Description
ST Notification of lapse