CH522956A - Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung - Google Patents

Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung

Info

Publication number
CH522956A
CH522956A CH477470A CH477470A CH522956A CH 522956 A CH522956 A CH 522956A CH 477470 A CH477470 A CH 477470A CH 477470 A CH477470 A CH 477470A CH 522956 A CH522956 A CH 522956A
Authority
CH
Switzerland
Prior art keywords
semiconductor
production
arrangements
arrangement produced
semiconductor arrangement
Prior art date
Application number
CH477470A
Other languages
English (en)
Inventor
Schierz Winfried
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH522956A publication Critical patent/CH522956A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Rectifiers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CH477470A 1969-04-01 1970-04-01 Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung CH522956A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1916554A DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Publications (1)

Publication Number Publication Date
CH522956A true CH522956A (de) 1972-05-15

Family

ID=5729950

Family Applications (1)

Application Number Title Priority Date Filing Date
CH477470A CH522956A (de) 1969-04-01 1970-04-01 Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung

Country Status (7)

Country Link
US (1) US3916433A (de)
BR (1) BR7017351D0 (de)
CH (1) CH522956A (de)
DE (1) DE1916554B2 (de)
ES (1) ES377012A1 (de)
FR (1) FR2042218A5 (de)
GB (1) GB1300334A (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2278160A1 (fr) * 1974-07-08 1976-02-06 Radiotechnique Compelec Languettes de connexion en forme de peigne pour transistors de puissance
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
DE3245762A1 (de) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement in modulbauweise
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US5761028A (en) * 1996-05-02 1998-06-02 Chrysler Corporation Transistor connection assembly having IGBT (X) cross ties

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting

Also Published As

Publication number Publication date
FR2042218A5 (de) 1971-02-05
ES377012A1 (es) 1972-05-16
GB1300334A (en) 1972-12-20
US3916433A (en) 1975-10-28
DE1916554B2 (de) 1974-07-04
DE1916554A1 (de) 1971-02-11
BR7017351D0 (pt) 1973-01-16

Similar Documents

Publication Publication Date Title
CH533095A (de) Verfahren zur Herstellung von Androstan-Verbindungen
CH544093A (de) Verfahren zur Herstellung von O-Acyl-lysergolen
AT298629B (de) Verfahren zur Herstellung von Indoanilinen
AT300371B (de) Verfahren zur Herstellung von Polyurethanen
CH512626A (de) Verfahren zur Herstellung von Prepregs
AT305417B (de) Verfahren zur Herstellung von Schaltkreisen
CH543553A (de) Verfahren zur Herstellung von Poly-amid-imid-estern
CH522956A (de) Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung
AT315127B (de) Verfahren zur Herstellung von β-Aluminiumoxyd
AT306715B (de) Verfahren zur Herstellung von ω-Lactamen
CH531257A (de) Verfahren zur Herstellung von Halbleiter-Gleichrichter-Anordnungen
AT300840B (de) Verfahren zur Herstellung von Organo-H-silanen
CH543487A (de) Verfahren zur Herstellung von Adamantylharnstoffen
CH544808A (de) Verfahren zur Herstellung von Negamycin
CH530859A (de) Verfahren zur Herstellung von planebenen Bauelementen und nach diesem Verfahren hergestelltes Bauelement
CH533087A (de) Verfahren zur Herstellung von Isocyanaten
CH490936A (de) Verfahren zur Herstellung von Schleifmitteln und nach diesem Verfahren hergestelltes Schleifmittel
CH522012A (de) Verfahren zur Herstellung von Polyurethanen
CH466642A (de) Verfahren zur Herstellung von Spannstiften, und Spannstift, hergestellt nach diesem Verfahren
CH497425A (de) Verfahren zur Herstellung von B-Picolin
CH544758A (de) Verfahren zur Herstellung von Lysergolen
CH529248A (de) Verfahren zur Herstellung von Vliesstoffen
AT309636B (de) Verfahren zur Herstellung von Verklebungen
AT300755B (de) Verfahren zur Herstellung von Isothiocyanaten
AT303960B (de) Verfahren zur herstellung von alpha-aminobenzylpenicillin

Legal Events

Date Code Title Description
PL Patent ceased