ES377012A1 - Perfeccionamientos en las disposiciones de semiconductores. - Google Patents

Perfeccionamientos en las disposiciones de semiconductores.

Info

Publication number
ES377012A1
ES377012A1 ES377012A ES377012A ES377012A1 ES 377012 A1 ES377012 A1 ES 377012A1 ES 377012 A ES377012 A ES 377012A ES 377012 A ES377012 A ES 377012A ES 377012 A1 ES377012 A1 ES 377012A1
Authority
ES
Spain
Prior art keywords
conductors
clamp
semiconductor
wafers
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES377012A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of ES377012A1 publication Critical patent/ES377012A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Rectifiers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
ES377012A 1969-04-01 1970-02-18 Perfeccionamientos en las disposiciones de semiconductores. Expired ES377012A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1916554A DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Publications (1)

Publication Number Publication Date
ES377012A1 true ES377012A1 (es) 1972-05-16

Family

ID=5729950

Family Applications (1)

Application Number Title Priority Date Filing Date
ES377012A Expired ES377012A1 (es) 1969-04-01 1970-02-18 Perfeccionamientos en las disposiciones de semiconductores.

Country Status (7)

Country Link
US (1) US3916433A (es)
BR (1) BR7017351D0 (es)
CH (1) CH522956A (es)
DE (1) DE1916554B2 (es)
ES (1) ES377012A1 (es)
FR (1) FR2042218A5 (es)
GB (1) GB1300334A (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2278160A1 (fr) * 1974-07-08 1976-02-06 Radiotechnique Compelec Languettes de connexion en forme de peigne pour transistors de puissance
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
DE3245762A1 (de) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement in modulbauweise
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US5761028A (en) * 1996-05-02 1998-06-02 Chrysler Corporation Transistor connection assembly having IGBT (X) cross ties

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting

Also Published As

Publication number Publication date
FR2042218A5 (es) 1971-02-05
US3916433A (en) 1975-10-28
DE1916554A1 (de) 1971-02-11
CH522956A (de) 1972-05-15
BR7017351D0 (pt) 1973-01-16
DE1916554B2 (de) 1974-07-04
GB1300334A (en) 1972-12-20

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