ES402464A1 - Perfeccionamientos introducidos en marcos conductores para dispositivos semiconductores. - Google Patents
Perfeccionamientos introducidos en marcos conductores para dispositivos semiconductores.Info
- Publication number
- ES402464A1 ES402464A1 ES402464A ES402464A ES402464A1 ES 402464 A1 ES402464 A1 ES 402464A1 ES 402464 A ES402464 A ES 402464A ES 402464 A ES402464 A ES 402464A ES 402464 A1 ES402464 A1 ES 402464A1
- Authority
- ES
- Spain
- Prior art keywords
- integrated circuit
- circuit devices
- wire bonded
- support area
- manufacturing wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Perfeccionamientos introducidos en marcos conductores para dispositivos semiconductores, siendo dichos marcos conductores del tipo formado a partir de una única lámina metálica continua, que comprende un marco exterior, una zona central de soporte de una pastilla semiconductora, y una pluralidad de dedos conductores, cada uno de los cuales tiene una parte de terminal cerca de dicha zona de soporte de la pastilla, caracterizados porque dicha zona de soporte de la pastilla y al menos dichas partes terminales de dichos conductores no son coplanarias.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14290171A | 1971-05-13 | 1971-05-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES402464A1 true ES402464A1 (es) | 1975-12-16 |
Family
ID=22501734
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES402464A Expired ES402464A1 (es) | 1971-05-13 | 1972-05-06 | Perfeccionamientos introducidos en marcos conductores para dispositivos semiconductores. |
ES406435A Expired ES406435A1 (es) | 1971-05-13 | 1972-09-06 | Un metodo de montar un dispositivo semiconductor. |
ES406434A Expired ES406434A1 (es) | 1971-05-13 | 1972-09-06 | Un dispositivo semiconductor. |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES406435A Expired ES406435A1 (es) | 1971-05-13 | 1972-09-06 | Un metodo de montar un dispositivo semiconductor. |
ES406434A Expired ES406434A1 (es) | 1971-05-13 | 1972-09-06 | Un dispositivo semiconductor. |
Country Status (14)
Country | Link |
---|---|
US (1) | US3685137A (es) |
JP (1) | JPS5121744B1 (es) |
AU (1) | AU463288B2 (es) |
BE (1) | BE783423A (es) |
CA (1) | CA951026A (es) |
DE (1) | DE2221886C3 (es) |
ES (3) | ES402464A1 (es) |
FR (1) | FR2137669B1 (es) |
GB (1) | GB1338188A (es) |
HK (1) | HK73676A (es) |
IT (1) | IT955452B (es) |
MY (1) | MY7700063A (es) |
NL (1) | NL7206425A (es) |
SE (1) | SE384426B (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3768986A (en) * | 1971-10-08 | 1973-10-30 | Micro Science Ass | Laminated lead frame and method of producing same |
US3995845A (en) * | 1972-12-26 | 1976-12-07 | Rca Corporation | Ultrasonic wire bonding chuck |
US4137546A (en) * | 1977-10-14 | 1979-01-30 | Plessey Incorporated | Stamped lead frame for semiconductor packages |
EP0063170A3 (en) * | 1981-04-21 | 1983-08-31 | Rockwell International Corporation | Pneumatic wire lifter and method |
US4534105A (en) * | 1983-08-10 | 1985-08-13 | Rca Corporation | Method for grounding a pellet support pad in an integrated circuit device |
KR100276781B1 (ko) * | 1992-02-03 | 2001-01-15 | 비센트 비. 인그라시아 | 리드-온-칩 반도체장치 및 그 제조방법 |
US5647528A (en) | 1996-02-06 | 1997-07-15 | Micron Technology, Inc. | Bondhead lead clamp apparatus and method |
US5954842A (en) * | 1996-01-26 | 1999-09-21 | Micron Technology, Inc. | Lead finger clamp assembly |
US5890644A (en) * | 1996-01-26 | 1999-04-06 | Micron Technology, Inc. | Apparatus and method of clamping semiconductor devices using sliding finger supports |
US5673845A (en) * | 1996-06-17 | 1997-10-07 | Micron Technology, Inc. | Lead penetrating clamping system |
US6068174A (en) | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
US6121674A (en) | 1998-02-23 | 2000-09-19 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
US6126062A (en) * | 1998-04-02 | 2000-10-03 | Micron Technology, Inc. | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
US6634538B2 (en) | 1998-04-02 | 2003-10-21 | Micron Technology, Inc. | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
US6977214B2 (en) * | 1998-12-11 | 2005-12-20 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
-
1971
- 1971-05-13 US US142901A patent/US3685137A/en not_active Expired - Lifetime
-
1972
- 1972-03-29 CA CA138,495,A patent/CA951026A/en not_active Expired
- 1972-05-03 GB GB2056272A patent/GB1338188A/en not_active Expired
- 1972-05-04 DE DE2221886A patent/DE2221886C3/de not_active Expired
- 1972-05-06 ES ES402464A patent/ES402464A1/es not_active Expired
- 1972-05-09 FR FR7216523A patent/FR2137669B1/fr not_active Expired
- 1972-05-10 SE SE7206192A patent/SE384426B/xx unknown
- 1972-05-11 JP JP47046823A patent/JPS5121744B1/ja active Pending
- 1972-05-12 AU AU42216/72A patent/AU463288B2/en not_active Expired
- 1972-05-12 BE BE783423A patent/BE783423A/xx unknown
- 1972-05-12 NL NL7206425A patent/NL7206425A/xx not_active Application Discontinuation
- 1972-05-12 IT IT24266/72A patent/IT955452B/it active
- 1972-09-06 ES ES406435A patent/ES406435A1/es not_active Expired
- 1972-09-06 ES ES406434A patent/ES406434A1/es not_active Expired
-
1976
- 1976-11-25 HK HK736/76*UA patent/HK73676A/xx unknown
-
1977
- 1977-12-30 MY MY63/77A patent/MY7700063A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
ES406434A1 (es) | 1975-07-01 |
US3685137A (en) | 1972-08-22 |
NL7206425A (es) | 1972-11-15 |
ES406435A1 (es) | 1975-07-16 |
DE2221886B2 (de) | 1980-03-06 |
AU4221672A (en) | 1973-11-15 |
FR2137669A1 (es) | 1972-12-29 |
DE2221886C3 (de) | 1980-11-20 |
FR2137669B1 (es) | 1978-07-21 |
CA951026A (en) | 1974-07-09 |
JPS5121744B1 (es) | 1976-07-05 |
HK73676A (en) | 1976-12-03 |
DE2221886A1 (de) | 1972-11-23 |
IT955452B (it) | 1973-09-29 |
BE783423A (fr) | 1972-09-01 |
MY7700063A (en) | 1977-12-31 |
GB1338188A (en) | 1973-11-21 |
SE384426B (sv) | 1976-05-03 |
AU463288B2 (en) | 1975-07-24 |
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