GB1300334A - Semi-conductor arrangement and method of production - Google Patents

Semi-conductor arrangement and method of production

Info

Publication number
GB1300334A
GB1300334A GB05121/70A GB1512170A GB1300334A GB 1300334 A GB1300334 A GB 1300334A GB 05121/70 A GB05121/70 A GB 05121/70A GB 1512170 A GB1512170 A GB 1512170A GB 1300334 A GB1300334 A GB 1300334A
Authority
GB
United Kingdom
Prior art keywords
conductor
semi
members
strip
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB05121/70A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of GB1300334A publication Critical patent/GB1300334A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/481Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/421Shapes or dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/421Shapes or dispositions
    • H10W70/424Cross-sectional shapes
    • H10W70/427Bent parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/161Containers comprising no base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Rectifiers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB05121/70A 1969-04-01 1970-03-31 Semi-conductor arrangement and method of production Expired GB1300334A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1916554A DE1916554B2 (de) 1969-04-01 1969-04-01 Verfahren zum Herstellen von Halbleitergleichrichteranordnungen

Publications (1)

Publication Number Publication Date
GB1300334A true GB1300334A (en) 1972-12-20

Family

ID=5729950

Family Applications (1)

Application Number Title Priority Date Filing Date
GB05121/70A Expired GB1300334A (en) 1969-04-01 1970-03-31 Semi-conductor arrangement and method of production

Country Status (7)

Country Link
US (1) US3916433A (enExample)
BR (1) BR7017351D0 (enExample)
CH (1) CH522956A (enExample)
DE (1) DE1916554B2 (enExample)
ES (1) ES377012A1 (enExample)
FR (1) FR2042218A5 (enExample)
GB (1) GB1300334A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2278160A1 (fr) * 1974-07-08 1976-02-06 Radiotechnique Compelec Languettes de connexion en forme de peigne pour transistors de puissance
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
DE3245762A1 (de) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement in modulbauweise
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US5761028A (en) * 1996-05-02 1998-06-02 Chrysler Corporation Transistor connection assembly having IGBT (X) cross ties

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting

Also Published As

Publication number Publication date
ES377012A1 (es) 1972-05-16
FR2042218A5 (enExample) 1971-02-05
DE1916554B2 (de) 1974-07-04
DE1916554A1 (de) 1971-02-11
BR7017351D0 (pt) 1973-01-16
US3916433A (en) 1975-10-28
CH522956A (de) 1972-05-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees