GB1318808A - Semi-conductor arrangement - Google Patents

Semi-conductor arrangement

Info

Publication number
GB1318808A
GB1318808A GB5125471A GB5125471A GB1318808A GB 1318808 A GB1318808 A GB 1318808A GB 5125471 A GB5125471 A GB 5125471A GB 5125471 A GB5125471 A GB 5125471A GB 1318808 A GB1318808 A GB 1318808A
Authority
GB
United Kingdom
Prior art keywords
strip
contact
conductor
semi
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5125471A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of GB1318808A publication Critical patent/GB1318808A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1318808 Semi-conductor devices SEMIKRON GESELLSCHAFT FUR GLEICHRICHTERBAU UND ELEKTRONIC mbH 4 Nov 1971 [6 Nov 1970] 51254/71 Addition to 1300334 Heading H1K A semi-conductor rectifier arrangement comprises a plurality of conductive members formed from a conductive strip 1, each member including a wafer contact portion 2, 3 and a conductor portion 21, 31, the contact portion of one member being a strip, 2, extending lengthwise of the conductive strip, the contact strip being bent out of the plane of the conductive strip at 22 to overlap the other contact portions 3 in order to hold a semi-conductor wafer therebetween. The wafer may then be soldered to its contacts, the arrangement provided with a housing, and the strip severed, at 10. In a further embodiment, a second smaller contact strip may be included between contact strip 2 and two portions 3, the second strip also being bent at its conductor to overlap another part of the contact portions 3, enabling two wafers to be held at each portion 3 allowing full wave bridge rectifiers to be constructed. Specification 1,300,334 is referred to.
GB5125471A 1970-11-06 1971-11-04 Semi-conductor arrangement Expired GB1318808A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702054677 DE2054677B2 (en) 1970-11-06 1970-11-06 METHOD OF MANUFACTURING SEMI-CONDUCTOR RECTIFIER ARRANGEMENTS

Publications (1)

Publication Number Publication Date
GB1318808A true GB1318808A (en) 1973-05-31

Family

ID=5787370

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5125471A Expired GB1318808A (en) 1970-11-06 1971-11-04 Semi-conductor arrangement

Country Status (7)

Country Link
BR (1) BR7107150D0 (en)
DE (1) DE2054677B2 (en)
ES (1) ES396126A2 (en)
FR (1) FR2119924B1 (en)
GB (1) GB1318808A (en)
IT (1) IT974539B (en)
SE (1) SE363541B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351749A2 (en) * 1988-07-22 1990-01-24 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351749A2 (en) * 1988-07-22 1990-01-24 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
EP0351749A3 (en) * 1988-07-22 1991-04-17 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor

Also Published As

Publication number Publication date
DE2054677A1 (en) 1972-05-10
DE2054677B2 (en) 1977-12-22
BR7107150D0 (en) 1973-04-17
FR2119924B1 (en) 1978-06-02
SE363541B (en) 1974-01-21
FR2119924A6 (en) 1972-08-11
ES396126A2 (en) 1974-05-01
IT974539B (en) 1974-07-10

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees