GB1147420A - Improvements in and relating to semiconductor devices - Google Patents

Improvements in and relating to semiconductor devices

Info

Publication number
GB1147420A
GB1147420A GB5093968A GB5093968A GB1147420A GB 1147420 A GB1147420 A GB 1147420A GB 5093968 A GB5093968 A GB 5093968A GB 5093968 A GB5093968 A GB 5093968A GB 1147420 A GB1147420 A GB 1147420A
Authority
GB
United Kingdom
Prior art keywords
layer
base
emitter
electrode
collector region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5093968A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6405411A external-priority patent/NL6405411A/xx
Priority claimed from NL6510237A external-priority patent/NL6510237A/xx
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1147420A publication Critical patent/GB1147420A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/08Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
    • H03F1/14Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of neutralising means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Integrated Circuits (AREA)

Abstract

1,147,420. Transistors. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 14 March, 1966 [23 July, 1965; 6 Aug., 1965], No. 50939/68. Divided out of 1,146,600. Heading H1K. A planar transistor has emitter and base regions of a smaller lateral area than a collector region and connected to metallic electrode areas overlying the collector region on an insulating layer. A screening layer is provided between one of the electrode areas and the collector region and is interconnected to the other electrode area by at least one metallic stripe extending over the insulating layer. The screening layer, which is separated from the overlying electrode area by the insulating layer, is a metal layer isolated from the collector region by insulation formed between them. The two embodiments described are NPN silicon transistors. One of these has its base electrode screened from the collector and is to be used in a common emitter emplifier and the other has its emitter electrode screened and is to be used in grounded base configuration. In both an N-type wafer is first provided with boron-doped base region 3 by diffusion through an apertured oxide layer and subsequently with two partial emitter regions 2 by indiffusion of phosphorus. In the embodiment shown screening layer 108 is formed on the oxide layer and is covered by an insulating layer 109 of photo-resist, lacquer or silicon oxide. The base 6 and emitter 5 electrode areas are then formed at the same time as the stripe 11 interconnecting the screening layer with the base electrode area. In the other embodiment (Figs. 11 and 12, not shown) a screening layer (128) lies under the emitter electrode area (5) and is connected to the base contact area (6) by fingers (17) and interconnecting stripes (27) which are kept in a straight line to keep the output shunt capacitance low. The transistors are completed by the provision of collector electrodes and by encapsulation. The Specification also describes but does not claim a construction like that shown (Fig. 9) but wherein the metal screening layer is replaced by semi-conductor region of opposite conductivity type to the collector region and formed in the surface thereof. A similar construction is described corresponding to Fig. 11 (not shown) and is claimed in the parent Specification.
GB5093968A 1964-05-15 1966-03-14 Improvements in and relating to semiconductor devices Expired GB1147420A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6405411A NL6405411A (en) 1964-05-15 1964-05-15
NL6509551 1965-07-23
NL6510237A NL6510237A (en) 1965-08-06 1965-08-06

Publications (1)

Publication Number Publication Date
GB1147420A true GB1147420A (en) 1969-04-02

Family

ID=27351310

Family Applications (2)

Application Number Title Priority Date Filing Date
GB3917765A Expired GB1146600A (en) 1964-05-15 1966-03-14 Improvements in and relating to semiconductor devices
GB5093968A Expired GB1147420A (en) 1964-05-15 1966-03-14 Improvements in and relating to semiconductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB3917765A Expired GB1146600A (en) 1964-05-15 1966-03-14 Improvements in and relating to semiconductor devices

Country Status (4)

Country Link
CH (1) CH436491A (en)
DK (1) DK117162B (en)
GB (2) GB1146600A (en)
NO (1) NO119910B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053850A (en) * 1988-03-14 1991-10-01 Motorola, Inc. Bonding pad for semiconductor devices

Also Published As

Publication number Publication date
CH436491A (en) 1967-05-31
DK117162B (en) 1970-03-23
GB1146600A (en) 1969-03-26
NO119910B (en) 1970-07-27

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