GB1147420A - Improvements in and relating to semiconductor devices - Google Patents
Improvements in and relating to semiconductor devicesInfo
- Publication number
- GB1147420A GB1147420A GB5093968A GB5093968A GB1147420A GB 1147420 A GB1147420 A GB 1147420A GB 5093968 A GB5093968 A GB 5093968A GB 5093968 A GB5093968 A GB 5093968A GB 1147420 A GB1147420 A GB 1147420A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- base
- emitter
- electrode
- collector region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000012216 screening Methods 0.000 abstract 6
- 238000010276 construction Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
- H03F1/14—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of neutralising means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
1,147,420. Transistors. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 14 March, 1966 [23 July, 1965; 6 Aug., 1965], No. 50939/68. Divided out of 1,146,600. Heading H1K. A planar transistor has emitter and base regions of a smaller lateral area than a collector region and connected to metallic electrode areas overlying the collector region on an insulating layer. A screening layer is provided between one of the electrode areas and the collector region and is interconnected to the other electrode area by at least one metallic stripe extending over the insulating layer. The screening layer, which is separated from the overlying electrode area by the insulating layer, is a metal layer isolated from the collector region by insulation formed between them. The two embodiments described are NPN silicon transistors. One of these has its base electrode screened from the collector and is to be used in a common emitter emplifier and the other has its emitter electrode screened and is to be used in grounded base configuration. In both an N-type wafer is first provided with boron-doped base region 3 by diffusion through an apertured oxide layer and subsequently with two partial emitter regions 2 by indiffusion of phosphorus. In the embodiment shown screening layer 108 is formed on the oxide layer and is covered by an insulating layer 109 of photo-resist, lacquer or silicon oxide. The base 6 and emitter 5 electrode areas are then formed at the same time as the stripe 11 interconnecting the screening layer with the base electrode area. In the other embodiment (Figs. 11 and 12, not shown) a screening layer (128) lies under the emitter electrode area (5) and is connected to the base contact area (6) by fingers (17) and interconnecting stripes (27) which are kept in a straight line to keep the output shunt capacitance low. The transistors are completed by the provision of collector electrodes and by encapsulation. The Specification also describes but does not claim a construction like that shown (Fig. 9) but wherein the metal screening layer is replaced by semi-conductor region of opposite conductivity type to the collector region and formed in the surface thereof. A similar construction is described corresponding to Fig. 11 (not shown) and is claimed in the parent Specification.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6405411A NL6405411A (en) | 1964-05-15 | 1964-05-15 | |
NL6509551 | 1965-07-23 | ||
NL6510237A NL6510237A (en) | 1965-08-06 | 1965-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1147420A true GB1147420A (en) | 1969-04-02 |
Family
ID=27351310
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3917765A Expired GB1146600A (en) | 1964-05-15 | 1966-03-14 | Improvements in and relating to semiconductor devices |
GB5093968A Expired GB1147420A (en) | 1964-05-15 | 1966-03-14 | Improvements in and relating to semiconductor devices |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3917765A Expired GB1146600A (en) | 1964-05-15 | 1966-03-14 | Improvements in and relating to semiconductor devices |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH436491A (en) |
DK (1) | DK117162B (en) |
GB (2) | GB1146600A (en) |
NO (1) | NO119910B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5053850A (en) * | 1988-03-14 | 1991-10-01 | Motorola, Inc. | Bonding pad for semiconductor devices |
-
1965
- 1965-09-14 NO NO15969565A patent/NO119910B/no unknown
- 1965-09-14 CH CH1275165A patent/CH436491A/en unknown
- 1965-09-14 DK DK470765A patent/DK117162B/en unknown
-
1966
- 1966-03-14 GB GB3917765A patent/GB1146600A/en not_active Expired
- 1966-03-14 GB GB5093968A patent/GB1147420A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH436491A (en) | 1967-05-31 |
DK117162B (en) | 1970-03-23 |
GB1146600A (en) | 1969-03-26 |
NO119910B (en) | 1970-07-27 |
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