SE363541B - - Google Patents

Info

Publication number
SE363541B
SE363541B SE1409571A SE1409571A SE363541B SE 363541 B SE363541 B SE 363541B SE 1409571 A SE1409571 A SE 1409571A SE 1409571 A SE1409571 A SE 1409571A SE 363541 B SE363541 B SE 363541B
Authority
SE
Sweden
Application number
SE1409571A
Inventor
W Schierz
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of SE363541B publication Critical patent/SE363541B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Packages (AREA)
  • Control Of Conveyors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Rectifiers (AREA)
SE1409571A 1970-11-06 1971-11-04 SE363541B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702054677 DE2054677B2 (en) 1970-11-06 1970-11-06 METHOD OF MANUFACTURING SEMI-CONDUCTOR RECTIFIER ARRANGEMENTS

Publications (1)

Publication Number Publication Date
SE363541B true SE363541B (en) 1974-01-21

Family

ID=5787370

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1409571A SE363541B (en) 1970-11-06 1971-11-04

Country Status (7)

Country Link
BR (1) BR7107150D0 (en)
DE (1) DE2054677B2 (en)
ES (1) ES396126A2 (en)
FR (1) FR2119924B1 (en)
GB (1) GB1318808A (en)
IT (1) IT974539B (en)
SE (1) SE363541B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor

Also Published As

Publication number Publication date
ES396126A2 (en) 1974-05-01
DE2054677B2 (en) 1977-12-22
BR7107150D0 (en) 1973-04-17
GB1318808A (en) 1973-05-31
FR2119924A6 (en) 1972-08-11
DE2054677A1 (en) 1972-05-10
IT974539B (en) 1974-07-10
FR2119924B1 (en) 1978-06-02

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