ES396126A2 - Semi-conductor arrangement - Google Patents

Semi-conductor arrangement

Info

Publication number
ES396126A2
ES396126A2 ES396126A ES396126A ES396126A2 ES 396126 A2 ES396126 A2 ES 396126A2 ES 396126 A ES396126 A ES 396126A ES 396126 A ES396126 A ES 396126A ES 396126 A2 ES396126 A2 ES 396126A2
Authority
ES
Spain
Prior art keywords
elements
semiconductor
conductive
conveyor belt
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES396126A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of ES396126A2 publication Critical patent/ES396126A2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Rectifiers (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Control Of Conveyors (AREA)
  • Packages (AREA)

Abstract

Improvements in the object of the patent 377,012, by improvements in the semiconductor arrangements, with semiconductor components placed in a row in a plane, and more particularly with rectifying components, whose semiconductor tablets are respectively contacted between the corresponding conductive elements, whose sections form a clamp fixing, in which arrangements the conducting elements, which exist in plurality and manufactured with a conducting material that is eventually continuous, tapered or flattened, form a flat, geometric structure with areas of periodic repetition, being joined together by a zone longitudinal edge of the conductive material provided as a conveyor belt, each one of the respective flattened conductive elements corresponding to each semiconductor tablet disposed parallel and overlapping the other conductive element, forming with this a clamp clamp for the plank semiconductor eta, and serving the respective center lines of the section of each conductor element, which serves as the external conductive connection of the box, as a marking to discretionally fraction the structure of conductor elements in rectifier circuits and/or in individual semiconductor components, characterized in that the flat, geometric structure of the conductive elements comprises the conveyor belt (1), at least one contact flange (2) that runs along the conveyor belt, connected to the latter by conductive elements (21) in the form of an arm and that serve as connection conductors, and flattened contact elements (3) located between the conductive elements and attached to the conveyor belt (1), and because the contact flange, displaced by bending (22) of the conductive elements (21) in the direction of the conveyor belt (1), is arranged in such a way, by overlapping a number of element (3) contact and by the choice of a suitably elastic conductive material, in contact with the contact elements (3) under pressure as a spring pressure, which forms with the same clamp fasteners to accommodate at least minus one semiconductor tablet (4) each time. (Machine-translation by Google Translate, not legally binding)
ES396126A 1970-11-06 1971-10-07 Semi-conductor arrangement Expired ES396126A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702054677 DE2054677B2 (en) 1970-11-06 1970-11-06 METHOD OF MANUFACTURING SEMI-CONDUCTOR RECTIFIER ARRANGEMENTS

Publications (1)

Publication Number Publication Date
ES396126A2 true ES396126A2 (en) 1974-05-01

Family

ID=5787370

Family Applications (1)

Application Number Title Priority Date Filing Date
ES396126A Expired ES396126A2 (en) 1970-11-06 1971-10-07 Semi-conductor arrangement

Country Status (7)

Country Link
BR (1) BR7107150D0 (en)
DE (1) DE2054677B2 (en)
ES (1) ES396126A2 (en)
FR (1) FR2119924B1 (en)
GB (1) GB1318808A (en)
IT (1) IT974539B (en)
SE (1) SE363541B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor

Also Published As

Publication number Publication date
BR7107150D0 (en) 1973-04-17
DE2054677A1 (en) 1972-05-10
IT974539B (en) 1974-07-10
SE363541B (en) 1974-01-21
FR2119924A6 (en) 1972-08-11
DE2054677B2 (en) 1977-12-22
FR2119924B1 (en) 1978-06-02
GB1318808A (en) 1973-05-31

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