DE1752727B2 - Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe - Google Patents

Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe

Info

Publication number
DE1752727B2
DE1752727B2 DE19681752727 DE1752727A DE1752727B2 DE 1752727 B2 DE1752727 B2 DE 1752727B2 DE 19681752727 DE19681752727 DE 19681752727 DE 1752727 A DE1752727 A DE 1752727A DE 1752727 B2 DE1752727 B2 DE 1752727B2
Authority
DE
Germany
Prior art keywords
film
pieces
disc
semiconductor wafer
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681752727
Other languages
German (de)
English (en)
Other versions
DE1752727A1 (de
Inventor
Jacobus; Pas Hermanus Antonius van de; Nijmegen Eigeman (Niederlande)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1752727A1 publication Critical patent/DE1752727A1/de
Publication of DE1752727B2 publication Critical patent/DE1752727B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)
DE19681752727 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe Pending DE1752727B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6709523A NL6709523A (OSRAM) 1967-07-08 1967-07-08

Publications (2)

Publication Number Publication Date
DE1752727A1 DE1752727A1 (de) 1971-05-19
DE1752727B2 true DE1752727B2 (de) 1972-05-10

Family

ID=19800665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681752727 Pending DE1752727B2 (de) 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe

Country Status (10)

Country Link
US (1) US3537169A (OSRAM)
AT (1) AT296389B (OSRAM)
BE (1) BE717795A (OSRAM)
CH (1) CH483726A (OSRAM)
DE (1) DE1752727B2 (OSRAM)
ES (1) ES355847A1 (OSRAM)
FR (1) FR1574319A (OSRAM)
GB (1) GB1233083A (OSRAM)
NL (1) NL6709523A (OSRAM)
SE (1) SE330415B (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4085038A (en) * 1976-12-15 1978-04-18 Western Electric Co., Inc. Methods of and apparatus for sorting parts of a separated article
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
DE3888685T2 (de) * 1988-10-10 1994-10-20 Ibm Verfahren zum Brechen eines plattenförmigen Werkstücks, insbesondere eines Halbleiterplättchens, und Vorrichtung zum Brechen des genannten zwischen zwei Folien sandwichartig angeordneten Werkstücks.
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
US6541852B2 (en) 1994-07-07 2003-04-01 Tessera, Inc. Framed sheets
US6228685B1 (en) 1994-07-07 2001-05-08 Tessera, Inc. Framed sheet processing
US5668062A (en) * 1995-08-23 1997-09-16 Texas Instruments Incorporated Method for processing semiconductor wafer with reduced particle contamination during saw
US6182546B1 (en) 1997-03-04 2001-02-06 Tessera, Inc. Apparatus and methods for separating microelectronic packages from a common substrate
US6217972B1 (en) 1997-10-17 2001-04-17 Tessera, Inc. Enhancements in framed sheet processing
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
NL284964A (OSRAM) * 1961-11-10 1900-01-01
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
US3384279A (en) * 1966-08-23 1968-05-21 Western Electric Co Methods of severing brittle material along prescribed lines

Also Published As

Publication number Publication date
ES355847A1 (es) 1970-01-01
DE1752727A1 (de) 1971-05-19
GB1233083A (OSRAM) 1971-05-26
AT296389B (de) 1972-02-10
BE717795A (OSRAM) 1969-01-08
FR1574319A (OSRAM) 1969-07-11
SE330415B (OSRAM) 1970-11-16
US3537169A (en) 1970-11-03
NL6709523A (OSRAM) 1969-01-10
CH483726A (de) 1969-12-31

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