DE1521728B2 - Verfahren zum chemischen Polieren von Halbleiterkristallen - Google Patents

Verfahren zum chemischen Polieren von Halbleiterkristallen

Info

Publication number
DE1521728B2
DE1521728B2 DE19661521728 DE1521728A DE1521728B2 DE 1521728 B2 DE1521728 B2 DE 1521728B2 DE 19661521728 DE19661521728 DE 19661521728 DE 1521728 A DE1521728 A DE 1521728A DE 1521728 B2 DE1521728 B2 DE 1521728B2
Authority
DE
Germany
Prior art keywords
crystals
semiconductor
chemical polishing
semiconductor crystals
etching solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19661521728
Other languages
German (de)
English (en)
Other versions
DE1521728A1 (de
Inventor
Gerald Francis Saginaw Mich. Rydman (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE1521728A1 publication Critical patent/DE1521728A1/de
Publication of DE1521728B2 publication Critical patent/DE1521728B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
DE19661521728 1965-05-11 1966-05-03 Verfahren zum chemischen Polieren von Halbleiterkristallen Pending DE1521728B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45479665A 1965-05-11 1965-05-11

Publications (2)

Publication Number Publication Date
DE1521728A1 DE1521728A1 (de) 1969-06-12
DE1521728B2 true DE1521728B2 (de) 1970-02-12

Family

ID=23806130

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661521728 Pending DE1521728B2 (de) 1965-05-11 1966-05-03 Verfahren zum chemischen Polieren von Halbleiterkristallen

Country Status (4)

Country Link
CH (1) CH469103A (ref)
DE (1) DE1521728B2 (ref)
GB (1) GB1114609A (ref)
NL (1) NL6606411A (ref)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838494A (ref) * 1971-09-18 1973-06-06

Also Published As

Publication number Publication date
GB1114609A (en) 1968-05-22
DE1521728A1 (de) 1969-06-12
CH469103A (de) 1969-02-28
NL6606411A (ref) 1966-11-14

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