DE3885160T2 - Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur. - Google Patents
Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur.Info
- Publication number
- DE3885160T2 DE3885160T2 DE88201242T DE3885160T DE3885160T2 DE 3885160 T2 DE3885160 T2 DE 3885160T2 DE 88201242 T DE88201242 T DE 88201242T DE 3885160 T DE3885160 T DE 3885160T DE 3885160 T2 DE3885160 T2 DE 3885160T2
- Authority
- DE
- Germany
- Prior art keywords
- processing
- semiconductor chips
- associated equipment
- edge semiconductor
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8706615A IT1229640B (it) | 1987-06-29 | 1987-06-29 | Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3885160D1 DE3885160D1 (de) | 1993-12-02 |
DE3885160T2 true DE3885160T2 (de) | 1994-04-07 |
Family
ID=11121454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88201242T Expired - Fee Related DE3885160T2 (de) | 1987-06-29 | 1988-06-20 | Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4897369A (de) |
EP (1) | EP0297648B1 (de) |
JP (1) | JPH01220832A (de) |
DE (1) | DE3885160T2 (de) |
IT (1) | IT1229640B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2645478B2 (ja) * | 1988-10-07 | 1997-08-25 | 富士通株式会社 | 半導体装置の製造方法 |
US5128281A (en) * | 1991-06-05 | 1992-07-07 | Texas Instruments Incorporated | Method for polishing semiconductor wafer edges |
JPH0715897B2 (ja) * | 1991-11-20 | 1995-02-22 | 株式会社エンヤシステム | ウエ−ハ端面エッチング方法及び装置 |
JP2628424B2 (ja) * | 1992-01-24 | 1997-07-09 | 信越半導体株式会社 | ウエーハ面取部の研磨方法及び装置 |
US5424224A (en) * | 1993-01-19 | 1995-06-13 | Texas Instruments Incorporated | Method of surface protection of a semiconductor wafer during polishing |
US5595522A (en) * | 1994-01-04 | 1997-01-21 | Texas Instruments Incorporated | Semiconductor wafer edge polishing system and method |
EP0694957B1 (de) * | 1994-07-29 | 2001-11-07 | STMicroelectronics S.r.l. | Verfahren zur Behandlung von Halbleiterscheiben mit Flüssigkeiten |
US6523553B1 (en) | 1999-03-30 | 2003-02-25 | Applied Materials, Inc. | Wafer edge cleaning method and apparatus |
US6465353B1 (en) * | 2000-09-29 | 2002-10-15 | International Rectifier Corporation | Process of thinning and blunting semiconductor wafer edge and resulting wafer |
US20050211379A1 (en) * | 2004-03-29 | 2005-09-29 | Hung-Wen Su | Apparatus and method for removing metal from wafer edge |
US20050252547A1 (en) * | 2004-05-11 | 2005-11-17 | Applied Materials, Inc. | Methods and apparatus for liquid chemical delivery |
JP4993721B2 (ja) * | 2007-07-02 | 2012-08-08 | シャープ株式会社 | 薄板処理方法および薄板処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3951728A (en) * | 1974-07-30 | 1976-04-20 | Hitachi, Ltd. | Method of treating semiconductor wafers |
JPS5433676A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Wafer processing unit |
JPS55143037A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Treating method of semiconductor complex |
JPS5928036Y2 (ja) * | 1980-07-15 | 1984-08-14 | 信越化学工業株式会社 | 化学エツチング処理装置 |
JPS5958827A (ja) * | 1982-09-28 | 1984-04-04 | Toshiba Corp | 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置 |
JPS5994425A (ja) * | 1982-11-19 | 1984-05-31 | Nec Kyushu Ltd | 半導体製造装置 |
JPS59117123A (ja) * | 1982-12-23 | 1984-07-06 | Toshiba Corp | レジスト除去装置 |
JPS6072234A (ja) * | 1983-09-28 | 1985-04-24 | Mitsubishi Electric Corp | 半導体ウエハ−の水洗装置 |
JPS61230332A (ja) * | 1985-04-04 | 1986-10-14 | Mitsubishi Electric Corp | ウエハ等薄板体の搬送装置 |
JPS6296400A (ja) * | 1985-10-23 | 1987-05-02 | Mitsubishi Metal Corp | ウエハの製造方法 |
-
1987
- 1987-06-29 IT IT8706615A patent/IT1229640B/it active
-
1988
- 1988-06-20 EP EP88201242A patent/EP0297648B1/de not_active Expired - Lifetime
- 1988-06-20 DE DE88201242T patent/DE3885160T2/de not_active Expired - Fee Related
- 1988-06-22 US US07/210,049 patent/US4897369A/en not_active Expired - Lifetime
- 1988-06-28 JP JP63158213A patent/JPH01220832A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
IT8706615A0 (it) | 1987-06-29 |
US4897369A (en) | 1990-01-30 |
DE3885160D1 (de) | 1993-12-02 |
EP0297648A3 (en) | 1990-05-30 |
JPH01220832A (ja) | 1989-09-04 |
EP0297648A2 (de) | 1989-01-04 |
IT1229640B (it) | 1991-09-04 |
EP0297648B1 (de) | 1993-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |