IT1229640B - Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura - Google Patents

Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura

Info

Publication number
IT1229640B
IT1229640B IT8706615A IT661587A IT1229640B IT 1229640 B IT1229640 B IT 1229640B IT 8706615 A IT8706615 A IT 8706615A IT 661587 A IT661587 A IT 661587A IT 1229640 B IT1229640 B IT 1229640B
Authority
IT
Italy
Prior art keywords
slices
semiconductive material
related equipment
conformation process
edge conformation
Prior art date
Application number
IT8706615A
Other languages
English (en)
Other versions
IT8706615A0 (it
Inventor
Beretta Giorgio
Inserra Antonino
Original Assignee
S G S Microelettronica S P A O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S G S Microelettronica S P A O filed Critical S G S Microelettronica S P A O
Priority to IT8706615A priority Critical patent/IT1229640B/it
Publication of IT8706615A0 publication Critical patent/IT8706615A0/it
Priority to EP88201242A priority patent/EP0297648B1/en
Priority to DE88201242T priority patent/DE3885160T2/de
Priority to US07/210,049 priority patent/US4897369A/en
Priority to JP63158213A priority patent/JPH01220832A/ja
Application granted granted Critical
Publication of IT1229640B publication Critical patent/IT1229640B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
IT8706615A 1987-06-29 1987-06-29 Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura IT1229640B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8706615A IT1229640B (it) 1987-06-29 1987-06-29 Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura
EP88201242A EP0297648B1 (en) 1987-06-29 1988-06-20 Method of shaping the edges of slices of semiconductor material and corresponding apparatus
DE88201242T DE3885160T2 (de) 1987-06-29 1988-06-20 Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur.
US07/210,049 US4897369A (en) 1987-06-29 1988-06-22 Method for shaping the edges of slices of semiconductor material
JP63158213A JPH01220832A (ja) 1987-06-29 1988-06-28 半導体材料薄片の端縁を形成する方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8706615A IT1229640B (it) 1987-06-29 1987-06-29 Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura

Publications (2)

Publication Number Publication Date
IT8706615A0 IT8706615A0 (it) 1987-06-29
IT1229640B true IT1229640B (it) 1991-09-04

Family

ID=11121454

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8706615A IT1229640B (it) 1987-06-29 1987-06-29 Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura

Country Status (5)

Country Link
US (1) US4897369A (it)
EP (1) EP0297648B1 (it)
JP (1) JPH01220832A (it)
DE (1) DE3885160T2 (it)
IT (1) IT1229640B (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2645478B2 (ja) * 1988-10-07 1997-08-25 富士通株式会社 半導体装置の製造方法
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
JPH0715897B2 (ja) * 1991-11-20 1995-02-22 株式会社エンヤシステム ウエ−ハ端面エッチング方法及び装置
JP2628424B2 (ja) * 1992-01-24 1997-07-09 信越半導体株式会社 ウエーハ面取部の研磨方法及び装置
US5424224A (en) * 1993-01-19 1995-06-13 Texas Instruments Incorporated Method of surface protection of a semiconductor wafer during polishing
US5595522A (en) * 1994-01-04 1997-01-21 Texas Instruments Incorporated Semiconductor wafer edge polishing system and method
EP0694957B1 (en) * 1994-07-29 2001-11-07 STMicroelectronics S.r.l. Method for wet processing of semiconductor wafers
US6523553B1 (en) 1999-03-30 2003-02-25 Applied Materials, Inc. Wafer edge cleaning method and apparatus
US6465353B1 (en) * 2000-09-29 2002-10-15 International Rectifier Corporation Process of thinning and blunting semiconductor wafer edge and resulting wafer
US20050211379A1 (en) * 2004-03-29 2005-09-29 Hung-Wen Su Apparatus and method for removing metal from wafer edge
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
JP4993721B2 (ja) * 2007-07-02 2012-08-08 シャープ株式会社 薄板処理方法および薄板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951728A (en) * 1974-07-30 1976-04-20 Hitachi, Ltd. Method of treating semiconductor wafers
JPS5433676A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Wafer processing unit
JPS55143037A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Treating method of semiconductor complex
JPS5928036Y2 (ja) * 1980-07-15 1984-08-14 信越化学工業株式会社 化学エツチング処理装置
JPS5958827A (ja) * 1982-09-28 1984-04-04 Toshiba Corp 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置
JPS59117123A (ja) * 1982-12-23 1984-07-06 Toshiba Corp レジスト除去装置
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法

Also Published As

Publication number Publication date
DE3885160D1 (de) 1993-12-02
US4897369A (en) 1990-01-30
EP0297648A2 (en) 1989-01-04
DE3885160T2 (de) 1994-04-07
EP0297648A3 (en) 1990-05-30
JPH01220832A (ja) 1989-09-04
EP0297648B1 (en) 1993-10-27
IT8706615A0 (it) 1987-06-29

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970628