DE1521287A1 - Verfahren zur Herstellung von Halbleiteranordnungen - Google Patents

Verfahren zur Herstellung von Halbleiteranordnungen

Info

Publication number
DE1521287A1
DE1521287A1 DE19651521287 DE1521287A DE1521287A1 DE 1521287 A1 DE1521287 A1 DE 1521287A1 DE 19651521287 DE19651521287 DE 19651521287 DE 1521287 A DE1521287 A DE 1521287A DE 1521287 A1 DE1521287 A1 DE 1521287A1
Authority
DE
Germany
Prior art keywords
layer
metal
cover layer
aluminum
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19651521287
Other languages
German (de)
English (en)
Inventor
Yasuo Ebisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE1521287A1 publication Critical patent/DE1521287A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
    • F16D33/00—Rotary fluid couplings or clutches of the hydrokinetic type
    • F16D33/06—Rotary fluid couplings or clutches of the hydrokinetic type controlled by changing the amount of liquid in the working circuit
    • F16D33/08—Rotary fluid couplings or clutches of the hydrokinetic type controlled by changing the amount of liquid in the working circuit by devices incorporated in the fluid coupling, with or without remote control
    • F16D33/14—Rotary fluid couplings or clutches of the hydrokinetic type controlled by changing the amount of liquid in the working circuit by devices incorporated in the fluid coupling, with or without remote control consisting of shiftable or adjustable scoops
    • H10P76/202—
    • H10W20/40—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/934—
    • H10W72/952—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE19651521287 1964-12-17 1965-12-15 Verfahren zur Herstellung von Halbleiteranordnungen Pending DE1521287A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7074064 1964-12-17

Publications (1)

Publication Number Publication Date
DE1521287A1 true DE1521287A1 (de) 1969-05-14

Family

ID=13440196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19651521287 Pending DE1521287A1 (de) 1964-12-17 1965-12-15 Verfahren zur Herstellung von Halbleiteranordnungen

Country Status (4)

Country Link
US (1) US3412456A (enExample)
DE (1) DE1521287A1 (enExample)
GB (1) GB1070303A (enExample)
NL (2) NL6516486A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532540A (en) * 1967-10-26 1970-10-06 Ncr Co Differential adhesion process for making high resolution thin film patterns
US3623961A (en) * 1968-01-12 1971-11-30 Philips Corp Method of providing an electric connection to a surface of an electronic device and device obtained by said method
DE1932164B2 (de) * 1968-07-15 1972-04-06 International Business Machines Corp , Armonk, NY (V St A ) Verfahren zum einlegieren von metall in teilbereiche eines insbesondere aus halbleitermaterial bestehenden substrats
US3567508A (en) * 1968-10-31 1971-03-02 Gen Electric Low temperature-high vacuum contact formation process
US3767491A (en) * 1970-10-27 1973-10-23 Cogar Corp Process for etching metals employing ultrasonic vibration
US3784379A (en) * 1971-12-02 1974-01-08 Itt Method of laminating one or more materials with a base structure for use in a high vacuum electron tube and method of masking the base preparatory to lamination
JPS4960870A (enExample) * 1972-10-16 1974-06-13
JPS57130430A (en) 1981-02-06 1982-08-12 Nippon Telegr & Teleph Corp <Ntt> Pattern formation
US4451968A (en) * 1981-09-08 1984-06-05 Texas Instruments Incorporated Method and device for providing an ohmic contact of high resistance on a semiconductor at low temperatures
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
US5478779A (en) 1994-03-07 1995-12-26 Micron Technology, Inc. Electrically conductive projections and semiconductor processing method of forming same
US6797586B2 (en) * 2001-06-28 2004-09-28 Koninklijke Philips Electronics N.V. Silicon carbide schottky barrier diode and method of making
FR2946462B1 (fr) * 2009-06-09 2011-07-01 Commissariat Energie Atomique Procede de realisation d'au moins un microcomposant avec un masque unique

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2849583A (en) * 1952-07-19 1958-08-26 Pritikin Nathan Electrical resistor and method and apparatus for producing resistors
US2879188A (en) * 1956-03-05 1959-03-24 Westinghouse Electric Corp Processes for making transistors
US2994621A (en) * 1956-03-29 1961-08-01 Baldwin Piano Co Semi-conductive films and methods of producing them
USB778836I5 (enExample) * 1958-12-08
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3230109A (en) * 1961-12-18 1966-01-18 Bell Telephone Labor Inc Vapor deposition method and apparatus
US3170810A (en) * 1962-05-24 1965-02-23 Western Electric Co Methods of and apparatus for forming substances on preselected areas of substrates
US3281815A (en) * 1963-07-29 1966-10-25 Ford Motor Co Liquid level sensing system

Also Published As

Publication number Publication date
GB1070303A (en) 1967-06-01
US3412456A (en) 1968-11-26
NL6516486A (enExample) 1966-06-20
NL132313C (enExample) 1900-01-01

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