DE1248810C2 - Halbleiterbauelement mit Lackschutzschicht - Google Patents
Halbleiterbauelement mit LackschutzschichtInfo
- Publication number
- DE1248810C2 DE1248810C2 DE1959S0061433 DES0061433A DE1248810C2 DE 1248810 C2 DE1248810 C2 DE 1248810C2 DE 1959S0061433 DE1959S0061433 DE 1959S0061433 DE S0061433 A DES0061433 A DE S0061433A DE 1248810 C2 DE1248810 C2 DE 1248810C2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- additive
- semiconductor component
- paint
- german
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Paints Or Removers (AREA)
- Thermistors And Varistors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL127388D NL127388C (OSRAM) | 1959-01-21 | ||
| NL247076D NL247076A (OSRAM) | 1959-01-21 | ||
| DE1959S0061433 DE1248810C2 (de) | 1959-01-21 | 1959-01-21 | Halbleiterbauelement mit Lackschutzschicht |
| FR813091A FR1291525A (fr) | 1959-01-21 | 1959-12-15 | Procédé de fabrication de dispositifs semi-conducteurs à jonctions p-n tels que des redresseurs ou des transistors à jonctions |
| CH23560A CH392696A (de) | 1959-01-21 | 1960-01-11 | Verfahren zur Herstellung einer Halbleiteranordnung mit p-n-Übergang, welcher mit einer Lackschutzschicht versehen ist |
| GB2310/60A GB889318A (en) | 1959-01-21 | 1960-01-21 | A semi-conductor device having a p-n-junction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1959S0061433 DE1248810C2 (de) | 1959-01-21 | 1959-01-21 | Halbleiterbauelement mit Lackschutzschicht |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE1248810B DE1248810B (OSRAM) | 1967-08-31 |
| DE1248810C2 true DE1248810C2 (de) | 1968-03-14 |
Family
ID=37436691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1959S0061433 Expired DE1248810C2 (de) | 1959-01-21 | 1959-01-21 | Halbleiterbauelement mit Lackschutzschicht |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH392696A (OSRAM) |
| DE (1) | DE1248810C2 (OSRAM) |
| FR (1) | FR1291525A (OSRAM) |
| GB (1) | GB889318A (OSRAM) |
| NL (2) | NL247076A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1764738B1 (de) * | 1968-07-27 | 1970-09-24 | Siemens Ag | Halbleiterbauelement mit einem UEberzug aus bleihaltigem Isolierstoff am pn-UEbergang |
-
0
- NL NL127388D patent/NL127388C/xx active
- NL NL247076D patent/NL247076A/xx unknown
-
1959
- 1959-01-21 DE DE1959S0061433 patent/DE1248810C2/de not_active Expired
- 1959-12-15 FR FR813091A patent/FR1291525A/fr not_active Expired
-
1960
- 1960-01-11 CH CH23560A patent/CH392696A/de unknown
- 1960-01-21 GB GB2310/60A patent/GB889318A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL247076A (OSRAM) | 1900-01-01 |
| CH392696A (de) | 1965-05-31 |
| NL127388C (OSRAM) | 1900-01-01 |
| DE1248810B (OSRAM) | 1967-08-31 |
| FR1291525A (fr) | 1962-04-27 |
| GB889318A (en) | 1962-02-14 |
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