DE1244310B - Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten - Google Patents

Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten

Info

Publication number
DE1244310B
DE1244310B DEJ23808A DEJ0023808A DE1244310B DE 1244310 B DE1244310 B DE 1244310B DE J23808 A DEJ23808 A DE J23808A DE J0023808 A DEJ0023808 A DE J0023808A DE 1244310 B DE1244310 B DE 1244310B
Authority
DE
Germany
Prior art keywords
layer
insulating layer
layers
thickness
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DEJ23808A
Other languages
German (de)
English (en)
Inventor
Rudolf Eduard Thun
Edward Stanley Wajda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1244310B publication Critical patent/DE1244310B/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/28Non-electron-emitting electrodes; Screens
    • H01J19/30Non-electron-emitting electrodes; Screens characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0001Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012Constructional arrangements
    • H01J2893/0019Chemical composition and manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Bipolar Transistors (AREA)
  • Insulating Bodies (AREA)
  • Cold Cathode And The Manufacture (AREA)
DEJ23808A 1962-06-01 1963-06-01 Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten Withdrawn DE1244310B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19944962A 1962-06-01 1962-06-01
US199450A US3202543A (en) 1962-06-01 1962-06-01 Method of forming a thin film grid

Publications (1)

Publication Number Publication Date
DE1244310B true DE1244310B (de) 1967-07-13

Family

ID=26894786

Family Applications (2)

Application Number Title Priority Date Filing Date
DEJ23808A Withdrawn DE1244310B (de) 1962-06-01 1963-06-01 Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten
DEJ23809A Pending DE1246898B (de) 1962-06-01 1963-06-01 Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente

Family Applications After (1)

Application Number Title Priority Date Filing Date
DEJ23809A Pending DE1246898B (de) 1962-06-01 1963-06-01 Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente

Country Status (9)

Country Link
US (1) US3202543A (en:Method)
BE (1) BE633151A (en:Method)
CH (2) CH413114A (en:Method)
DE (2) DE1244310B (en:Method)
DK (1) DK126462B (en:Method)
FR (2) FR1357559A (en:Method)
GB (1) GB994241A (en:Method)
NL (1) NL293391A (en:Method)
SE (1) SE321990B (en:Method)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022928A (en) * 1975-05-22 1977-05-10 Piwcyzk Bernhard P Vacuum deposition methods and masking structure
SU1005223A1 (ru) * 1980-05-16 1983-03-15 Ордена Трудового Красного Знамени Институт Радиотехники И Электроники Ан Ссср Полупроводниковое запоминающее устройство
US4978558A (en) * 1988-06-10 1990-12-18 United Technologies Corporation Method for applying diffusion coating masks
DE10006738C2 (de) 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
US7205578B2 (en) * 2000-02-15 2007-04-17 Osram Gmbh Semiconductor component which emits radiation, and method for producing the same
DE20111659U1 (de) * 2000-05-23 2001-12-13 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Bauelement für die Optoelektronik
KR100831843B1 (ko) * 2006-11-07 2008-05-22 주식회사 실트론 금속층 위에 성장된 화합물 반도체 기판, 그 제조 방법 및이를 이용한 화합물 반도체 소자
EP2177644A1 (en) 2008-10-14 2010-04-21 Applied Materials, Inc. Coating of masked substrates
CN110981479B (zh) * 2020-01-10 2022-03-01 陕西科技大学 一种高击穿的铁电陶瓷及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1266933A (fr) * 1959-09-09 1961-07-17 Ass Elect Ind Perfectionnements aux dispositifs à semi-conducteurs

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB500342A (en) * 1937-09-18 1939-02-07 British Thomson Houston Co Ltd Improvements relating to dry surface-contact electric rectifiers
GB500344A (en) * 1937-09-22 1939-02-07 British Thomson Houston Co Ltd Improvements in and relating to dry surface-contact electric rectifiers
CH307776A (de) * 1952-01-08 1955-06-15 Ericsson Telefon Ab L M Kontaktvorrichtung an einem Halbleiterelement.
US2815462A (en) * 1953-05-19 1957-12-03 Electronique Sa Soc Gen Method of forming a film supported a short distance from a surface and cathode-ray tube incorporating such film
US2906637A (en) * 1953-05-19 1959-09-29 Electronique Soc Gen Method of forming a film a short distance from a surface

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1266933A (fr) * 1959-09-09 1961-07-17 Ass Elect Ind Perfectionnements aux dispositifs à semi-conducteurs

Also Published As

Publication number Publication date
DK126462B (da) 1973-07-16
SE321990B (en:Method) 1970-03-23
BE633151A (en:Method)
US3202543A (en) 1965-08-24
DE1246898B (de) 1967-08-10
NL293391A (en:Method)
FR1357558A (fr) 1964-04-03
FR1357559A (fr) 1964-04-03
GB994241A (en) 1965-06-02
CH413114A (de) 1966-05-15
CH415861A (de) 1966-06-30

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Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee