DE1200951B - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE1200951B
DE1200951B DES71703A DES0071703A DE1200951B DE 1200951 B DE1200951 B DE 1200951B DE S71703 A DES71703 A DE S71703A DE S0071703 A DES0071703 A DE S0071703A DE 1200951 B DE1200951 B DE 1200951B
Authority
DE
Germany
Prior art keywords
conductive
disks
piece
discs
central openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES71703A
Other languages
German (de)
English (en)
Inventor
Susumu Yoshida
Hiroji Sumiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE1200951B publication Critical patent/DE1200951B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
DES71703A 1959-12-16 1960-12-16 Halbleiteranordnung Pending DE1200951B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6506159 1959-12-16

Publications (1)

Publication Number Publication Date
DE1200951B true DE1200951B (de) 1965-09-16

Family

ID=13276045

Family Applications (1)

Application Number Title Priority Date Filing Date
DES71703A Pending DE1200951B (de) 1959-12-16 1960-12-16 Halbleiteranordnung

Country Status (4)

Country Link
US (1) US3114866A (https=)
DE (1) DE1200951B (https=)
GB (1) GB910979A (https=)
NL (2) NL121501C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2876401A (en) * 1955-09-12 1959-03-03 Pye Ltd Semi-conductor devices
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495353A (en) * 1950-01-24 Mounting arrangement for circuit
NL94441C (https=) * 1951-09-15
NL87784C (https=) * 1953-10-23 1958-04-15
US2894183A (en) * 1956-05-01 1959-07-07 Sprague Electric Co Transistor sub-assembly
US3001113A (en) * 1959-10-06 1961-09-19 Rca Corp Semiconductor device assemblies

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
US2876401A (en) * 1955-09-12 1959-03-03 Pye Ltd Semi-conductor devices
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same

Also Published As

Publication number Publication date
US3114866A (en) 1963-12-17
NL258551A (https=)
GB910979A (en) 1962-11-21
NL121501C (https=)

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