DE1166383B - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE1166383B
DE1166383B DES67967A DES0067967A DE1166383B DE 1166383 B DE1166383 B DE 1166383B DE S67967 A DES67967 A DE S67967A DE S0067967 A DES0067967 A DE S0067967A DE 1166383 B DE1166383 B DE 1166383B
Authority
DE
Germany
Prior art keywords
carrier plate
semiconductor
metal
semiconductor arrangement
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES67967A
Other languages
German (de)
English (en)
Inventor
Dr Phil Nat Norbert Schink
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL262292D priority Critical patent/NL262292A/xx
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES67967A priority patent/DE1166383B/de
Priority to FR857945A priority patent/FR1331331A/fr
Priority to GB1291561A priority patent/GB914034A/en
Publication of DE1166383B publication Critical patent/DE1166383B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Fuses (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DES67967A 1960-04-08 1960-04-08 Halbleiteranordnung Pending DE1166383B (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
NL262292D NL262292A (enrdf_load_stackoverflow) 1960-04-08
DES67967A DE1166383B (de) 1960-04-08 1960-04-08 Halbleiteranordnung
FR857945A FR1331331A (fr) 1960-04-08 1961-04-06 Dispositif semiconducteur
GB1291561A GB914034A (en) 1960-04-08 1961-04-10 A semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES67967A DE1166383B (de) 1960-04-08 1960-04-08 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
DE1166383B true DE1166383B (de) 1964-03-26

Family

ID=7499943

Family Applications (1)

Application Number Title Priority Date Filing Date
DES67967A Pending DE1166383B (de) 1960-04-08 1960-04-08 Halbleiteranordnung

Country Status (3)

Country Link
DE (1) DE1166383B (enrdf_load_stackoverflow)
GB (1) GB914034A (enrdf_load_stackoverflow)
NL (1) NL262292A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US3800190A (en) * 1970-11-02 1974-03-26 Bbc Brown Boveri & Cie Cooling system for power semiconductor devices
US4258383A (en) * 1978-12-22 1981-03-24 Rca Corporation Minimum pressure drop liquid cooled structure for a semiconductor device
US7348665B2 (en) * 2004-08-13 2008-03-25 Intel Corporation Liquid metal thermal interface for an integrated circuit device
EP4376074A1 (en) * 2022-11-25 2024-05-29 Infineon Technologies AG Conductor rail, and power semiconductor module arrangement comprising a conductor rail

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1030462B (de) * 1956-11-10 1958-05-22 Bosch Gmbh Robert Halbleitergleichrichter fuer hohe Stromstaerken
DE1041600B (de) * 1956-10-02 1958-10-23 Siemens Ag In einem metallischen Gehaeuse eingebautes, waermeempfindliches, elektrisches Halbleiterbauelement, wie Leistungstransistor oder Richtleiter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1041600B (de) * 1956-10-02 1958-10-23 Siemens Ag In einem metallischen Gehaeuse eingebautes, waermeempfindliches, elektrisches Halbleiterbauelement, wie Leistungstransistor oder Richtleiter
DE1030462B (de) * 1956-11-10 1958-05-22 Bosch Gmbh Robert Halbleitergleichrichter fuer hohe Stromstaerken

Also Published As

Publication number Publication date
GB914034A (en) 1962-12-28
NL262292A (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
DE102006002452B4 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
DE2749848C3 (de) Wärmebrücke einer in einem Gehäuse eingekapselten integrierten Schaltung
DE10066442B4 (de) Halbleitervorrichtung mit Abstrahlungs-Struktur
DE3221199C2 (enrdf_load_stackoverflow)
DE2816249C3 (de) Verfahren zum Vorbereiten eines Kupfer-Kohlenstoffasern-Verbundwerkstoffs zum Verlöten mit einem Bauteil
DE1128924B (de) Verfahren zur Herstellung einer Halbleiteranordnung aus Silizium
DE1166383B (de) Halbleiteranordnung
DE1236660B (de) Halbleiteranordnung mit einem plattenfoermigen, im wesentlichen einkristallinen halbleiterkoerper
DE1263190B (de) Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
DE10334116A1 (de) Strahlungssystem, Strahlungsverfahren, Wärmepuffer, Halbleitermodul, Wärmeverteilungseinrichtung und Substrat
DE102006005271A1 (de) Lötlegierung und eine unter Verwendung derselben hergestellte Halbleitervorrichtung
DE1213922C2 (de) Verfahren zur Herstellung einer leicht benetzbaren Metallschicht auf einer keramischen Unterlage fuer Halbleiterbauelemente
DE1113519B (de) Siliziumgleichrichter fuer hohe Stromstaerken
DE1153461B (de) Halbleiteranordnung
DE1277967C2 (de) Verfahren zur Herstellung einer Halbleiteranordnung, insbesondere einer thermoelektrischen Halbleiteranordnung
DE1539652A1 (de) Halbleiteranordnung
AT232132B (de) Halbleiteranordnung
DE1614653C3 (de) Halbleiteranordnung hoher Strombelastbarkeit
AT234842B (de) In ein Gehäuse eingeschlossene Halbleiteranordnung
DE1166940B (de) Halbleiterbauelement mit einem im wesentlichen einkristallinen Halbleiterkoerper und vier Zonen abwechselnden Leitfaehigkeitstyps und Verfahren zum Herstellen
DE1116827B (de) Verfahren zur Herstellung einer Halbleiteranordnung mit mindestens einer Legierungselektrode
DE1191044B (de) Verfahren zur Herstellung von Halbleiteranordnungen, wie Silizium-Flaechengleichrichter, -Transistoren oder Halbleiterstromtore
AT227840B (de) Halbleiteranordnung
DE1200102B (de) Verfahren zur Herstellung eines Halbleiter-bauelementes
DE1125553B (de) Verfahren zum Herstellen einer mit einlegierten Elektroden versehenen Halbleiteranordnung