GB914034A - A semi-conductor device - Google Patents
A semi-conductor deviceInfo
- Publication number
- GB914034A GB914034A GB1291561A GB1291561A GB914034A GB 914034 A GB914034 A GB 914034A GB 1291561 A GB1291561 A GB 1291561A GB 1291561 A GB1291561 A GB 1291561A GB 914034 A GB914034 A GB 914034A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- liquid
- conductor device
- potassium
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Fuses (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES67967A DE1166383B (de) | 1960-04-08 | 1960-04-08 | Halbleiteranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB914034A true GB914034A (en) | 1962-12-28 |
Family
ID=7499943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1291561A Expired GB914034A (en) | 1960-04-08 | 1961-04-10 | A semi-conductor device |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1166383B (enrdf_load_stackoverflow) |
| GB (1) | GB914034A (enrdf_load_stackoverflow) |
| NL (1) | NL262292A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
| US3408451A (en) * | 1965-09-01 | 1968-10-29 | Texas Instruments Inc | Electrical device package |
| US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
| US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
| US3800190A (en) * | 1970-11-02 | 1974-03-26 | Bbc Brown Boveri & Cie | Cooling system for power semiconductor devices |
| US4258383A (en) * | 1978-12-22 | 1981-03-24 | Rca Corporation | Minimum pressure drop liquid cooled structure for a semiconductor device |
| WO2006020332A1 (en) * | 2004-08-13 | 2006-02-23 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
| EP4376074A1 (en) * | 2022-11-25 | 2024-05-29 | Infineon Technologies AG | Conductor rail, and power semiconductor module arrangement comprising a conductor rail |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1041600B (de) * | 1956-10-02 | 1958-10-23 | Siemens Ag | In einem metallischen Gehaeuse eingebautes, waermeempfindliches, elektrisches Halbleiterbauelement, wie Leistungstransistor oder Richtleiter |
| DE1030462B (de) * | 1956-11-10 | 1958-05-22 | Bosch Gmbh Robert | Halbleitergleichrichter fuer hohe Stromstaerken |
-
0
- NL NL262292D patent/NL262292A/xx unknown
-
1960
- 1960-04-08 DE DES67967A patent/DE1166383B/de active Pending
-
1961
- 1961-04-10 GB GB1291561A patent/GB914034A/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3408451A (en) * | 1965-09-01 | 1968-10-29 | Texas Instruments Inc | Electrical device package |
| US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
| US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
| US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
| US3800190A (en) * | 1970-11-02 | 1974-03-26 | Bbc Brown Boveri & Cie | Cooling system for power semiconductor devices |
| US4258383A (en) * | 1978-12-22 | 1981-03-24 | Rca Corporation | Minimum pressure drop liquid cooled structure for a semiconductor device |
| WO2006020332A1 (en) * | 2004-08-13 | 2006-02-23 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
| US7348665B2 (en) | 2004-08-13 | 2008-03-25 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
| EP4376074A1 (en) * | 2022-11-25 | 2024-05-29 | Infineon Technologies AG | Conductor rail, and power semiconductor module arrangement comprising a conductor rail |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1166383B (de) | 1964-03-26 |
| NL262292A (enrdf_load_stackoverflow) |
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