DE1143075B - Verfahren zum galvanischen Abscheiden von Kupfer- und Kupferlegierung? - Google Patents
Verfahren zum galvanischen Abscheiden von Kupfer- und Kupferlegierung?Info
- Publication number
- DE1143075B DE1143075B DEM37960A DEM0037960A DE1143075B DE 1143075 B DE1143075 B DE 1143075B DE M37960 A DEM37960 A DE M37960A DE M0037960 A DEM0037960 A DE M0037960A DE 1143075 B DE1143075 B DE 1143075B
- Authority
- DE
- Germany
- Prior art keywords
- bath
- copper
- liter
- gluconate
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 17
- 229910052802 copper Inorganic materials 0.000 title claims description 17
- 239000010949 copper Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 10
- 238000004070 electrodeposition Methods 0.000 title claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 10
- 229940050410 gluconate Drugs 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 8
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical class [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 5
- HLCFGWHYROZGBI-JJKGCWMISA-M Potassium gluconate Chemical compound [K+].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O HLCFGWHYROZGBI-JJKGCWMISA-M 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004224 potassium gluconate Substances 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007792 addition Methods 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- XKGUZGHMWUIYDR-UHFFFAOYSA-N benzyl n-(3-fluoro-4-morpholin-4-ylphenyl)carbamate Chemical compound C=1C=C(N2CCOCC2)C(F)=CC=1NC(=O)OCC1=CC=CC=C1 XKGUZGHMWUIYDR-UHFFFAOYSA-N 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229940108925 copper gluconate Drugs 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- 239000010953 base metal Substances 0.000 claims 3
- 229910000831 Steel Inorganic materials 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- XGRYDJSRYGHYOO-UHFFFAOYSA-N Thesine Natural products C1=CC(O)=CC=C1C1C(C(=O)OCC2C3CCCN3CC2)C(C=2C=CC(O)=CC=2)C1C(=O)OCC1C2CCCN2CC1 XGRYDJSRYGHYOO-UHFFFAOYSA-N 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 229910052792 caesium Inorganic materials 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 239000001509 sodium citrate Substances 0.000 claims 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims 1
- 159000000000 sodium salts Chemical class 0.000 claims 1
- -1 alkali metal cyanide Chemical class 0.000 description 6
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 229960003189 potassium gluconate Drugs 0.000 description 4
- 235000013926 potassium gluconate Nutrition 0.000 description 4
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 229940074439 potassium sodium tartrate Drugs 0.000 description 2
- 239000000176 sodium gluconate Substances 0.000 description 2
- 235000012207 sodium gluconate Nutrition 0.000 description 2
- 229940005574 sodium gluconate Drugs 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- VGGUVGVAVAAODK-ZROIWOOFSA-N (5z)-2-amino-5-[(3-cyclopentyloxy-4-methoxyphenyl)methylidene]-1,3-thiazol-4-one Chemical compound C1=C(OC2CCCC2)C(OC)=CC=C1\C=C1/SC(=N)NC1=O VGGUVGVAVAAODK-ZROIWOOFSA-N 0.000 description 1
- ZOBPZXTWZATXDG-UHFFFAOYSA-N 1,3-thiazolidine-2,4-dione Chemical compound O=C1CSC(=O)N1 ZOBPZXTWZATXDG-UHFFFAOYSA-N 0.000 description 1
- IPDWABJNXLNLRA-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;2-hydroxypropane-1,2,3-tricarboxylic acid Chemical compound OC(=O)C(O)C(O)C(O)=O.OC(=O)CC(O)(C(O)=O)CC(O)=O IPDWABJNXLNLRA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ICPMTQOYWXXMIG-OPDGVEILSA-K aluminum;(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoate Chemical compound [Al+3].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O ICPMTQOYWXXMIG-OPDGVEILSA-K 0.000 description 1
- 150000001462 antimony Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003892 tartrate salts Chemical class 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 210000001550 testis Anatomy 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US666773A US2916423A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper and copper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1143075B true DE1143075B (de) | 1963-01-31 |
Family
ID=24675413
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEM37961A Pending DE1109000B (de) | 1957-06-19 | 1958-06-18 | Bad zum galvanischen Abscheiden von Kupfer- und Kupferlegierungsueberzuegen |
| DEM37960A Pending DE1143075B (de) | 1957-06-19 | 1958-06-18 | Verfahren zum galvanischen Abscheiden von Kupfer- und Kupferlegierung? |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEM37961A Pending DE1109000B (de) | 1957-06-19 | 1958-06-18 | Bad zum galvanischen Abscheiden von Kupfer- und Kupferlegierungsueberzuegen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US2916423A (fr) |
| DE (2) | DE1109000B (fr) |
| FR (1) | FR1210750A (fr) |
| GB (1) | GB836978A (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4310392A (en) * | 1979-12-31 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Electrolytic plating |
| US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
| US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3108006A (en) * | 1959-07-13 | 1963-10-22 | M & T Chemicals Inc | Plating on aluminum |
| US3930965A (en) * | 1974-03-18 | 1976-01-06 | Mcgean Chemical Company, Inc. | Zinc-copper alloy electroplating baths |
| DE4324995C2 (de) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
| EP1461478B1 (fr) * | 2000-12-20 | 2011-02-09 | Honda Giken Kogyo Kabushiki Kaisha | Film de placage composite et son procede de formation |
| US20020092673A1 (en) * | 2001-01-17 | 2002-07-18 | International Business Machines Corporation | Tungsten encapsulated copper interconnections using electroplating |
| US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
| AT514818B1 (de) | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten |
| PT3150744T (pt) | 2015-09-30 | 2020-05-12 | Coventya S P A | Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2548867A (en) * | 1945-04-14 | 1951-04-17 | Poor & Co | Electroplating metals |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US694658A (en) * | 1900-12-11 | 1902-03-04 | Jules Meurant | Electrolytic process. |
| US2287654A (en) * | 1938-05-04 | 1942-06-23 | Du Pont | Copper plating |
| US2406072A (en) * | 1941-02-15 | 1946-08-20 | Univ Ohio State Res Found | Electrodeposition of metals and bath composition therefor |
| FR960115A (fr) * | 1947-08-09 | 1950-04-13 | ||
| US2763606A (en) * | 1952-06-25 | 1956-09-18 | American Brake Shoe Co | Electrodepositing baths and plating methods |
-
1957
- 1957-06-19 US US666773A patent/US2916423A/en not_active Expired - Lifetime
-
1958
- 1958-06-06 GB GB18211/58A patent/GB836978A/en not_active Expired
- 1958-06-16 FR FR1210750D patent/FR1210750A/fr not_active Expired
- 1958-06-18 DE DEM37961A patent/DE1109000B/de active Pending
- 1958-06-18 DE DEM37960A patent/DE1143075B/de active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2548867A (en) * | 1945-04-14 | 1951-04-17 | Poor & Co | Electroplating metals |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4310392A (en) * | 1979-12-31 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Electrolytic plating |
| US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
| US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1210750A (fr) | 1960-03-10 |
| DE1109000B (de) | 1961-06-15 |
| US2916423A (en) | 1959-12-08 |
| GB836978A (en) | 1960-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2845439C2 (de) | Bad zur galvanischen Abscheidung von Überzügen aus Zinn oder Zinnlegierungen | |
| DE1143075B (de) | Verfahren zum galvanischen Abscheiden von Kupfer- und Kupferlegierung? | |
| DE832982C (de) | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Kupfer | |
| DE3601698C2 (fr) | ||
| DE1496917A1 (de) | Elektrolytbaeder sowie Verfahren fuer die Herstellung galvanischer UEberzuege | |
| DE2500730A1 (de) | Chromsaeureelektrolyt | |
| DE1017000B (de) | Bad und Verfahren fuer die elektrolytische Abscheidung von Kupferueberzuegen | |
| DE852633C (de) | Verfahren zur elektrolytischen Abscheidung von dichten, gut haftenden Kupferueberzuegen aus Baedern | |
| DE959242C (de) | Bad zur galvanischen Abscheidung von Antimon oder Antimonlegierungen | |
| DE2809636A1 (de) | Galvanisierbad auf der basis von dreiwertigem chrom | |
| DE1180140B (de) | Verfahren zur Abscheidung feinkoerniger Niederschlaege bei der Raffinations- und Reduktionselektrolyse von Nickel, Zink, Silber, Zinn, Blei und insbesondere Kupfer | |
| EP2635724B1 (fr) | Procédé de placage de chrome dur à partir d'un électrolyte sans cr(vi) | |
| DE2208327A1 (de) | Verfahren zur galvanischen Metallplattierung | |
| DE2032867C3 (de) | Galvanisches Goldbad und Verfahren zur Abscheidung gleichmäßiger, dicker Goldüberzüge | |
| DE759339C (de) | Verfahren zur elektrolytischen Herstellung von hellfarbenen, glaenzenden Zinkueberzuegen | |
| DE2249037A1 (de) | Verfahren zum plattieren von kupfer auf aluminium | |
| DE3423690A1 (de) | Waessriges bad zur abscheidung von gold und dessen verwendung bei einem galvanischen verfahren | |
| DE2251285C3 (de) | Alkalisches Bad für die galvanische Abscheidung von Goldlegierungen | |
| DE959243C (de) | Galvanisches Bad und Verfahren fuer die Abscheidung von Antimonueberzuegen | |
| DE69011549T2 (de) | Elektroplattierung von Gold enthaltenden Legierungen. | |
| DE2943399C2 (de) | Verfahren und Zusammensetzung zur galvanischen Abscheidung von Palladium | |
| DE1052771B (de) | Verfahren zum elektrolytischen Abscheiden von Platin | |
| EP0194432A1 (fr) | Bain de dépôt galvanique de couches d'alliage d'or-étain | |
| DE2948999C2 (de) | Wässriges, saures Bad zur galvanischen Abscheidung von Gold und Verfahren zur galvanischen Abscheidung von Hartgold unter seiner Verwendung | |
| DE1072449B (de) | Cyanidisches Bad zum galvanischen Abscheiden von g'änzenden Kupferüberzügen |