PT3150744T - Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido - Google Patents

Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Info

Publication number
PT3150744T
PT3150744T PT151875119T PT15187511T PT3150744T PT 3150744 T PT3150744 T PT 3150744T PT 151875119 T PT151875119 T PT 151875119T PT 15187511 T PT15187511 T PT 15187511T PT 3150744 T PT3150744 T PT 3150744T
Authority
PT
Portugal
Prior art keywords
alloy
substrate
electrochemical deposition
electroplating bath
electrochemical
Prior art date
Application number
PT151875119T
Other languages
English (en)
Original Assignee
Coventya S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54249387&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT3150744(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Coventya S P A filed Critical Coventya S P A
Publication of PT3150744T publication Critical patent/PT3150744T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PT151875119T 2015-09-30 2015-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido PT3150744T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15187511.9A EP3150744B1 (en) 2015-09-30 2015-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate

Publications (1)

Publication Number Publication Date
PT3150744T true PT3150744T (pt) 2020-05-12

Family

ID=54249387

Family Applications (2)

Application Number Title Priority Date Filing Date
PT151875119T PT3150744T (pt) 2015-09-30 2015-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
PT167782846T PT3356579T (pt) 2015-09-30 2016-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Family Applications After (1)

Application Number Title Priority Date Filing Date
PT167782846T PT3356579T (pt) 2015-09-30 2016-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Country Status (5)

Country Link
EP (2) EP3150744B1 (pt)
CN (1) CN108138346B (pt)
ES (2) ES2790583T3 (pt)
PT (2) PT3150744T (pt)
WO (1) WO2017055553A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3150744B1 (en) 2015-09-30 2020-02-12 COVENTYA S.p.A. Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
IT201800004235A1 (it) * 2018-04-05 2019-10-05 Lega di bronzo bianco, bagno galvanico e procedimento al fine di produrre la lega di bronzo bianco tramite deposizione elettrogalvanica
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
IT202000011203A1 (it) * 2020-05-15 2021-11-15 Bluclad S P A Lega di bronzo inossidabile e suo impiego in prodotti galvanizzati
FR3118067B1 (fr) * 2020-12-18 2023-05-26 Linxens Holding Procédé de dépôt d’un alliage de bronze sur un circuit imprimé et circuit imprimé obtenu par ce procédé

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2916423A (en) 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
US3440151A (en) 1965-06-02 1969-04-22 Robert Duva Electrodeposition of copper-tin alloys
BE805602A (en) 1973-10-03 1974-02-01 Johnson Matthey Co Ltd Cyanide-free gold electroplating bath - contg alkali metal gold complex and complexing agent and additives
CH662583A5 (fr) 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
JP3029948B2 (ja) 1993-04-07 2000-04-10 シチズン時計株式会社 Ｓｎ−Ｃｕ−Ｐｄ合金めっき部材、その製造に用いるめっき浴
JPH0827590A (ja) 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd 光沢銅−錫合金めっき浴
CN1097644C (zh) 1995-12-07 2003-01-01 西铁城钟表有限公司 装饰件
KR100270349B1 (ko) 1995-12-07 2000-11-01 하루타 히로시 장식부재
JP2977503B2 (ja) 1997-02-13 1999-11-15 株式会社ビクトリア 銅−パラジウム系合金メッキ液及びメッキ基材
JP4642317B2 (ja) * 2000-06-27 2011-03-02 シチズンホールディングス株式会社 白色被膜を有する装飾品
CN101096769A (zh) 2006-06-26 2008-01-02 比亚迪股份有限公司 一种电镀方法
EP1930478B1 (en) 2006-12-06 2013-06-19 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
JP5642928B2 (ja) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
EP2975143B1 (de) 2011-03-09 2018-12-19 SAXONIA Technical Materials GmbH Verfahren zur herstellung von amalgamkugeln
EP2757180B1 (en) 2013-01-18 2015-08-12 Valmet Plating S.R.L. A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process
EP2799595A1 (de) 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
AT514818B1 (de) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
ITUB20152876A1 (it) * 2015-08-05 2017-02-05 Bluclad S R L Leghe stagno/rame contenenti palladio, metodo per la loro preparazione e loro uso.
EP3150744B1 (en) 2015-09-30 2020-02-12 COVENTYA S.p.A. Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate

Also Published As

Publication number Publication date
CN108138346B (zh) 2021-03-05
ES2791197T3 (es) 2020-11-03
WO2017055553A1 (en) 2017-04-06
CN108138346A (zh) 2018-06-08
EP3150744B1 (en) 2020-02-12
EP3356579B1 (en) 2020-03-11
ES2790583T3 (es) 2020-10-28
PT3356579T (pt) 2020-06-16
EP3356579A1 (en) 2018-08-08
EP3150744A1 (en) 2017-04-05

Similar Documents

Publication Publication Date Title
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
SG10201607132XA (en) Plating Apparatus, Plating Method, And Substrate Holder
EP3042985A4 (en) ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN
EP3149222A4 (en) Plating or coating method for producing metal-ceramic coating on a substrate
HK1199910A1 (zh) 製造耐腐蝕、光澤、金屬塗覆基材的方法，該金屬塗覆基材，及其用途
ZA201707420B (en) Method for nickel-free phosphating metal surfaces
PT2852698T (pt) Banho de galvanoplastia de níquel ou liga de níquel galvânico para depositar um níquel ou liga de níquel semibrilhante, método para a galvanoplastia e utilização de um tal banho e compostos para o mesmo
EP3514859A4 (en) ELECTROPLATING SOLUTION FOR LITHIUM METAL AND METHOD FOR PRODUCING A LITHIUM METAL ELECTRODE THEREWITH
EP3042984A4 (en) ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN
EP3156522A4 (en) Tin electroplating bath and tin plating film
ZA201903049B (en) Method for electroplating an uncoated steel strip with a plating layer
PL3611294T3 (pl) Sposób galwanizacji
EP3396009A4 (en) METALLIC STEEL SHEET HAVING A FINE AND REGULAR METALLIZATION STRUCTURE AND METHOD FOR MANUFACTURING METALLIC STEEL SHEET
EP3178968A4 (en) Copper-nickel alloy electroplating bath
EP3196263A4 (en) Electrodeposition liquid, metal core substrate, and process for producing metal core substrate
EP3212823A4 (en) Plating bath solutions
PL3253906T3 (pl) Elektrolit do powlekania elektrolitycznego
EP3333278A4 (en) Molten metal plating facility and method
EP3197612A4 (en) Electrodeposition mediums for formation of protective coatings electrochemically deposited on metal substrates
EP3438317A4 (en) CONTINUOUS HOT DIP METAL PLATING DEVICE AND CONTINUOUS HOT DIP METAL PLATING METHOD
PT3117907T (pt) Processo para produção de substratos revestidos
EP3149223A4 (en) Aqueous electroless nickel plating bath and method of using the same
SI3015571T1 (sl) Kisli sestavek cinkove in zlitinske cink-nikljeve platirne kopeli in galvanizirni postopek
EP3480339A4 (en) ELECTRIC PLATINUM BATH
SG10201603626RA (en) Methods for increasing the rate of electrochemical deposition