DE112022004740T5 - Chip-Widerstand - Google Patents

Chip-Widerstand Download PDF

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Publication number
DE112022004740T5
DE112022004740T5 DE112022004740.2T DE112022004740T DE112022004740T5 DE 112022004740 T5 DE112022004740 T5 DE 112022004740T5 DE 112022004740 T DE112022004740 T DE 112022004740T DE 112022004740 T5 DE112022004740 T5 DE 112022004740T5
Authority
DE
Germany
Prior art keywords
heat transfer
layer
transfer layer
electrode
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022004740.2T
Other languages
German (de)
English (en)
Inventor
Takanori SHINOURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022004740T5 publication Critical patent/DE112022004740T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
DE112022004740.2T 2021-09-30 2022-06-16 Chip-Widerstand Pending DE112022004740T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-160318 2021-09-30
JP2021160318 2021-09-30
PCT/JP2022/024172 WO2023053594A1 (ja) 2021-09-30 2022-06-16 チップ抵抗器

Publications (1)

Publication Number Publication Date
DE112022004740T5 true DE112022004740T5 (de) 2024-07-18

Family

ID=85780556

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022004740.2T Pending DE112022004740T5 (de) 2021-09-30 2022-06-16 Chip-Widerstand

Country Status (5)

Country Link
US (1) US20240212890A1 (https=)
JP (1) JPWO2023053594A1 (https=)
CN (1) CN118020117A (https=)
DE (1) DE112022004740T5 (https=)
WO (1) WO2023053594A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024017316A (ja) * 2022-07-27 2024-02-08 株式会社村田製作所 高周波モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277638A (ja) 2007-05-01 2008-11-13 Rohm Co Ltd チップ抵抗器及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3665385B2 (ja) * 1995-05-15 2005-06-29 ローム株式会社 電子部品
JP4061729B2 (ja) * 1998-09-01 2008-03-19 松下電器産業株式会社 抵抗器およびその製造方法
JP2000277301A (ja) * 1999-03-29 2000-10-06 Taiyo Yuden Co Ltd 伝熱層を有する絶縁基板及び抵抗器
JP2007088161A (ja) * 2005-09-21 2007-04-05 Koa Corp チップ抵抗器
TW201401305A (zh) * 2012-06-25 2014-01-01 Ralec Electronic Corp 微型金屬片電阻的量產方法
JP2015079872A (ja) * 2013-10-17 2015-04-23 コーア株式会社 チップ抵抗器
US10319501B2 (en) * 2014-02-27 2019-06-11 Panasonic Intellectual Property Management Co., Ltd. Chip resistor
JP6453599B2 (ja) * 2014-09-26 2019-01-16 Koa株式会社 チップ抵抗器の製造方法
DE112018005181B4 (de) * 2017-11-02 2025-04-10 Rohm Co., Ltd. Chip-widerstand
JP7336636B2 (ja) * 2017-12-11 2023-09-01 パナソニックＩｐマネジメント株式会社 チップ抵抗器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277638A (ja) 2007-05-01 2008-11-13 Rohm Co Ltd チップ抵抗器及びその製造方法

Also Published As

Publication number Publication date
CN118020117A (zh) 2024-05-10
US20240212890A1 (en) 2024-06-27
JPWO2023053594A1 (https=) 2023-04-06
WO2023053594A1 (ja) 2023-04-06

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Legal Events

Date Code Title Description
R012 Request for examination validly filed