DE112022000758T5 - Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils - Google Patents

Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils Download PDF

Info

Publication number
DE112022000758T5
DE112022000758T5 DE112022000758.3T DE112022000758T DE112022000758T5 DE 112022000758 T5 DE112022000758 T5 DE 112022000758T5 DE 112022000758 T DE112022000758 T DE 112022000758T DE 112022000758 T5 DE112022000758 T5 DE 112022000758T5
Authority
DE
Germany
Prior art keywords
bond pad
section
back surface
thickness direction
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112022000758.3T
Other languages
German (de)
English (en)
Inventor
Yosui FUTAMURA
Shunya Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022000758T5 publication Critical patent/DE112022000758T5/de
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/041—Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Wire Bonding (AREA)
DE112022000758.3T 2021-04-01 2022-03-14 Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils Ceased DE112022000758T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-062894 2021-04-01
JP2021062894 2021-04-01
PCT/JP2022/011312 WO2022209819A1 (ja) 2021-04-01 2022-03-14 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112022000758T5 true DE112022000758T5 (de) 2023-11-16

Family

ID=83458909

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022000758.3T Ceased DE112022000758T5 (de) 2021-04-01 2022-03-14 Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils

Country Status (5)

Country Link
US (1) US20240030178A1 (https=)
JP (1) JPWO2022209819A1 (https=)
CN (1) CN117157755A (https=)
DE (1) DE112022000758T5 (https=)
WO (1) WO2022209819A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018113359A (ja) 2017-01-12 2018-07-19 ローム株式会社 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175266A (ja) * 1991-12-20 1993-07-13 Mitsubishi Electric Corp 半導体装置
JP2001168261A (ja) * 1999-12-03 2001-06-22 Mitsui High Tec Inc 半導体装置
JP2001185671A (ja) * 1999-12-22 2001-07-06 Mitsubishi Electric Corp 半導体装置の製造方法及び該半導体装置の製造に用いられるリードフレームの製造方法
JP2001339029A (ja) * 2000-05-26 2001-12-07 Shinko Electric Ind Co Ltd 多層リードフレーム及びこれを用いた半導体装置
JP3470111B2 (ja) * 2001-06-28 2003-11-25 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP2005166943A (ja) * 2003-12-02 2005-06-23 Sony Corp リードフレーム、それを用いた半導体装置の製造におけるワイヤーボンディング方法及び樹脂封止型半導体装置
JP2005191240A (ja) * 2003-12-25 2005-07-14 Renesas Technology Corp 半導体装置及びその製造方法
JP2008130660A (ja) * 2006-11-17 2008-06-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US7838339B2 (en) * 2008-04-04 2010-11-23 Gem Services, Inc. Semiconductor device package having features formed by stamping

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018113359A (ja) 2017-01-12 2018-07-19 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2022209819A1 (ja) 2022-10-06
US20240030178A1 (en) 2024-01-25
JPWO2022209819A1 (https=) 2022-10-06
CN117157755A (zh) 2023-12-01

Similar Documents

Publication Publication Date Title
DE68926645T2 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE102008025705B4 (de) Leistungshalbleitervorrichtung
DE102005006333B4 (de) Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben
DE102014118836B4 (de) Halbleiter-packaging-anordnung und halbleiter-package
DE112021007737B4 (de) Halbleitermodul
DE102005034485B4 (de) Verbindungselement für ein Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterleistungsbauelements
DE112018002137B4 (de) Halbleiterbauteil
DE102009014582A1 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE102005049687B4 (de) Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad und Verfahren zur Herstellung
DE102013208818A1 (de) Zuverlässige Bereichsverbindungsstellen für Leistungshalbleiter
DE112006003036T5 (de) Halbleiterchipgehäuse mit einem Leitungsrahmen und einem Clip sowie Verfahren zur Herstellung
DE102010038933A1 (de) Halbleitervorrichtung mit Halbleiterchip und Metallplatte und Verfahren zu deren Fertigung
DE212021000239U1 (de) Halbleitermodul
DE212021000205U1 (de) Halbleiterbauteil
DE112019003664T5 (de) Halbleiterbauteil und verfahren zur herstellung eines halbleiterbauteils
DE212019000110U1 (de) Halbleiterbauteil
DE102006015447B4 (de) Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben
DE102020109703A1 (de) Halbleitergehäuse und verfahren zu seiner herstellung
DE102022110325A1 (de) Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung
DE112022005176T5 (de) Halbleiterbauteil
DE102015223300B4 (de) Halbleitervorrichtung
DE112022005438T5 (de) Halbleiterbauteil und Verfahren zur Herstellung des Halbleiterbauteils
DE112022000871T5 (de) Halbleiterbauelement
DE102021200017B4 (de) Halbleitermodul und verfahren zum herstellen eines halbleitermoduls
DE112021001570T5 (de) Halbleiterbauteil

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023490000

Ipc: H10W0072500000